Category: Publications

ESA Workshop 2014: Reduced 2nd Level Solder Joint Life time of Low-CTE Mold Compound Packages

Nov 12, 2024

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Geert Willems
Material Identification in Electronics – Going Green CARE 2014

Oct 25, 2024

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Geert Willems
La directive RoHS

Oct 25, 2024

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Geert Willems
The RoHS Directive

Oct 25, 2024

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Geert Willems
De RoHS richtlijn

Oct 25, 2024

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Geert Willems
Best Paper APEX 2024 – A Parametric Approach to Quantifying the Environmental Impact of PCB Manufacturing

Sep 10, 2024

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Geert Willems

APEX 2024 – Maarten Cauwe, Geert Willems and Eddy Geerinckx
IEEE Transactions Device and Materials reliability – September 2018: Methodology for Solder-Joint Lifetime Prediction of LED-Based PCB Assemblies

Sep 9, 2024

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Geert Willems

IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, VOL. 18, NO. 3, SEPTEMBER 2018 – Bart Vandevelde et al.
Global SMT & Packaging September 2010: Predicting Delamination in Lead-free Assembly

Sep 9, 2024

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Geert Willems

Global SMT & Packaging september 2010 – Geert Willems and Piet Watte
EPTC 2011: Green Mould Compounds: Impact on Second Level Interconnect Reliability

Sep 9, 2024

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Geert Willems

EPTC Conference December 2011 – Bart Vandevelde et al.
ESTC 2012: Early Fatigue Failures in Copper Wire Bonds Inside Packages with low CTE Green Mold Compounds

Sep 9, 2024

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Geert Willems

ESTC Conference September 2012 – Bart Vandevelde and Geert Willems