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Category: Electronic Components
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ESTC 2012: Early Fatigue Failures in Copper Wire Bonds Inside Packages with low CTE Green Mold Compounds
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ESTC Conference September 2012 – Bart Vandevelde and Geert Willems
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IMAPS-EMPC 2013: Impact of Pad Finish on Mechanical Shock Resistance of Lead-Free Solder Joints Tested Under Shear and in Pull Mode
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IMAPS EMPC Conference September 2013 – Bart Vandevelde et al.
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Eurosime 2014: Hidden Head-In-Pillow Soldering Failures
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IEEE Eurosime Conference 2014 – Bart Vandevelde et al.
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Eurosime 2015: Impact of Solder-Joint Tilting on the Reliability of LED-based PCB Assemblies
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IEEE Eurosime Conference 2015 – Bart Vandevelde et al.
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ICEP 2016: How the Mold Compound Thermal Expansion Overrules the Solder Composition Choice in Board Level Reliability Performance
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Conference paper ICEP 2016 – Bart Vandevelde et al.
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Failure Mechanisms Turned into an Asset: New Ways of Embedding Key Security Elements in IC’s
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Thomas Kallstenius – imec