BEGIN:VCALENDAR VERSION:2.0 PRODID:-//EDM Forum - ECPv6.15.12.2//NONSGML v1.0//EN CALSCALE:GREGORIAN METHOD:PUBLISH X-WR-CALNAME:EDM Forum X-ORIGINAL-URL:https://edmforum.eu X-WR-CALDESC:Events for EDM Forum REFRESH-INTERVAL;VALUE=DURATION:PT1H X-Robots-Tag:noindex X-PUBLISHED-TTL:PT1H BEGIN:VTIMEZONE TZID:Europe/Brussels BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20110327T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20111030T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20120325T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20121028T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20130331T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20131027T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20140330T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20141026T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20150329T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20151025T010000 END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20141014T080000 DTEND;TZID=Europe/Brussels:20141015T170000 DTSTAMP:20260709T151726 CREATED:20241007T161118Z LAST-MODIFIED:20241007T161118Z UID:8630-1413273600-1413392400@edmforum.eu SUMMARY:IPC Europe High reliability Forum 2014 DESCRIPTION:From aerospace to automotive to telecommunications to medical devices\, reliability has never been more critical than in today’s high technology electronic products. Co-developed with technologists from top companies\, including Thales\, Continental Automotive\, EADS\, Robert Bosch\, Celestica and Zestron\, this two-day technical conference will bring together experts from industry and research institutions to explore critical reliability issues facing European electronics designers and manufacturers. \n\n\n\n\n\nThe High Reliability Forum opens with a choice of one half-day workshop (one focused on fundamentals\, the other offering advanced education) followed by paper presentations in four key areas:     – Electrochemical Migration     – Impact of High Temperatures on Design\, Process and Assembly     – Advanced PCB Materials and Technology     – Solder Joint Reliability \n\n\n\nLocation: Dusseldorf\, Germany. URL:https://edmforum.eu/event/ipc-europe-high-reliability-forum-2014/ CATEGORIES:Events with EDM contribution END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20141009T140000 DTEND;TZID=Europe/Brussels:20141009T190000 DTSTAMP:20260709T151726 CREATED:20231212T224038Z LAST-MODIFIED:20240726T074222Z UID:1846-1412863200-1412881200@edmforum.eu SUMMARY:EDM Event 2014: International Cooperation with the Center for Electronics Design & Manufacturing DESCRIPTION:Imec’s Center for Electronics Design & Manufacturing (cEDM) activities are aimed at supporting the industry in the development of cost effective quality electronics. cEDM cooperates internationally on research\, knowledge creation and sharing with organizations like iNEMI (the International Electronics Manufacturing Initiative – http://www.iNEMI.org)\, SPM (a Danish electronics’ industry association – http://uk.spm-erfa.dk) and others in\, e.g.\, the framework of international projects.This event gives you the opportunity to get to know cEDM’s international network that brings state-of-the-art knowledge to our electronics’ industry. \n\n\n\nThe yearly overview of cEDM activities will be presented by cEDM manager Geert Willems. \n\n\n\nGrace O’Malley\,Vice President of Operations for iNEMI\, will present a selection of iNEMI projects and the value proposition of iNEMI. \n\n\n\nSPM\, an association from Denmark and cEDM partner\, will present its activities with focus on electronics reliability. \n\n\n\nEnvironmental aspects have become of considerable importance. Ruud Balkenende from Philips Nat Lab in The Netherlands and project leader of the ENIAC project GreenElec will talk on Design-for-Recycling and bridging the Design-Recycling gap. \n\n\n\nAgenda \n\n\n\n14h00Welcome by Jo De Boeck\, CTO- imec14h10cEDM activity overviewGeert Willems – imec 14h40iNEMI activities – projects and iNEMI value propositionGrace O’Malley – iNEMI15h10SPM – Electronics design\, production and testing in Scandinavia: SPM activitiesHans Fhær Larsen – SPM15h35ENIAC GreenElec project on Electronics design and recyclingRuud Balkenende – Philips – Nat Lab16h00Q&A16h15Networking and visit to booths\n\n\n\n\n\n\n\n \n \n \n \n \n \n  cEDM Activity Overview: Improving the Reliability of Electronics\n \n \n \n \n 1 file(s) 3.30 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n iNEMI activities – Projects and iNEMI Value Proposition\n \n \n \n \n 1 file(s) 3.46 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n SPM – Electronics Design\, Production and Testing in Scandinavia: SPM Activities\n \n \n \n \n 1 file(s) 908.73 KB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n ENIAC GreenElec project on Electronics Design and Recycling\n \n \n \n \n 1 file(s) 2.35 MB\n \n \n Login to download. URL:https://edmforum.eu/event/cedm-event-3/ LOCATION:Imec Leuven\, Kapeldreef 75\, Leuven\, 3001\, Belgium CATEGORIES:EDM event END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20140625T160000 DTEND;TZID=Europe/Brussels:20140625T200000 DTSTAMP:20260709T151726 CREATED:20231212T224038Z LAST-MODIFIED:20241007T160009Z UID:1843-1403712000-1403726400@edmforum.eu SUMMARY:Geneess start evenement DESCRIPTION:In februari 2013 is DSP Valley (samen met partner imec) gestart met het project GEzonder door Nano-Elektronica En Slimme Specialisatie (GENEESS). Doel is om de inzet van nano-elektronica als sleuteltechnologie te stimuleren in Vlaanderen\, specifiek op het veelbelovende domein van de medische technologie. GENEESS will partijen uit de hele waardeketen bij elkaar brengen (van componentenbouwers tot zorgverstrekkers) om samen te bouwen aan gepersonaliseerde oplossingen voor diagnose en therapie. Focus ligt op de toestellen “dicht bij de patiënt” (draadloze monitoring devices\, slimme implantaten\, enz.).Het startevenement wil voor een zo ruim mogelijk publiek de activiteiten en eerste resultaten van het project voorstellen\, in de aanwezigheid van