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Category: Materials
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Global SMT & Packaging September 2010: Predicting Delamination in Lead-free Assembly
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Global SMT & Packaging september 2010 – Geert Willems and Piet Watte
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EPTC 2011: Green Mould Compounds: Impact on Second Level Interconnect Reliability
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EPTC Conference December 2011 – Bart Vandevelde et al.
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Global SMT & Packaging April 2014: New Brittle Fracture Test Reveals Importance of Choosing the Right Board Finish
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Global SMT & Packaging April 2014 – Bart Vandevelde
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Going Green CARE Innovation 2014: Material Identification in Electronics
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Going Green CARE Innovation 2014 – Wesley Van Meensel et al.