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Category: PCB technology
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Best Paper APEX 2024 – A Parametric Approach to Quantifying the Environmental Impact of PCB Manufacturing
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APEX 2024 – Maarten Cauwe, Geert Willems and Eddy Geerinckx
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Global SMT & Packaging September 2010: Predicting Delamination in Lead-free Assembly
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Global SMT & Packaging september 2010 – Geert Willems and Piet Watte
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EMC Europe 2013: Modeling the Low- and High-Frequency Impedance of Thermal Reliefs
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EMC Europe September 2013 – Bart Boesman et al.
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IMAPS-EMPC 2013: Impact of Pad Finish on Mechanical Shock Resistance of Lead-Free Solder Joints Tested Under Shear and in Pull Mode
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IMAPS EMPC Conference September 2013 – Bart Vandevelde et al.
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Global SMT & Packaging April 2014: New Brittle Fracture Test Reveals Importance of Choosing the Right Board Finish
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Global SMT & Packaging April 2014 – Bart Vandevelde
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Going Green CARE Innovation 2014: Material Identification in Electronics
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Going Green CARE Innovation 2014 – Wesley Van Meensel et al.