boeiende sprekers uit de bedrijfswereld\, onderzoekswereld en de overheid. Er zullen ook demonstraties zijn van producten en ontwikkelingen van bedrijven en onderzoeksinstellingen actief op het gebied van medische technologie.Het project GENEESS wordt gesteund door de Vlaamse Overheid (Agentschap Ondernemen\, Nieuw Industrieel Beleid). \n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n16h00 Welkom16h30 GENEESS-project: Gezonder door Nano-Elektronica en Slimme Specialisatie (Frederik Horemans\, projectcoördinator)16h50 Medec: anesthesie-apparaten designed & made in Belgium (Wim De Kimpe\, R&D Director)17h10 Medische technologie voor het screenen van gehoor en zicht bij baby’s (Dr. Erwin Van Kerschaver\, voormalig hoofdarts Kind&Gezin)17h30 AMACS: automatic monitoring of activities of daily living using contactless sensors (Prof. Bart Vanrumste\, Thomas More Kempen)17h30 AMACS Data collection process and full material declarations at Barco (to be confirmed)17h50 Afsluitende toespraak Vlaams Minister-President Kris Peeters18h00 drink & demo’s  URL:https://edmforum.eu/event/geneess-start-evenement/ LOCATION:Imec Leuven\, Kapeldreef 75\, Leuven\, 3001\, Belgium CATEGORIES:Partner Events END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20140612T090000 DTEND;TZID=Europe/Brussels:20140612T130000 DTSTAMP:20260709T151726 CREATED:20241007T154846Z LAST-MODIFIED:20241007T154942Z UID:8615-1402563600-1402578000@edmforum.eu SUMMARY:FMTC Workshop: Reliability Estimation of Physically inspired Models (Relimod) DESCRIPTION:Program \n\n\n\n\n\nPhysically inspired models are a useful means for designing better machines and vehicles. They allow for a faster control design and verification of the correct operation of the machine/vehicle through virtual tests. But how can we incorporate the different behavior of multiple machines of the same type in a single model? Or how can we rely on a model\, if we do not know to what extent its behavior deviates from reality? For example\, what guarantee do we have that a model-based control design will produce the expected performance on the actual machine? Or in an end-of-line test\, can we use a model to evaluate whether the observed machine behavior is within acceptable tolerances? So an understanding of the reliability of the model and its parameters is necessary.In the Relimod project\, an approach is developed and demonstrated that allows quantifying the reliability (uncertainty) of the output of physically inspired models and their parameters based on a certain set of experiments performed on a realization of the mechatronic system. \n\n\n\n\n\n13:00 Welcome & Introduction\, Wim Symens\, Technical director at FMTC13:10 A systematic integrated methodology to increase safety and reliability of mechatronic systems\, Bey-Temsamani Abdel\, Project manager at FMTC13:30 Invited speaker: Model-based functional safety concept for an EV (Electric Vehicle) use case\, Bert Dexters\, Account Manager at Flanders’ DRIVE14:00 Enhanced functional reliability prediction\, Kristof Boerjan\, Team leader at Televic Rail14:30 Coffee pause15:00 Invited speaker: Feedback on FIDES (reliability prediction) method application in French military programs\, Denis Tourtelier\, Expert on electronics reliability\, Attached to the French Ministry of Defense15:45 Accelerated life testing and reliability\, Vital Driesen\, Business development manager at Jabil Circuit Belgium16:15 Towards a model-based functional safety verification and validation\, Bjorn Aelvoet\, Project leader embedded systems and functional safety at Spicer off-highway product group16:45 Concluding session & Network drink  \n\n\n\nLocation: FMTC\, Celestijnenlaan 300\, 3001 Heverlee URL:https://edmforum.eu/event/fmtc-workshop-reliability-estimation-of-physically-inspired-models-relimod/ CATEGORIES:Partner Events END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20140407T000000 DTEND;TZID=Europe/Brussels:20140409T000000 DTSTAMP:20260709T151726 CREATED:20231212T223909Z LAST-MODIFIED:20241007T153400Z UID:1814-1396828800-1397001600@edmforum.eu SUMMARY:EuroSimE Training Course & Conference 2014 DESCRIPTION:Thermal\, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and MicrosystemsEuroSimE 2014 will be hosted in the beautiful city Ghent. The conference will address the results of both fundamental research and industrial applications for thermal\, mechanical and multiphysics simulation and experiments of micro/nano-electronics and microsystems. \n\n\n\n\n\nLocation: Mariott hotel\, Gent URL:https://edmforum.eu/event/eurosime-training-course-conference/ CATEGORIES:Partner Events END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20140520T000000 DTEND;TZID=Europe/Brussels:20140522T235959 DTSTAMP:20260709T151726 CREATED:20241008T140140Z LAST-MODIFIED:20241008T142155Z UID:8820-1400544000-1400803199@edmforum.eu SUMMARY:ESA: 5th Electronic Materials\, Processes and Packaging for Space workshops (EMPPS) DESCRIPTION:Presentation: Bart Vandevelde\, imec \n\n\n\n\n\n \n \n \n \n \n \n Reduced 2nd Level Solder Joint Life time of Low-CTE Mold Compound Packages\n \n \n \n \n 1 file(s) 1 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\nPublication \n\n\nSelect a package!