BEGIN:VCALENDAR VERSION:2.0 PRODID:-//EDM Forum - ECPv6.15.12.2//NONSGML v1.0//EN CALSCALE:GREGORIAN METHOD:PUBLISH X-WR-CALNAME:EDM Forum X-ORIGINAL-URL:https://edmforum.eu X-WR-CALDESC:Events for EDM Forum REFRESH-INTERVAL;VALUE=DURATION:PT1H X-Robots-Tag:noindex X-PUBLISHED-TTL:PT1H BEGIN:VTIMEZONE TZID:Europe/Brussels BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20120325T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20121028T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20130331T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20131027T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20140330T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20141026T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20150329T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20151025T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20160327T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20161030T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20170326T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20171029T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20180325T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20181028T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20190331T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20191027T010000 END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20180621T103000 DTEND;TZID=Europe/Brussels:20180621T110000 DTSTAMP:20260727T075444 CREATED:20231212T224241Z LAST-MODIFIED:20240725T101208Z UID:1937-1529577000-1529578800@edmforum.eu SUMMARY:Webinar 2018-6-21: Mission Profiles of Electronics DESCRIPTION:Presented by: Tania Drissen – Sirris \n\n\n\nProduct reliability is gaining importance because of today’s increasing overall complexity of products. In a product’s design for reliability knowing the actual loads that will act on the product during its lifetime is key. The life cycle profile describes these different loads and their variation over time throughout the entire product life. This lifecycle profile guideline provides a step-by-step approach to identify all relevant life cycle phases\, situations and loads for a physical system. It aims to be a methodology for product designers who want to pursue a design for reliability approach for their current and future products. \n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n Mission Profiles of Electronic Products\n \n \n \n \n 1 file(s) 3.78 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Mission profiles of Electronic Products – video\n \n \n \n \n 1 file(s) 24.47 MB\n \n \n Login to download. URL:https://edmforum.eu/event/webinar-9mission-profiles/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20180301T000000 DTEND;TZID=Europe/Brussels:20180301T000000 DTSTAMP:20260727T075444 CREATED:20231212T224241Z LAST-MODIFIED:20240725T101124Z UID:1936-1519862400-1519862400@edmforum.eu SUMMARY:Webinar 2018-3-1: New Solder Joint Compositions: a Literature Review on Reliability DESCRIPTION:Presented by: Bart Vandevelde and Riet Labie – imec \n\n\n\nIn the first years after the introduction of the RoHS directive in 2006\, SnAgCu (SAC) with Ag percentage between 3 and 4.5% was the main solder composition used by the industry to replace SnPb solder. However\, in the recent years\, many new lead-free compositions were and are being introduced by the industry. This can be triggered by cost reasons (e.g. lower Ag content)\, a lower process temperature or to improve the reliability.In this webinar\, we will give an overview on the thermal cycling and mechanical shock reliability of these new compositions\, based on studies published in literature. \n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n New Solder Joint Compositions: a Literature Review on Reliability\n \n \n \n \n 1 file(s) 3.18 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n New Solder Joint Compositions: a Literature Review on Reliability – video\n \n \n \n \n 1 file(s) 15.44 MB\n \n \n Login to download. URL:https://edmforum.eu/event/webinar-8new-solder-joint-compositions/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20180111T000000 DTEND;TZID=Europe/Brussels:20180111T000000 DTSTAMP:20260727T075444 CREATED:20231212T224231Z LAST-MODIFIED:20240725T101047Z UID:1935-1515628800-1515628800@edmforum.eu SUMMARY:Webinar 2018-1-11: EMI Risk management DESCRIPTION:Davy Pissoort – KU Leuven \n\n\n\nEveryone has already been confronted with Electro-Magnetic Interference (EMI)\, ranging from an annoying buzz in a stereo when receiving a phone call to a computer crashing during a lightning storm. Frustrating\, but not life threatening. However\, two trends warrant appropriate concern: (i) high-tech electronics is being used more and more for safety-related functions\, (ii) electronic devices are increasingly vulnerable to EMI because of a lower intrinsic immunity and an increasingly severe electromagnetic environment. Combined expertise in Electro-Magnetic Compatibility (EMC) and Functional Safety (FS) will gain huge importance in many sectors like automotive\, robotics medical\, railways\, avionics\,… Unfortunately\, EMC and FS have evolved separately and share no concepts nor terminology.EMI Risk Management must go well beyond the current state-of-the-art in classical EMC engineering.This webinar will guide you on how you should deal with EMI risks in your functional safety process for your electronic products. \n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n EMI Risk