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BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20241115T093000
DTEND;TZID=Europe/Brussels:20241115T170000
DTSTAMP:20260709T073034
CREATED:20231208T165206Z
LAST-MODIFIED:20241113T150428Z
UID:1605-1731663000-1731690000@edmforum.eu
SUMMARY:Electronic Assembly Technology
DESCRIPTION:The course treats the technology\, design and manufacturing of Printed Circuit Boards (PCB) and the mounting of components on the PCB to manufacture an Electronic Assembly or Printed Board Assembly (PBA). The PBA is the generic building block of electronic products and systems. The course also provides the basics of electronics’ quantified quality. It provides insight into the body-of-knowledge on which the DfX guidelines and tools of the EDM Forum are based. \n\n\n\nCourse Objectives: \n\n\n\n\nBasics of PCB Technology\, manufacturing and Design-for-Manufacturing\n\n\n\nBasics of PBA Technology\, assembly and Design-for-Assembly\n\n\n\n\nAgenda:  \n\n\n\n\nPrinted Circuits Board Technology\, manufacturing\, cost drivers and specification\n\n\n\nPrinted Circuits Board Design-for-Manufacturing\n\n\n\nPrinted Board Assembly Technology: components\, soldering and other assembly processes.\n\n\n\nPrinted Board Assembly Design-for-Assembly\n\n\n\nQuantified Quality of PBA\n\n\n\nQ&A – wrap-up\n\n\n\n\nPrice:Members: EUR 250Non-member: EUR 375imec employees: free of charge \n\n\n\nimec employees\, please register at imec academy. \n\n\n\nIf you are interested in an on-site session for a group (>5 participants) of collaborators of your company\, please\, contact geert.willems@imec.be for an on-site training quotation and practicalities. \n\n\n\n\n\n\n\n\nRegistration is closed. \n\n\n\nNext session: Electronic Assembly Technology 2025
URL:https://edmforum.eu/event/masterclass-electronic-assembly-technology/
LOCATION:imec Tower\, Remisebosweg 1\, Leuven\, 3001\, Belgium
CATEGORIES:Masterclass
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20240927T130000
DTEND;TZID=Europe/Brussels:20240927T170000
DTSTAMP:20260709T073034
CREATED:20231208T161423Z
LAST-MODIFIED:20241001T085640Z
UID:1584-1727442000-1727456400@edmforum.eu
SUMMARY:PBA Reliability Seminar and Test Facility Visit
DESCRIPTION:Smart products\, AI\, electronics everywhere… increasing electronics complexity means more opportunities to fail and\, therefore\, intrinsically a reduced reliability.This seminar will explain reliability assessment\, take you through the failure mechanisms in electronics and show you why and how Physics-of-Failure must be the cornerstone of modern reliability engineering. The seminar is followed by a visit to the test facilities of the seminar host Jabil Hasselt\, Corda Campus 5.This seminar is complementary to the PCB and PBA technology seminars. Preferably\, the participants have attended these seminars or are familiar with PCB and PBA technology. \n\n\n\n\nFailure Probability/Reliability functions: “the bathtub curve”– Early failure – constant failure rate – wear-out – meaning of MTTF – Weibull– Constant failure rate modeling and why it is not suited for modern electronics.– EDM-D-100: Failure opportunities and the reliability function R(T) of a PBA\n\n\n\nBasics of Physics-of-Failure– The failure mechanism – the stress level – from stress to lifetime– Accelerated testing– Physics-of-Failure based testing\n\n\n\nDominant failure mechanisms in electronics– Solder joint failure– PCB via failure– Insulation failure: SIR – creep corrosion – (CAF – Sn-whiskers)– Component failures: capacitors\n\n\n\n\nPrice:Members: free of chargeNon-member: EUR 100\,00imec employees: free of charge – go to the imec academy registration. \n\n\n\n\n\nGet to know the Corda Campus: https://www.cordacampus.com/ \n\n\n\n\n\n\nRegistration closed
URL:https://edmforum.eu/event/reliability-seminar-and-test-facility-visit/
LOCATION:Corda Campus\, Corda Campus 1\, Hasselt\, B3500\, Belgium
CATEGORIES:Technology seminar
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20240920T093000
DTEND;TZID=Europe/Brussels:20240920T170000
DTSTAMP:20260709T073034
CREATED:20231208T160222Z
LAST-MODIFIED:20241001T085753Z
UID:1578-1726824600-1726851600@edmforum.eu
SUMMARY:System Engineering of Electronics and Smart Products
DESCRIPTION:This master class presents the System Engineering methodology developed by the International Counsel of System Engineers (INCOSE\, www.incose.org)\, consolidated in ISO/IEC/IEEE system and software engineering standards. We tailor and apply it to electronic products and smart systems with embedded electronics. We discuss in-depth the New Product Exploration (NPE)\, Planning (NPP) and Introduction (NPI) stages of system development that bring electronic products from idea to the end user. The specific characteristics of the electronic supply chain and the associated smart product development challenges are presented. A development methodology capable to cope with these challenges is explained as well as the important role of Design-for-eXcellence. \n\n\n\nCourse objectives \n\n\n\n\nIntroduction to ISO/IEC/IEEE System and Software Engineering standards.\n\n\n\nInsight in product life-cycle stages and processes of electronics and smart systems.\n\n\n\nElements of an electronic product and smart system development methodology.\n\n\n\nWhat capabilities does a smart system engineering organization need and can we assess this?\n\n\n\n\nAgenda \n\n\n\n\nBasics of System Engineering: System Structure\, Life Cycle Processes\, Life Cycle Management and Development strategies.\n\n\n\nNew Product Exploration: Business analysis\, Stakeholder need\,  Concept validation\n\n\n\nNew Product PlanningNew Product Introduction\,  NPI paradigm shift\, NPI per ISO/IEC/IEEE 15288Technology qualification\,\n\n\n\nSystem engineering capabilities of the System Engineering Organization\, of the electronics supply chain. Quality. Design-for-eXcellence\n\n\n\nQ&A – wrap-up\n\n\n\n\n\n\n\n\nPrice:Members: EUR 250Non-member: EUR 375iStart companies: participation fee covered by iStart. Select member/non-member ticket.imec employees: free of charge \n\n\n\nimec employees\, please register at imec academy. \n\n\n\nIf you are interested in an on-site session for a group (>5 participants) of collaborators of your company\, please\, contact geert.willems@imec.be for an on-site training quotation and practicalities. \n\n\n\n\n\n\n\n\nRegistration closed