\n\n\nLocation: ESA-ESTEC\, Nederland URL:https://edmforum.eu/event/5th-electronic-materials-processes-and-packaging-for-space-workshops-empps/ CATEGORIES:Events with EDM contribution END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20140514T130000 DTEND;TZID=Europe/Brussels:20140514T180000 DTSTAMP:20260709T151726 CREATED:20241007T154103Z LAST-MODIFIED:20241007T155107Z UID:8611-1400072400-1400090400@edmforum.eu SUMMARY:FMTC Workshop: Functional Safety Validation - Challenges and Innovative Solutions DESCRIPTION:Safety is of increasing importance in industrial environments. The international standard EN-IEC-61508 defines the requirements for the functional safety circuits and the procedure for performing a safety assessment. This procedure consists of 3 steps: hazard and risk analysis\, safety function definition and SIL (Safety Integrity Level) validation.In the validation process\, reliability quantification of parts used in safety instrumented systems is required.In the VAL4SIL project different techniques for reliability quantification have been investigated. Based on this investigation a systematic integrated process for quantifying system’s reliability and validating SIL for safety function is developed.Program \n\n\n\n\n\n13:00 Welcome & Introduction\, Wim Symens\, Technical director at FMTC13:10 A systematic integrated methodology to increase safety and reliability of mechatronic systems\, Bey-Temsamani Abdel\, Project manager at FMTC13:30 Invited speaker: Model-based functional safety concept for an EV (Electric Vehicle) use case\, Bert Dexters\, Account Manager at Flanders’ DRIVE14:00 Enhanced functional reliability prediction\, Kristof Boerjan\, Team leader at Televic Rail14:30 Coffee pause15:00 Invited speaker: Feedback on FIDES (reliability prediction) method application in French military programs\, Denis Tourtelier\, Expert on electronics reliability\, Attached to the French Ministry of Defense15:45 Accelerated life testing and reliability\, Vital Driesen\, Business development manager at Jabil Circuit Belgium16:15 Towards a model-based functional safety verification and validation\, Bjorn Aelvoet\, Project leader embedded systems and functional safety at Spicer off-highway product group16:45 Concluding session & Network drink  \n\n\n\nLocation: FMTC\, Celestijnenlaan 300\, 3001 Heverlee URL:https://edmforum.eu/event/fmtc-workshop-functional-safety-validation-challenges-and-innovative-solutions/ CATEGORIES:Partner Events END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20140509T140000 DTEND;TZID=Europe/Brussels:20140509T183000 DTSTAMP:20260709T151726 CREATED:20231212T224127Z LAST-MODIFIED:20240726T074147Z UID:1876-1399644000-1399660200@edmforum.eu SUMMARY:EDM Workshop 19: Design-for-Assembly & Design-for-Test: The EDM-D-004 & EDM-D-007 Guidelines Explained DESCRIPTION:Low cost\, high quality manufacturing demands a proper design. Placement of components need to be aligned with assembly process flow\, capability and equipment. This workshop presents the EDM-D-004: Design-for-Assembly guideline. The guideline provides general requirements and recommendations regarding Design-for-Assembly of printed boards. It treats automated board handling\, PBA type selection\, component placement\, compatibility with different assembly process steps and flow\, and more. \n\n\n\nOur guest Prodrive will explain how good design-assembly matching impacts cost\, quality and yield\, and leads to cost effective manufacturing solutions at our doorsteps. \n\n\n\nDue to the complexity of PBA and the reality of defect occurrence production test is crucial for high quality PBA delivery. The EDM-D-007: Quality and Test Coverage Quantification – Design-for-Test guideline provides the user with a methodology to quantify the quality of a PBA as well as a correct method to quantify the test coverage of production tests. These methodologies are implemented in our PBA simulation tool Pred-X. The use and capabilities of this tool will be presented. \n\n\n\nAgenda \n\n\n\n14h00Welcome14h10Design-for-Assembly: The EDM-D-004 GuidelineGeert Willems – imec 14h40Good design to assembly matching leads to cost effective solutionsJustin Harwig – Prodrive15h10Design-for-Test: The EDM-D-007 GuidelineBoris Leekens – imec15h40PBA simulation tool Pred-X: capabilities and useWesley Van Meensel – imec 16h00Q&A – Networking\n\n\n\n\n\n\n\n \n \n \n \n \n \n EDM Workshop 19 program\n \n \n \n \n 1 file(s) 266.38 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Intro EDM Workshop 19\n \n \n \n \n 1 file(s) 228.08 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n Design-for-Assembly: The EDM-D-004 Guideline\n \n \n \n \n 1 file(s) 2.91 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Good Design to Assembly Matching Leads to Cost Effective Solutions\n \n \n \n \n 1 file(s) 3.70 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Design-for-Test: The EDM-D-007 Guideline \n \n \n \n \n 1 file(s) 2.07 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n PBA Simulation Tool Pred-X: Capabilities and Use \n \n \n \n \n 1 file(s) 1.88 MB\n \n \n Login to download. URL:https://edmforum.eu/event/cedm-workshop-19/ LOCATION:Imec Leuven\, Kapeldreef 75\, Leuven\, 3001\, Belgium CATEGORIES:Workshop END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20140425T130000 DTEND;TZID=Europe/Brussels:20140425T170000 DTSTAMP:20260709T151726 CREATED:20231212T223741Z LAST-MODIFIED:20240726T110714Z UID:1807-1398430800-1398445200@edmforum.eu SUMMARY:PBA technologie sessie en bedrijfsbezoek DESCRIPTION: URL:https://edmforum.eu/event/pba-technologie-sessie-bedrijfsbezoek/ LOCATION:Connect Group Poperinge\, Frankrijklaan 22\, Poperinge\, 8970\, Belgium CATEGORIES:Technology seminar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20140321T130000 DTEND;TZID=Europe/Brussels:20140321T170000 DTSTAMP:20260709T151726 CREATED:20240726T111116Z LAST-MODIFIED:20240726T111140Z UID:5844-1395406800-1395421200@edmforum.eu SUMMARY:PCB technologie introductie en bedrijfsbezoek DESCRIPTION: URL:https://edmforum.eu/event/pcb-technologie-introductie-en-bedrijfsbezoek-2/ LOCATION:ACB\, Vosmeer 3\, Dendermonde\, +3252202030\, 9200\, Belgium CATEGORIES:Technology seminar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20140314T140000 DTEND;TZID=Europe/Brussels:20140314T170000 DTSTAMP:20260709T151726 CREATED:20231212T224244Z LAST-MODIFIED:20240726T074125Z UID:1943-1394805600-1394816400@edmforum.eu SUMMARY:EDM Workshop 18: Quality and Reliability Impact of Electronic Component Selection: the EDM-D-002 Guideline Explained DESCRIPTION:The selection of components that make up the Bill-of-Material\, especially the package type selection\, determines the manufacturability and the reliability of the Printed Board Assembly. \n\n\n\nThis workshop presents the EDM-D-002: Electronic Component Specification guideline. It addresses the specification of assembly aspects of components like Moisture and Process Sensitivity levels\, solder