Your cart is currently empty!
Category: Publications
EMC Europe 2013: Modeling the Low- and High-Frequency Impedance of Thermal Reliefs
—
by
EMC Europe September 2013 – Bart Boesman et al.
IMAPS-EMPC 2013: Impact of Pad Finish on Mechanical Shock Resistance of Lead-Free Solder Joints Tested Under Shear and in Pull Mode
—
by
IMAPS EMPC Conference September 2013 – Bart Vandevelde et al.
Global SMT & Packaging April 2014: New Brittle Fracture Test Reveals Importance of Choosing the Right Board Finish
—
by
Global SMT & Packaging April 2014 – Bart Vandevelde
Eurosime 2014: Hidden Head-In-Pillow Soldering Failures
—
by
IEEE Eurosime Conference 2014 – Bart Vandevelde et al.
Eurosime 2015: Impact of Solder-Joint Tilting on the Reliability of LED-based PCB Assemblies
—
by
IEEE Eurosime Conference 2015 – Bart Vandevelde et al.
cEDM: Center for Electronics Design & Manufacturing – SPM Magazine March 2016
—
by
SPM Magazine March 2016
Eurosime 2016: Four-point Bending Cycling as Alternative for Thermal Cycling Solder fatigue Testing
—
by
IEEE Eurosime Conference 2016 – Bart Vandevelde et al.
ICEP 2016: How the Mold Compound Thermal Expansion Overrules the Solder Composition Choice in Board Level Reliability Performance
—
by
Conference paper ICEP 2016 – Bart Vandevelde et al.