Management\n \n \n \n \n 1 file(s) 2.27 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n EMI Risk Management – video\n \n \n \n \n 1 file(s) 37.25 MB\n \n \n Login to download. URL:https://edmforum.eu/event/webinar-7emi-risk-management/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20171108T110000 DTEND;TZID=Europe/Brussels:20171108T120000 DTSTAMP:20260727T075444 CREATED:20231212T224231Z LAST-MODIFIED:20240725T101014Z UID:1934-1510138800-1510142400@edmforum.eu SUMMARY:Webinar 2017-11-8: Plated Through Hole Via Failure DESCRIPTION:Presented by: Bart Vandevelde – imec \n\n\n\nIn cEDM’s ‘reliability FMEA’ tool\, we listed about 15 different failure mechanisms which over time can lead to electrical malfunctioning of the Printed Circuit Board (PCB) itself. One of the most dominant failures which are purely related to the PCB\, is fracturing of the copper plated through hole via’s. These are induced by the thermal expansion mismatch between the plated copper via and the surrounding epoxy/glass material. Due to this CTE mismatch\, the copper is stressed during solder reflow cycles and during operational temperature cycling. Both multiple solder reflows and numerous temperature cycles can lead to cracked via’s.In this webinar\, we will explain the basics of this PTH via failure mechanism\, what are the design and material parameters accelerating this failure and how the life time of your particular PCB with 100-1000 via’s can be calculated. This latter one is needed to finally guarantee that PTH via failures will not occur during the required life time of the PCB. \n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n Plated Through Hole Via Failures: Is This a Risk for My Design?\n \n \n \n \n 1 file(s) 2.40 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Plated Through Hole Via Failures: Is This a Risk for My Design? – video\n \n \n \n \n 1 file(s) 26.70 MB\n \n \n Download URL:https://edmforum.eu/event/webinar-6plated-through-hole-via-failure/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170907T100000 DTEND;TZID=Europe/Brussels:20170907T110000 DTSTAMP:20260727T075444 CREATED:20231212T224231Z LAST-MODIFIED:20240725T100941Z UID:1933-1504778400-1504782000@edmforum.eu SUMMARY:Webinar 2017-9-7: BOM-based Yield & Test Coverage Prediction of PBA DESCRIPTION:Presented by: Wesley Van Meensel – imec \n\n\n\nYour EMS supplier is delivering your requested Printed Board Assembly. But how certain are you about the quality of the PBA? What is the risk that your electronic module will not work after integrating it into your product or at the customer? What can we do during the design phase and how will testing help to reduce these risks?During this seminar we will give you a brief look on how you can quantify your quality or yield\, what the impact is of your production tests on that quality and how Pred-X can help you in improving your quality during the design stage.  \n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n BOM-based Yield and Test Coverage Prediction of PBAs\n \n \n \n \n 1 file(s) 1.46 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n BOM-based Yield and Test Coverage Prediction of PBAs – video\n \n \n \n \n 1 file(s) 20.04 MB\n \n \n Login to download. URL:https://edmforum.eu/event/webinar-5yield-test-coverage/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170601T100000 DTEND;TZID=Europe/Brussels:20170601T110000 DTSTAMP:20260727T075444 CREATED:20231212T224231Z LAST-MODIFIED:20240725T100859Z UID:1932-1496311200-1496314800@edmforum.eu SUMMARY:Webinar 2017-6-1: System engineering DESCRIPTION:Presented by: Tania Drissen- Sirris \n\n\n\nSystems engineering (SE) is a complete process with 24 sub-processes to turn an early stage business idea or need of a client into a working product or process that satisfies all expectations throughout its life cycle. In this approach mainly the “technical management” processes are well known and common practice (project planning\, risk management\, configuration management\, …). However\, some other\, often neglected aspects (thorough requirements definition\, verification\, information management\, …) are also indispensable to control budget\, timing and quality.This webinar outlines what systems engineering is and which specific aspects deserve attention.  \n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n Systems Engineering\n \n \n \n \n 1 file(s) 5.97 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Systems Engineering – video\n \n \n \n \n 1 file(s) 28.90 MB\n \n \n Login to download. URL:https://edmforum.eu/event/webinar-4system-engineering/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170406T100000 DTEND;TZID=Europe/Brussels:20170406T110000 DTSTAMP:20260727T075444 CREATED:20231212T224231Z LAST-MODIFIED:20240725T090724Z UID:1931-1491472800-1491476400@edmforum.eu SUMMARY:Webinar 2017-4-6: Virtual Testing of Thermal-Mechanical Reliability of Electronic Systems DESCRIPTION:Presented by: Bart Vandevelde – imec \n\n\n\nBefore electronic systems can be brought on the market\, they must fulfill qualification tests according to international standards and customer specified test programs. Thermal and mechanical environmental loadings are major causes for electronic system failures that also appear during these qualification testing. It is obvious that any failure after such a test is very expensive in terms of time and cost. Performing virtual testing in a simulation environment allows to find possible weak spots in