Your basket is currently empty!
Category: Testing
-
IMAPS-EMPC 2013: Impact of Pad Finish on Mechanical Shock Resistance of Lead-Free Solder Joints Tested Under Shear and in Pull Mode
—
by
IMAPS EMPC Conference September 2013 – Bart Vandevelde et al.
-
Eurosime 2015: Impact of Solder-Joint Tilting on the Reliability of LED-based PCB Assemblies
—
by
IEEE Eurosime Conference 2015 – Bart Vandevelde et al.
-
Eurosime 2016: Four-point Bending Cycling as Alternative for Thermal Cycling Solder fatigue Testing
—
by
IEEE Eurosime Conference 2016 – Bart Vandevelde et al.