process compatibility and quality (yield) as well as reliability aspects. \n\n\n\nOur host ON Semiconductor will present the electronic component requirements set by the automotive industry and potential assembly and reliability risks. \n\n\n\nThe assessment of package and interconnection failures using physico-chemical analysis and thermo-mechanical simulation will be discussed by cEDM based on practical cases. \n\n\n\nAgenda \n\n\n\n14h00Welcome14h10Manufacturability and reliability impact of package selection: The EDM-D-002 GuidelineGeert Willems – imec 14h40Component package selection in automotive electronicsDaniel Vanderstraeten – ON Semiconductor15h10Package and interconnection failure assessmentBart Vandevelde – imec15h45Q&A – Networking\n\n\n\n\n\n\n\n \n \n \n \n \n \n EDM Workshop 18 program\n \n \n \n \n 1 file(s) 252.62 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Intro EDM Workshop 18\n \n \n \n \n 1 file(s) 244.65 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n Manufacturability and Reliability Impact of Package Selection: The EDM-D-002 Guideline\n \n \n \n \n 1 file(s) 4.18 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Component Package Selection in Automotive Electronics\n \n \n \n \n 1 file(s) 2.21 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Package and Interconnection Failure Assessment\n \n \n \n \n 1 file(s) 12.74 MB\n \n \n Login to download. URL:https://edmforum.eu/event/cedm-workshop-18/ LOCATION:ON Semiconductor Belgium\, Westerring 15\, Oudenaarde\, 9700\, Belgium CATEGORIES:Workshop END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20140313T000000 DTEND;TZID=Europe/Brussels:20140314T235959 DTSTAMP:20260709T151726 CREATED:20241008T131430Z LAST-MODIFIED:20241008T133214Z UID:8806-1394668800-1394841599@edmforum.eu SUMMARY:Nieuw Industrieel Ondernemen Happening DESCRIPTION:Op 13 & 14 maart 2014 vond de Nieuw Industrieel Ondernemen Happening plaats\, de apotheose na een campagne op Kanaal Z en de regionale zenders. Met een job- en stagebeurs in samenwerking met VDAB\, kende de eerste dag een groot succes met een talrijke aanwezigheid van bedrijven en jobzoekenden.Véronique Goossens modereerde enkele panelgesprekken. Bieke Illeghems was de host van deze twee dagen.Talrijke prominente sprekers passeerden de revue. In diverse workshops konden geïnteresseerden luisteren naar initiatieven in het kader van Nieuw Industrieel Ondernemen. De Fabriek van de Toekomst was een hot item en met enkele showcases zoals 3D printing was er voor elk wat wils.Bron: Agentschap Ondernemen – Jaarverslag 2014 \n\n\n\nPresentatie: Geert Willems\, imec \n\n\n\n\n\n \n \n \n \n \n \n Kritieke Metalen in Elektronica\n \n \n \n \n 1 file(s) 759 KB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Circulaire Economie interview\n \n \n \n \n 1 file(s) 16 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\nLocatie: Waagnatie\, Antwerpen URL:https://edmforum.eu/event/nieuw-industrieel-ondernemen-happening/ CATEGORIES:Events with EDM contribution END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20131108T130000 DTEND;TZID=Europe/Brussels:20131108T170000 DTSTAMP:20260709T151726 CREATED:20231212T223741Z LAST-MODIFIED:20240726T092812Z UID:1808-1383915600-1383930000@edmforum.eu SUMMARY:PBA technologie sessie en bedrijfsbezoek DESCRIPTION: URL:https://edmforum.eu/event/pba-technologie-sessie-bedrijfsbezoek-2/ LOCATION:Connect Group Poperinge\, Frankrijklaan 22\, Poperinge\, 8970\, Belgium CATEGORIES:Technology seminar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20131018T130000 DTEND;TZID=Europe/Brussels:20131018T170000 DTSTAMP:20260709T151726 CREATED:20231212T223638Z LAST-MODIFIED:20240726T105457Z UID:1789-1382101200-1382115600@edmforum.eu SUMMARY:PCB technologie introductie en bedrijfsbezoek DESCRIPTION: URL:https://edmforum.eu/event/pcb-tecnology-session/ LOCATION:ACB\, Vosmeer 3\, Dendermonde\, +3252202030\, 9200\, Belgium CATEGORIES:Technology seminar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20131004T140000 DTEND;TZID=Europe/Brussels:20131004T193000 DTSTAMP:20260709T151726 CREATED:20231212T224029Z LAST-MODIFIED:20240726T074100Z UID:1841-1380895200-1380915000@edmforum.eu SUMMARY:EDM Event 2013: The Business Impact of Center of Electronics Design & Manufacturing DESCRIPTION:Imec’s Center of Electronics Design & Manufacturing activities are aimed at supporting the industry in the development of cost effective quality electronics. When improved\, multidisciplinary insight in the physical realisation of electronics throughout the electronic supply chain is brought to the operational departments and factory floor by means of guidelines\, tools\, consultancy and training this has a significant positive effect on the business results. This event will give you an understanding of how and to what extent cEDM’s expertise may help your company.An overview of cEDM activities will be presented. A view on what some of our cEDM partners have done with cEDM know-how and how they have thrived the last five years will be given.Lena Eeckhout\, Manager PCB Layout Services of Barco\, will present Barco’s newly\, worldwide deployed PCB/PBA New Product Introduction process. This NPI business process was developed and deployed in collaboration with imec’scEDM and integrates several of cEDM’s innovations (PCB specification\, PCB failure calculation\, PBA passport\, Design-to-supplier matching\, etc).Eric Roskin now at Pepric has been working with cEDM for many years in the field of PCB/PBA design and manufacturing. He will share with you his cEDM collaboration experience as an industrialisation engineer. \n\n\n\nAgenda \n\n\n\n14h00Welcome14h10imecservicesSteve Beckers – imec14h25cEDMactivities from a business perspectiveGeert Willems – imec15h00Barco’s PCB/PBA New Product Introduction methodologyLena Eeckhout – Barco15h30Working with cEDM in industrialisationEric Roskin – Pepric16h00Q&A16h15Networking and visit to the booths:cEDM\, Sirris\, NEVAT EMS\, KHBO\, imomec\, Centexbel\, ED&A\, H&W\, PsiControl\, Eurocircuits\, Electronic Apparatus\, Page\, Taipro Engineering\, imec\, imecservices\n\n\n\n\n\n\n\n \n \n \n \n \n \n EDM Event 2013 program\n \n \n \n \n 1 file(s) 324.39 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n imecservices\n \n \n \n \n 1 file(s) 212.48 KB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n cEDM Activities from a Business Perspective\n \n \n \n \n 1 file(s) 3.52 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Barco’s PCB/PBA New Product Introduction Methodology\n \n \n \n \n 1 file(s) 2.15 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Working with cEDM in Industrialization\n \n \n \n \n 1 file(s) 1.05 MB\n \n \n Login to download. URL:https://edmforum.eu/event/cedm-event-2/ LOCATION:Imec Leuven\, Kapeldreef 75\, Leuven\, 3001\, Belgium CATEGORIES:EDM event END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20130618T130000 DTEND;TZID=Europe/Brussels:20130618T170000 DTSTAMP:20260709T151726 CREATED:20231212T224215Z LAST-MODIFIED:20241007T145807Z UID:1916-1371560400-1371574800@edmforum.eu SUMMARY:EMC@Flanders seminar: From nano (IC) to mega (installations) DESCRIPTION:In order to avoid extra delays and costs\, EMC issues have to be searched for\, investigated and solved at every stage of the design process and at every level (ICs\, PCBs\, modules\, systems\,…). Moreover\, legal EMC requirements are becoming more stringent as they will not only ask to show compliance at the moment of placing on the market\, but also to give evidence that EMC will be maintained during the whole lifetime of the product.Within the KU Leuven\, a long history exists on identifying\, studying and solving EMC issues at every moment in the design cycle and at every level from IC to system. In this seminar we want to introduce you “EMC@Flanders”\, a partnership of ESAT-MICAS\, ESAT-TELEMIC\, Labo DE NAYER and ReMI-FMEC\, all members of the KU Leuven with complementary expertise related to EMC. URL:https://edmforum.eu/event/training-kuleuven/ LOCATION:KHBO\, Zeedijk 101\, Oostende\, 8400 CATEGORIES:Partner Events END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20130607T140000 DTEND;TZID=Europe/Brussels:20130607T143000 DTSTAMP:20260709T151726 CREATED:20231212T224244Z LAST-MODIFIED:20240726T074032Z UID:1945-1370613600-1370615400@edmforum.eu SUMMARY:EDM Workshop 17: E-Waste recycling optimization and Design-for-Recycling: ENIAC project GreenElec DESCRIPTION:Recycling treats complex waste streams containing precious and other metals and materials. A smelter can recover some 20 precious and other non-ferrous metals from shredded end-of-life electronics. \n\n\n\nElectronic waste and especially electronic parts however have low recycling yields. Electronics pose a recycling challenge both from the point of purity (contaminants) as well as volume. The EU funded ENIAC project GreenElec aims at fundamentally improving the recycling situation by performing research into the basic elements that determine recycling efficiency. \n\n\n\nThis workshop will introduce the GreenElec project and give a glimpse of the possibilities to identify andquantify material content and improve the recycling process of electronics by Design-for-Recycling and selective disassembly based on optical recognition or product data made available end-of-life. \n\n\n\nAgenda \n\n\n\n14h00Welcome14h10 The GreenElec ProjectRuud Balkenende – Philips Research14h40Identification of materials in PBA’s & Design for RecyclingWesley van Meensel – imec15h00Recycling of e-wasteJoost Duflou – CIB University KU Leuven15h20Break15h40 Improvement of RecyclabilityJoost Duflou – CIB University KU Leuven16h00Environmental Data Collection: the Barco case studyJimmy Dirickx – Barco16h20Q&A – Networking\n\n\n\n\n\n\n\n \n \n \n \n \n \n EDM Workshop 17 program\n \n \n \n \n 1 file(s) 245.61 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Intro EDM Workshop 17\n \n \n \n \n 1 file(s) 470.28 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n The GreenElec Project\n \n \n \n \n 1 file(s) 1.45 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Identification of Materials in PBA’s & Design for Recycling \n \n \n \n \n 1 file(s) 846.95 KB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Recycling of e-waste \n \n \n \n \n 1 file(s) 2.42 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Improvement of Recyclability\n \n \n \n \n 1 file(s) 1.32 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Environmental Data Collection: the Barco Case Study\n \n \n \n \n 1 file(s) 771.70 KB\n \n \n Login to download. URL:https://edmforum.eu/event/cedm-workshop-17/ LOCATION:Philips High Tech Campus\, High Tech Campus HTC34\, Eindhoven\, 5656 AE\, Netherlands CATEGORIES:Workshop END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20130528T000000 DTEND;TZID=Europe/Brussels:20130528T235959 DTSTAMP:20260709T151726 CREATED:20231212T224316Z LAST-MODIFIED:20241007T152913Z UID:1972-1369699200-1369785599@edmforum.eu SUMMARY:Electronics & Automation 2013 DESCRIPTION:Electronics & Automation – De elektronicabeurs van de Benelux \n\n\n\nDe beurs vindt plaats van dinsdag 28 tot en met donderdag 30 mei 2013 in Jaarbeurs Utrecht. De exposanten op deze beurs geven diverse demonstraties en seminars binnen de vakkennis van industriële elektronica. \n\n\n\nHet conferentieprogramma bestaat uit 6 seminars. \n\n\n\nSeminarie: Design-for-Excellence \n\n\n\n\n\nEDM bijdrage \n\n\n\n\n\n \n \n \n \n \n \n Kwaliteit Kwantificatie en Kwaliteitverhoging door Test\n \n \n \n \n 1 file(s) 1 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\nBij het begrip kwaliteit vormt iedereen zich een eigen idee over de betekenis. Dit is erg subjectief waardoor kwaliteit een belangrijk maar weinig tastbaar begrip is. In een wereld die voor elke euro een harde realiteit vereist maakt een vage slogan “betere kwaliteit” daarom weinig indruk. Dit wordt anders wanneer we kwaliteit in harde cijfers gaan vatten. De presentatie legt uit hoe dit kan voor elektronica. Door ook het effect van test in objectieve cijfers uit te drukken transformeert test van een “overhead” kost tot een waarde creërende activiteit waarvoor de klant bereid is te betalen.  \n\n\n\nLocatie: Jaarbeurs Utrecht\, Jaarbeursplein\, 3521 AL utrecht URL:https://edmforum.eu/event/ea-beurs-2013/ CATEGORIES:Events with EDM contribution END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20130503T140000 DTEND;TZID=Europe/Brussels:20130503T170000 DTSTAMP:20260709T151726 CREATED:20231212T224300Z LAST-MODIFIED:20241007T115951Z UID:1957-1367589600-1367600400@edmforum.eu SUMMARY:Sirris Workshop: Voorkomen van faling door vibraties DESCRIPTION:In de eerste plaats richt Prosperita zich op OEM-ontwikkelaars van eigen elektronische producten\, OEM-productontwikkelaars die elektronische modules in hun producten integreren en niet-elektronica-OEM’s uit diverse sectoren (automotive\, machinebouw\, …) die elektronica in hun producten willen integreren. \n\n\n\n\n\nBedrijven in de toeleversector maken de ruimere doelgroep uit\, waaronder original design manufacturers (ODM) die onderaannemer zijn voor productontwerp en productie\, PCB/PBA ontwerphuizen die onderaannemers zijn van ontwerp\, electronic manufacturing services (EMS) die aanbieder zijn van assemblage- en industrialisatiediensten en de toeleveranciers aan de elektronische ontwikkeling en productie: componenten\, PCB’s\, materialen en productiemachines. \n\n\n\nWaarom faalt een elektronische installatie en hoe is dit te vermijden? Op dergelijke vragen en uitdagingen stoten fabrikanten van producten die elektronische componenten op de markt brengen regelmatig. Binnen het VIS-traject Prosperita helpen Sirris\, imec en KHBO-FMEC bedrijven het falen van elektronische systemen voorkomen en kosten besparen. Deze workshop focust op het voorkomen van falen door vibraties. \n\n\n\nNog tot eind 2014 loopt het VIS-traject Prosperita (PRoductverbetering dankzij Ontwerp- en SPecificatieregels voor Elektronica Realisatie en InTegrAtie) dat Sirris samen met imec en KHBO heeft opgestart. Doel van het project zijn betere elektronische producten fabriceren dankzij aangepast ontwerp en dit tegen een lagere kost. Het VIS-traject beoogt de uitwerking en verspreiding van een generieke handleiding voor PBA (Printed Board Assembly) Design-for-Manufacturing en PBA-integratie. Het initiatief wil de industrie ondersteunen bij de specificatie\, ontwikkeling en fabricage van hoogwaardige\, betrouwbare en kosteffectieve elektronische modules door kenniscreatie en -verspreiding\, het gebruik van wetenschappelijk onderbouwde methodologieën en samenwerking doorheen de elektronische toeleveringsketen. \n\n\n\nPBA-handleiding\n\n\n\nMet de handleiding ‘Printed Board Assembly (PBA) realisatie en integratie’\, ondersteund met rekentools\, en collectief en individueel advies\, worden een aantal nieuwe fysieke modellen ontwikkeld. Tijdens het ontwerp worden reducties beoogd op het vlak van productkost\, time-to-market\, prototypekost en falingskost. De praktijkgerichte PBA-handleiding\, die ter beschikking wordt gesteld aan de ruime doelgroep en geïmplementeerd bij de specifieke doelgroep\, zal wetenschappelijk onderbouwd zijn en praktijk getoetst door vertegenwoordigers van alle schakels van de toeleveringsketen. \n\n\n\nDeze workshop staat in het teken van de integratiehandleiding EDM-I-001 (=EDM-D-012) gericht op het voorkomen van faling door trillingen en resonanties. \n\n\n\n\n\n \n \n \n \n \n \n EDM-D-012 Mechanical Integration – V1.1 (2019)\n \n \n \n \n 1 file(s) 2 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n14:00 Onthaal & Koffie14:15 Introductie VIS-Prosperita (imec)14:45 Vibration Guidelines (Sirris)15:15 Vibration Tool (Sirris)15:45 Validation Tests (KHBO)16:00 Closure and discussion16:30 Networking drink17:00 Einde \n\n\n\nLocatie: Sirris\, Technologiepark 935\, Zwijnaarde  URL:https://edmforum.eu/event/sirris-workshop-2/ CATEGORIES:Events with EDM contribution,Partner Events END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20130419T130000 DTEND;TZID=Europe/Brussels:20130419T170000 DTSTAMP:20260709T151726 CREATED:20240726T110616Z LAST-MODIFIED:20240726T110839Z UID:5842-1366376400-1366390800@edmforum.eu SUMMARY:PBA technologie introductie en bedrijfsbezoek DESCRIPTION: URL:https://edmforum.eu/event/pba-technologie-introductie-en-bedrijfsbezoek/ LOCATION:Connect Group Poperinge\, Frankrijklaan 22\, Poperinge\, 8970\, Belgium CATEGORIES:Technology seminar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20130322T140000 DTEND;TZID=Europe/Brussels:20130322T180000 DTSTAMP:20260709T151726 CREATED:20231212T224127Z LAST-MODIFIED:20240726T074008Z UID:1875-1363960800-1363975200@edmforum.eu SUMMARY:EDM Workshop 16: PBA Assembly Material Specification - The Guideline Explained DESCRIPTION:Electronics assembly materials like soldering fluxes\, solder pastes\, adhesives and coatings have a major impact on the final product quality and reliability. Improper selection and/or application may lead to severe surface insulation (SIR) failures and corrosion. Despite these risks assembly materials are rarely specified beyond “no-clean”\, leaving the selection entirely to the production unit. Very often\, however\, the production unit is not fully knowledgeable about the working conditions and reliability requirements of the end product. A situation that may and has led to major product failures.cEDM has developed the PBA Assembly Material Specification guideline EDM-D-003 to support design departments and production units in selecting manufacturing friendly materials that will result in reliable products.In this workshop the technology\, application and reliability risks of soldering materials\, conductive adhesives and underfill will be presented. The content and use of the new guideline will be explained illustrated with the PBA failures it will prevent and how this is achieved. \n\n\n\nAgenda \n\n\n\n14h00Welcome14h15Soldering Materials: Technology\, Applications and Reliability aspectsRalph Lauwaert – Interflux15h00Conductive Adhesives and Underfill: Technology and ApplicationsCindy Doumen – Henkel Electronic Materials15h30Break16h00Assembly material related failures and EDM-D-003 GuidelineGeert Willems – imec16h45Q&A – Networking\n\n\n\n\n\n\n\n \n \n \n \n \n \n EDM