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Category: Thermal
High Performance Integrated Cooling of Electronics
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by
Frederik Rogiers – KULeuven-Department of Mechanical Engineering
Simulation and Characterisation of Cooling Performance of 3D Printed Heat Sinks
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by
Majid Nazemi – Materialise and Antonio Pappaterra – imec
Advanced 3D Printing Solutions for Advanced Processor Cooling: 3D Printing Technology
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by
Willem Verleysen – Materialise
HIPER: Introduction to Research Project on High Performance Vehicle Processors
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by
Bart Vandevelde – imec