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Category: Electronic Components
Impact of Green Mold Compounds on First- and Second-Level Interconnect
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Geert Willems, Bart Vandevelde, imec
Green IC Packaging: A Threath to Electronics Reliability
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Geert Willems, Steven Thijs, Bart Vandevelde, imec
IEEE Transactions Device and Materials reliability – September 2018: Methodology for Solder-Joint Lifetime Prediction of LED-Based PCB Assemblies
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IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, VOL. 18, NO. 3, SEPTEMBER 2018 – Bart Vandevelde et al.
EPTC 2011: Green Mould Compounds: Impact on Second Level Interconnect Reliability
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EPTC Conference December 2011 – Bart Vandevelde et al.
ESTC 2012: Early Fatigue Failures in Copper Wire Bonds Inside Packages with low CTE Green Mold Compounds
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ESTC Conference September 2012 – Bart Vandevelde and Geert Willems