Workshop 16 program\n \n \n \n \n 1 file(s) 314.04 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Intro EDM Workshop 16\n \n \n \n \n 1 file(s) 600.82 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n Soldering Materials: Technology\, Applications and Reliability Aspects\n \n \n \n \n 1 file(s) 1.75 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Conductive Adhesives and Underfill: Technology and Applications\n \n \n \n \n 1 file(s) 1.04 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Assembly Material Related Failures and EDM-D-003 Guideline \n \n \n \n \n 1 file(s) 1.86 MB\n \n \n Login to download. URL:https://edmforum.eu/event/cedm-workshop-16/ LOCATION:Imec Leuven\, Kapeldreef 75\, Leuven\, 3001\, Belgium CATEGORIES:Workshop END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20130315T130000 DTEND;TZID=Europe/Brussels:20130315T170000 DTSTAMP:20260709T151726 CREATED:20231212T223639Z LAST-MODIFIED:20240726T110038Z UID:1792-1363352400-1363366800@edmforum.eu SUMMARY:PCB technologie introductie en bedrijfsbezoek DESCRIPTION: URL:https://edmforum.eu/event/pcb-technology-seminar/ LOCATION:ACB\, Vosmeer 3\, Dendermonde\, +3252202030\, 9200\, Belgium CATEGORIES:Technology seminar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20130130T163000 DTEND;TZID=Europe/Brussels:20130130T173000 DTSTAMP:20260709T151726 CREATED:20231212T224143Z LAST-MODIFIED:20241007T142546Z UID:1891-1359563400-1359567000@edmforum.eu SUMMARY:iNEMI Webinar DESCRIPTION:imec\, a research institute based in Belgium (and an iNEMI member)\, is scheduling a special webinar for our membership to talk about reliability issues related to green mold compounds.New electronic materials are being introduced by component\, PCB manufacturers and assembly plants to cope with the IC-technology evolution\, environmental legislation (RoHS) and the “going green” trend. One of these trends has been the replacement of the mold compound of plastic packaged IC components by so-called “green mold compounds” (GMC) which are low-halogen\, typically highly silica filled and\, therefore\, have a low Coefficient of Thermal Expansion (CTE). The low CTE is the root cause of the second level solder joint risk. \n\n\n\n\n\nThe change-over has gradually taken place in the last five years and has reached a very high penetration level without being noticed by most component users. Although these new mold compounds have many environmental and technical benefits\, they also may endanger the reliability of electronics significantly. Product lifetime may be divided by a factor of four when GMC-based components are introduced. This webinar will explain the risks that GMC-based IC packages pose to electronics as well as the parameters of influence. \n\n\n\n\n\n \n \n \n \n \n \n Impact of Green Mold Compounds on First- and Second-Level Interconnect\n \n \n \n \n 1 file(s) 5 MB\n \n \n Login to download. URL:https://edmforum.eu/event/inemi-webinar/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20130111T000000 DTEND;TZID=Europe/Brussels:20130111T235959 DTSTAMP:20260709T151726 CREATED:20241007T144303Z LAST-MODIFIED:20241007T145134Z UID:8597-1357862400-1357948799@edmforum.eu SUMMARY:H&W Design - Meeting Point 2013 DESCRIPTION:Quantification of PBA Quality\, Test Coverage and Zero Hour Defect Rate\n \n \n \n \n 1 file(s) 2 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\nLocatie: H&W Design\, Tilburg\, Nederland URL:https://edmforum.eu/event/hw-design-meeting-point-2013/ CATEGORIES:Events with EDM contribution,Partner Events END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20121128T093000 DTEND;TZID=Europe/Brussels:20121128T193000 DTSTAMP:20260709T151726 CREATED:20231212T224012Z LAST-MODIFIED:20241007T115011Z UID:1837-1354095000-1354131000@edmforum.eu SUMMARY:Cohesi: Sensors of the Future DESCRIPTION:There is a trend towards smart electronic systems that interact with their surroundings. Sensors form the cornerstone of these systems\, enabling them to see\, feel or smell what is going on. A lot of technology breakthroughs are realized in this field. With this event we offer you the opportunity to discover the latest evolutions and meet sensor experts from leading universities\, knowledge centers and companies. Moreover\, during the breaks\, you will be able to witness real-life demos of state-of-the-art sensor technology. We are convinced that this event will trigger new ideas to revolutionize your products or processes. Let us innovate together!Programma URL:https://edmforum.eu/event/cohesi-sensors-of-the-future/ LOCATION:Imec Leuven\, Kapeldreef 75\, Leuven\, 3001\, Belgium CATEGORIES:Partner Events END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20121123T140000 DTEND;TZID=Europe/Brussels:20121123T180000 DTSTAMP:20260709T151726 CREATED:20231212T223725Z LAST-MODIFIED:20240726T073932Z UID:1802-1353679200-1353693600@edmforum.eu SUMMARY:EDM Workshop 15: PCB Build-Up and Density Classification DESCRIPTION:The DfM guideline on PCB build-up and density classification\, what’s in it for you?What choices to make for the PCB build-up? Will your design require six or eight layers\, or even more…? Is it OK to use microVIA’s in your design? When using a small pitch BGA\, will you use minimum track width and spacing all over the board? How to work with density classes and basis on which to make a selection? How does all this impact DfM quality and PCB cost?During the workshop\, you will get an introduction to the guideline. Next\, with the aid of a case\, examples will be given relating to the choices involved in the PCB build-up.Barco will present the implementation of a tool to handle the density classes. A comparison between different build-up options versus density classes will conclude the session. \n\n\n\nAgenda \n\n\n\n14h00Welcome14h10EDM-D-005: PCB Build-Up and Density ClassificationGeert Willems – imec14h40Selecting a PCB build-up and density classification for your design: a BGA caseAlain Carton – imec15h10Break15h40Build-up options versus density classes: How to choose the right PCB TechnologyHans Werner – H&W Design16h00Implementation of the PBA Passport Tool to handle the density classes Lena Eeckhout- Barco16h20Q&A – Networking\n\n\n\n\n\n\n\n \n \n \n \n \n \n EDM Workshop 15 program\n \n \n \n \n 1 file(s) 215.44 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Intro EDM Workshop 15\n \n \n \n \n 1 file(s) 319.35 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n\n\nFor members only \n\n\nSelect a package!