Your basket is currently empty!
Category: Active electronic components
-
Impact of Green Mold Compounds on First- and Second-Level Interconnect
—
by
Geert Willems, Bart Vandevelde, imec
-
Green IC Packaging: A Threath to Electronics Reliability
—
by
Geert Willems, Steven Thijs, Bart Vandevelde, imec
-
IEEE Transactions Device and Materials reliability – September 2018: Methodology for Solder-Joint Lifetime Prediction of LED-Based PCB Assemblies
—
by
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, VOL. 18, NO. 3, SEPTEMBER 2018 – Bart Vandevelde et al.
-
EPTC 2011: Green Mould Compounds: Impact on Second Level Interconnect Reliability
—
by
EPTC Conference December 2011 – Bart Vandevelde et al.
-
ESTC 2012: Early Fatigue Failures in Copper Wire Bonds Inside Packages with low CTE Green Mold Compounds
—
by
ESTC Conference September 2012 – Bart Vandevelde and Geert Willems
-
IMAPS-EMPC 2013: Impact of Pad Finish on Mechanical Shock Resistance of Lead-Free Solder Joints Tested Under Shear and in Pull Mode
—
by
IMAPS EMPC Conference September 2013 – Bart Vandevelde et al.