URL:https://edmforum.eu/event/system-engineering-of-electronics-and-smart-products/
LOCATION:imec Tower\, Remisebosweg 1\, Leuven\, 3001\, Belgium
CATEGORIES:Masterclass
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20240614T130000
DTEND;TZID=Europe/Brussels:20240614T170000
DTSTAMP:20260709T073034
CREATED:20240111T141644Z
LAST-MODIFIED:20240729T084305Z
UID:2084-1718370000-1718384400@edmforum.eu
SUMMARY:PCB Technology seminar and factory visit
DESCRIPTION:This seminar is there for all who need a basic knowledge of Printed Circuit Board technology\, specifically managers and engineers involved in design\, industrialization\, qualification\, purchasing\, quality control of electronics.This seminar provides basic insight in the technology and production processes of a key part of all electronics: the Printed Circuit Board that connects the electronic components in an electronic assembly. To understand the relationship between cost\, quality and reliability of electronics\, a basic understanding of the capabilities and the limitations of the PCB technology as well as the factors that drive cost and quality is a great help. This seminar provides a basic step towards this understanding.This seminar is complementary to the PBA Technology seminar. \nAGENDA \nReception13h00 – Start 13h15Welcome at ACB by Joachim Verhegge (ACB)PCB technology basics by Joachim Verhegge (ACB)Introduction to PCB manufacturing technology discussing the basic materials and PCB manufacturing processes:lithography\, etching\, lamination\, drilling\, plating\, solder mask deposition\, finishing\, inspection. The process sequence for multilayer PCB’s is explained.Overview of advanced PCB technology by Joachim Verhegge (ACB)Overview of advanced PCB technologies for high complexity\, high-density interconnect and flexible PCBs. Some guidelines on the use of microvias.Factory tourExtensive tour of ACB’s factory facilities. \nMax. 20 participants. Not open to employees of PCB manufacturers or PCB distributors.
URL:https://edmforum.eu/event/pcb-technology-seminar-and-factory-visit-2/
LOCATION:ACB\, Vosmeer 3\, Dendermonde\, +3252202030\, 9200\, Belgium
CATEGORIES:Technology seminar
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20240425T013000
DTEND;TZID=Europe/Brussels:20240425T180000
DTSTAMP:20260709T073034
CREATED:20240709T094633Z
LAST-MODIFIED:20240726T075731Z
UID:2991-1714008600-1714068000@edmforum.eu
SUMMARY:EDM Workshop 36: Digitalization in Electronics' Design\, Supply Chain and Life-Cycle Management
DESCRIPTION:Electronics provides the engine for the digitalization of our economy and society. Electronics is everywhere and needs to fulfill an increasingly long list of requirements such as performance\, low cost\, quality\, reliability\, maintainability\, sustainability\, safety\, regulatory compliancy\, and many more. Deployment in new types of operational environments\, new operation modes\, new device technologies\, and new applications\, in combination with a very challenging supply chain and a continuously shortening time-to-market\, makes the classic experience based design-build-test approach to product development obsolete. A paradigm shift is needed in which computational methods predicting the characteristics of electronics become a core element of design verification and validation. In this workshop we explore the industrial availability of tools that can support this paradigm shift as well those that can support the management of the electronic product’s supply chain and life cycle.  \n\n\n\nAgenda \n\n\n\n13h30Welcome13h40 A paradigm shift in electronic product development by Geert Willems – imec14h00Digitalization in the electronics industry  by Jeroen De Jong – SiemensWith increasing complexity and fast-changing business models\, digitalization becomes more and more important to stay in the game\, win new business and quickly adapt to changes. The old trial-and-error build-design-test is being replaced by solutions that maximally predict the life-cycle aspects and characteristics of electronics by means of simulations\, virtual prototyping\, design rule checks\, supply chain assessment\, etc. We also touch upon the role AI can play in digitalization in the electronics industry.14h25Smart manufacturing for electronics  by Jean-Paul Dirven – SiemensHow do you keep up with today’s component supply issues while balancing staffing and resources and still deliver quality products on time without passing the cost onto your customers? The answer is to make your factory “smart\,” making it operate as efficiently as possible with leaner operations for more effective use of your resources and more predictable inventory needs. You’ll gain maximum flexibility\, better predictability\, and more agility to lower lead times and costs for customers. Ensure on-time delivery with production capacity improvements and fewer defective products.Break-out session I: