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Category: Failure mechanisms
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IEEE Transactions Device and Materials reliability – September 2018: Methodology for Solder-Joint Lifetime Prediction of LED-Based PCB Assemblies
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IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, VOL. 18, NO. 3, SEPTEMBER 2018 – Bart Vandevelde et al.
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Global SMT & Packaging September 2010: Predicting Delamination in Lead-free Assembly
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Global SMT & Packaging september 2010 – Geert Willems and Piet Watte

