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Category: Active electronic components
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Eurosime 2014: Hidden Head-In-Pillow Soldering Failures
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IEEE Eurosime Conference 2014 – Bart Vandevelde et al.
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Eurosime 2015: Impact of Solder-Joint Tilting on the Reliability of LED-based PCB Assemblies
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IEEE Eurosime Conference 2015 – Bart Vandevelde et al.
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ICEP 2016: How the Mold Compound Thermal Expansion Overrules the Solder Composition Choice in Board Level Reliability Performance
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Conference paper ICEP 2016 – Bart Vandevelde et al.
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Failure Mechanisms Turned into an Asset: New Ways of Embedding Key Security Elements in IC’s
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Thomas Kallstenius – imec
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Ultra-Thin Chip Packages (UTCP’s) for Embedding in Mainstream Flex Circuits
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Jan Vanfleteren – imec/UGent