the system already in early phase of the development when adaptations can be made easily. In this webinar\, we will show several examples how simulations are used to virtually test the electronic systems from the thermal and mechanical point of view. \n\n\n\n\n\n\n\n \n \n \n \n \n \n Virtual Testing of Thermal-Mechanical Reliability of Electronic Systems\n \n \n \n \n 1 file(s) 2.20 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Virtual Testing of Thermal-Mechanical Reliability of Electronic Systems – video\n \n \n \n \n 1 file(s) 37.00 MB\n \n \n Login to download. URL:https://edmforum.eu/event/webinar-3virtual-testing/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170202T100000 DTEND;TZID=Europe/Brussels:20170202T110000 DTSTAMP:20260727T075444 CREATED:20231212T224228Z LAST-MODIFIED:20240725T084040Z UID:1930-1486029600-1486033200@edmforum.eu SUMMARY:Webinar 2017-2-2: CE Marking DESCRIPTION:Presented by: Davy Pissoort – KU Leuven \n\n\n\nThe CE-mark (Conformité Européenne or European Conformity) is required for every electronic product that is put on the market within the European Economic Area. However\, a lot of questions and misunderstanding exist around what is exactly required and who should be involved with the CE-marking process. Within this seminar\, we will clarify the difference between directives and standards\, explain a typical conformity assessment procedure and describe the typical format of the final Declaration-of-Conformity. It will be stressed that the CE-marking on its own is not the evidence of compliance\, instead\, it is the Technical Documentation that gathers all arguments for claiming compliance. Advice will be given on how to identify the relevant directives and standards needed for this Technical Documentation. \n\n\n\n\n\n\n\n \n \n \n \n \n \n CE Marking of Electronic Products\n \n \n \n \n 1 file(s) 2.26 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n CE Marking of Electronic Products – video\n \n \n \n \n 1 file(s) 44.43 MB\n \n \n Login to download. URL:https://edmforum.eu/event/webinar-2ce-marking/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170112T100000 DTEND;TZID=Europe/Brussels:20170112T110000 DTSTAMP:20260727T075444 CREATED:20231212T224228Z LAST-MODIFIED:20240725T083947Z UID:1929-1484215200-1484218800@edmforum.eu SUMMARY:Webinar 2017-1-12: How FMEA Can Improve the Reliability of Your Product DESCRIPTION:Presented by: Riet Labie – imec \n\n\n\nAn FMEA (Failure Mode and Effect Analysis) procedure is a risk assessment method that helps to pinpoint critical design choices of your product. In this webinar we will explain how to apply this method to a PBA (Printed Board Assembly). A differentiation is made between failures at the level of the PCB\, component failures and failures at the interconnection level. A list of common failure mechanisms is documented in a database which serves as a guide through the risk assessment process. For each of the potential malfunctions\, the critical parameters that influence the occurrence of the failure are listed. By gaining a better understanding of the effect of these parameters\, the effect of certain design choices on the final product performance will become more clear. Some practical examples will be shown to improve your knowledge on the methodology as well as on some of the potentially occurring (and avoidable) errors. \n\n\n\n\n\n\n\n \n \n \n \n \n \n How FMEA Can Improve the Reliability of Your Product\n \n \n \n \n 1 file(s) 2.51 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n How FMEA Can Improve The Reliability of Your Product – video\n \n \n \n \n 1 file(s) 30.40 MB\n \n \n Login to download. URL:https://edmforum.eu/event/webinar-1fmea/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20130130T163000 DTEND;TZID=Europe/Brussels:20130130T173000 DTSTAMP:20260727T075444 CREATED:20231212T224143Z LAST-MODIFIED:20241007T142546Z UID:1891-1359563400-1359567000@edmforum.eu SUMMARY:iNEMI Webinar DESCRIPTION:imec\, a research institute based in Belgium (and an iNEMI member)\, is scheduling a special webinar for our membership to talk about reliability issues related to green mold compounds.New electronic materials are being introduced by component\, PCB manufacturers and assembly plants to cope with the IC-technology evolution\, environmental legislation (RoHS) and the “going green” trend. One of these trends has been the replacement of the mold compound of plastic packaged IC components by so-called “green mold compounds” (GMC) which are low-halogen\, typically highly silica filled and\, therefore\, have a low Coefficient of Thermal Expansion (CTE). The low CTE is the root cause of the second level solder joint risk. \n\n\n\n\n\nThe change-over has gradually taken place in the last five years and has reached a very high penetration level without being noticed by most component users. Although these new mold compounds have many environmental and technical benefits\, they also may endanger the reliability of electronics significantly. Product lifetime may be divided by a factor of four when GMC-based components are introduced. This webinar will explain the risks that GMC-based IC packages pose to electronics as well as the parameters of influence. \n\n\n\n\n\n \n \n \n \n \n \n Impact of Green Mold Compounds on First- and Second-Level Interconnect\n \n \n \n \n 1 file(s) 5 MB\n \n \n Login to download. URL:https://edmforum.eu/event/inemi-webinar/ CATEGORIES:Webinar END:VEVENT END:VCALENDAR