\n\n\n\n\n \n \n \n \n \n \n Selecting a PCB Build-Up and Density Classification for Your Design: a BGA Case\n \n \n \n \n 1 file(s) 1.17 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Build-Up Options Versus Density Classes: How to Choose the Right PCB Technology\n \n \n \n \n 1 file(s) 217.13 KB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Implementation of the PBA Passport Tool to Handle the Density Classes \n \n \n \n \n 1 file(s) 502.02 KB\n \n \n Login to download. URL:https://edmforum.eu/event/cedm-workshop-15/ LOCATION:Barco Kuurne\, Noordlaan 5\, Kuurne\, 8520\, Belgium CATEGORIES:Workshop END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20121019T130000 DTEND;TZID=Europe/Brussels:20121019T170000 DTSTAMP:20260709T151726 CREATED:20231212T224215Z LAST-MODIFIED:20240726T100049Z UID:1919-1350651600-1350666000@edmforum.eu SUMMARY:PBA technologie introductie en bedrijfsbezoek DESCRIPTION: URL:https://edmforum.eu/event/pba-technology-session/ LOCATION:Connect Group Poperinge\, Frankrijklaan 22\, Poperinge\, 8970\, Belgium CATEGORIES:Technology seminar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20121015T123000 DTEND;TZID=Europe/Brussels:20121015T180000 DTSTAMP:20260709T151726 CREATED:20231212T224300Z LAST-MODIFIED:20241007T115651Z UID:1956-1350304200-1350324000@edmforum.eu SUMMARY:Sirris Workshop: Microprinting of Functional Material Deposit DESCRIPTION:The Sirris Microfabrication AppLication Lab (SMALL) at Sirris is active in the field of micro deposition and printed electronics by Aerosol Jet Printing technology (AJP). This new technology is very interesting in terms of material deposition on many types of substrates. If you want to learn more about how to improve in material deposition\, you should definitely attend this workshop. \n\n\n\n\n\nIn order to gather ideas supported by industrial companies and to help industry innovate\, Sirris and its SMALL laboratory equipped with AJP technology\, invites people from industry to this workshop at the Sirris’ ‘µPrinting Day’. During this event\, experts in Aerosol Jet printing technologies from OPTOMEC\, a recognized leader in the field of additive manufacturing\, will be present. \n\n\n\n12h30 : Welcome and sandwiches13h30 : Introduction (Umberto Baraldi\, Sirris)13h45 : Aerosol Jet® Technology for Printed Electronics (Dr. Mike Renn\, Aerosol Jet Advanced Applications)14h15: Functional materials for printed sensor structures (Dr. Volker Zöllmer\, Fraunhofer-Institut IFAM)14h45: µPrinting : change your paradigm – some industrial cases @ Sirris (Laurent Seronveaux\, SMALL Lab\, Sirris)15h15 : Coffee break15h30 : Discussion about 2 themes : General printed electronics – Sensor applications17h15: Networking cocktail and concluding remarks17h45 : End of the workshop    \n\n\n\nLocation: Sirris\, Rue du Bois Saint-Jean 12\, 4102 Seraing URL:https://edmforum.eu/event/sirris-workshop/ CATEGORIES:Partner Events END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20121012T130000 DTEND;TZID=Europe/Brussels:20121012T170000 DTSTAMP:20260709T151726 CREATED:20231212T223636Z LAST-MODIFIED:20240726T092508Z UID:1786-1350046800-1350061200@edmforum.eu SUMMARY:PCB technologie introductie and bedrijfsbezoek DESCRIPTION: URL:https://edmforum.eu/event/pcb-technologie-introductie-bedrijfsbezoek-3/ LOCATION:ACB\, Vosmeer 3\, Dendermonde\, +3252202030\, 9200\, Belgium CATEGORIES:Technology seminar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20121005T140000 DTEND;TZID=Europe/Brussels:20121005T193000 DTSTAMP:20260709T151726 CREATED:20231212T224012Z LAST-MODIFIED:20240726T073904Z UID:1836-1349445600-1349465400@edmforum.eu SUMMARY:EDM Event 2012: Kwantificatie van kwaliteit - op weg naar industriële toepassing DESCRIPTION:Wat heeft cEDM de industrie te bieden? Hoe kunnen wetenschappelijk onderbouwde methoden vertaald worden naar nuttig toepasbare hulpmiddelen in de industrie? Hoe deze methoden inzetten doorheen de toeleveringsketen? cEDM partners getuigen. \n\n\n\nOnze cEDM Partner ASML presenteert het MoVIP-project (Modellering van de Voorspelbaarheid van Initiële productkwaliteit.) \n\n\n\nHet project bouwt voort op het Defect Opportunity (DO) en Defect-Per-Million-Opportunity (DPMO) concept\, ontwikkeld op basis van IPC-7912 door cEDM\, voor het kwantificeren van PBA kwaliteit\, yield en testdekking. Zestien MoVIP projectpartners uit verschillende technologische disciplines werken het DO concept verder uit voor volledige industriële systemen (mechatronisch/optisch)\, rekening houdend met de afwijkende karakteristieken van deze systemen t.o.v. PBA’s.MoVIP illustreert hoe een wetenschappelijk onderbouwde methode\, ontwikkeld in het kader van het cEDM programma\, antwoord geeft op een concrete bedrijfsproblematiek. \n\n\n\nAgenda \n\n\n\n14h00Welkom14h10 EDM activiteiten en resultatenGeert Willems – imec14h50MoVIP project: Modellering van de Voorspelbaarheid van Initiële ProductkwaliteitDick van Hees – ASML15h15Invloed van pick & place machines op productkwaliteitSjef van Gastel – Assembléon15h40V&A16h00Netwerking en bezoek aan standen\n\n\n\n\n\n\n\n \n \n \n \n \n \n EDM Event 2012 program\n \n \n \n \n 1 file(s) 269.84 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n cEDM Activities\n \n \n \n \n 1 file(s) 3.31 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Movip – Predict Assembly ZHDR in the Design Phase\n \n \n \n \n 1 file(s) 1.13 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Influence of Pick & Place Machines on Product Quality\n \n \n \n \n 1 file(s) 1.40 MB\n \n \n Login to download. URL:https://edmforum.eu/event/cedm-event/ LOCATION:Imec Leuven\, Kapeldreef 75\, Leuven\, 3001\, Belgium CATEGORIES:EDM event END:VEVENT END:VCALENDAR