Category: Failure mechanisms, Reliability & Maintenance

ESA Workshop 2014: Reduced 2nd Level Solder Joint Life time of Low-CTE Mold Compound Packages

Nov 12, 2024

—

by

Geert Willems
Reliability of Solder Joints for LED Applications

Nov 12, 2024

—

by

Geert Willems
New Product Introduction Methodology for Reliable Smart Products

Oct 9, 2024

—

by

Geert Willems

Geert Willems
State of the art on Prognostic Health Monitoring for Electronic Systems

Oct 8, 2024

—

by

Geert Willems

Bart Vandevelde, imec
Data-driven system health monitoring

Oct 8, 2024

—

by

Geert Willems

Elena Tsiporkova, Sirris
Physics-of-Failure Based Reliability Assessment of Electronics

Oct 8, 2024

—

by

Geert Willems

Geert Willems
Physics of Failure Based Quantification of Life Time for Electronics Board Assemblies

Oct 8, 2024

—

by

Geert Willems

Bart Vandevelde et al
Reduced 2nd Level Solder Joint Life time of Low-CTE Mold Compound Packages

Oct 8, 2024

—

by

Geert Willems

Bart Vandevelde
Impact of Green Mold Compounds on First- and Second-Level Interconnect

Oct 7, 2024

—

by

Geert Willems

Geert Willems, Bart Vandevelde, imec
Green IC Packaging: A Threath to Electronics Reliability

Oct 7, 2024

—

by

Geert Willems

Geert Willems, Steven Thijs, Bart Vandevelde, imec