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Category: Simulation
Impact of Green Mold Compounds on First- and Second-Level Interconnect
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Geert Willems, Bart Vandevelde, imec
ESTC 2012: Early Fatigue Failures in Copper Wire Bonds Inside Packages with low CTE Green Mold Compounds
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ESTC Conference September 2012 – Bart Vandevelde and Geert Willems
EMC Europe 2013: Modeling the Low- and High-Frequency Impedance of Thermal Reliefs
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EMC Europe September 2013 – Bart Boesman et al.
Eurosime 2015: Impact of Solder-Joint Tilting on the Reliability of LED-based PCB Assemblies
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IEEE Eurosime Conference 2015 – Bart Vandevelde et al.
Eurosime 2016: Four-point Bending Cycling as Alternative for Thermal Cycling Solder fatigue Testing
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IEEE Eurosime Conference 2016 – Bart Vandevelde et al.
ICEP 2016: How the Mold Compound Thermal Expansion Overrules the Solder Composition Choice in Board Level Reliability Performance
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Conference paper ICEP 2016 – Bart Vandevelde et al.