Category: Electronic Components

ESA Workshop 2014: Reduced 2nd Level Solder Joint Life time of Low-CTE Mold Compound Packages

Nov 12, 2024

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by

Geert Willems
Material Identification in Electronics – Going Green CARE 2014

Oct 25, 2024

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by

Geert Willems
Reduced 2nd Level Solder Joint Life time of Low-CTE Mold Compound Packages

Oct 8, 2024

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by

Geert Willems

Bart Vandevelde
Impact of Green Mold Compounds on First- and Second-Level Interconnect

Oct 7, 2024

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by

Geert Willems

Geert Willems, Bart Vandevelde, imec
Green IC Packaging: A Threath to Electronics Reliability

Oct 7, 2024

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by

Geert Willems

Geert Willems, Steven Thijs, Bart Vandevelde, imec
Aanpak van betrouwbaarheid van microsystemen en innovatieve verpakkingen

Oct 4, 2024

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Geert Willems

Ingrid De Wolf, imec
Aanpak van betrouwbaarheid op IC niveau

Oct 4, 2024

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by

Geert Willems

Guido Groeseneken, imec
EDM Code Generator

Oct 4, 2024

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by

Geert Willems
IEEE Transactions Device and Materials reliability – September 2018: Methodology for Solder-Joint Lifetime Prediction of LED-Based PCB Assemblies

Sep 9, 2024

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by

Geert Willems

IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, VOL. 18, NO. 3, SEPTEMBER 2018 – Bart Vandevelde et al.
EPTC 2011: Green Mould Compounds: Impact on Second Level Interconnect Reliability

Sep 9, 2024

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by

Geert Willems

EPTC Conference December 2011 – Bart Vandevelde et al.