Design15h10Simulation driven design for electronics by Julian Lai and Heiko Dudek – SiemensAnalysis is key to rapid evaluation and verification\, allowing you to eliminate unfit designs as early as possible before consuming significant resources. Continuously verify\, manage and share all the data\, including requirements\, test plans\, and results\, to address electronics design challenges and effectively shorten your entire program with Analysis Driven Design.Break-out session II: Product Life-Cycle Management15h10Supply Chain management by Andres Maya – SiemensIn the rapidly evolving electronics industry\, managing the supply chain has become increasingly complex due to technological advancements\, fluctuating demand\, and global disruptions. We address these challenges by focusing on the innovative concept of ‘shifting left’ in supply chain management. This approach emphasizes the importance of integrating supply chain considerations early in the product design and development phases to enhance resilience\, efficiency\, and innovation.15h50Product Life-Cycle management for electronics by Jeroen De Jong – SiemensDeveloping ever more innovative products requires a collaborative way of working that helps managing complexity and shortens development cycles. Teams should be enabled to collaborate as early as possible and in real-time\, creating a 360º view of project\, product\, and process data. PLM provides the backbone for connecting data\, applications\, people and processes throughout a product’s entire lifecycle.16h30Networking\n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Intro EDM Workshop 36\n                    \n                \n                \n                    \n                         1 file(s)  2 MB\n                    \n                    \n                        Download\n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n\n\nFor members only \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        A Paradigm Shift in Electronic Product Development\n                    \n                \n                \n                    \n                         1 file(s)  1 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Digitalization in the Electronics Industry\n                    \n                \n                \n                    \n                         1 file(s)  4 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Smart Manufacturing for Electronics\n                    \n                \n                \n                    \n                         1 file(s)  2 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Simulation Driven Design for Electronics\n                    \n                \n                \n                    \n                         1 file(s)  5 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Supply Chain Management\n                    \n                \n                \n                    \n                         1 file(s)  2 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Product Life-Cycle Management for Electronics\n                    \n                \n                \n                    \n                         1 file(s)  3 MB\n                    \n                    \n                        Login to download.
URL:https://edmforum.eu/event/edm-workshop-36-digitalization-in-electronics-design-supply-chain-and-life-cycle-management/
LOCATION:Siemens Leuven\, Interleuvenlaan 68\, Heverlee\, 3001\, Belgium
CATEGORIES:Workshop
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20240406T000000
DTEND;TZID=Europe/Brussels:20240411T235959
DTSTAMP:20260709T073034
CREATED:20241011T130124Z
LAST-MODIFIED:20241011T131723Z
UID:9106-1712361600-1712879999@edmforum.eu
SUMMARY:IPC APEX EXPO 2024 - ECWC16 Conference
DESCRIPTION:Discover the newest innovations and hear from the best minds in the electronics manufacturing industry. IPC APEX EXPO 2024 will be our industry’s largest event in North America featuring a world-class trade show\, professional development courses taught by industry experts\, non-stop networking and more! IPC APEX EXPO 2024 will also host the Electronic Circuits World Convention 16 (ECWC16) Technical Conference featuring cutting-edge technical presentations. Join us in Anaheim\, California\, April 6-11\, 2024. \n\n\n\nProceedings \n\n\n\nEDM contribution \n\n\n\n\n\n\n\n\n\nBest Paper Award \n\n\n\n\n\nPresentation: Maarten Cauwe\, UG-imec (right on photo) \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        A parametric approach to quantifying the environmental impact of PCB manufacturing\n                    \n                \n                \n                    \n                         1 file(s)  2 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\nPaper: Maarten Cauwe\, UG-imec\, Geert Willems\, imec\, Eddy Geerinckx\, ACB \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Best Paper APEX 2024 – A Parametric Approach to Quantifying the Environmental Impact of PCB Manufacturing\n                    \n                \n                \n                    \n                         1 file(s)  717.15 KB\n                    \n                    \n                        Login to download.
URL:https://edmforum.eu/event/ipc-apex-expo-2024-ecwc16-conference/
CATEGORIES:Events with EDM contribution
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20240328T133000
DTEND;TZID=Europe/Brussels:20240328T170000
DTSTAMP:20260709T073034
CREATED:20231205T162733Z
LAST-MODIFIED:20240731T151500Z
UID:1396-1711632600-1711645200@edmforum.eu
SUMMARY:Electronic Assembly Reliability
DESCRIPTION:Smart products\, AI\, electronics everywhere… increasing electronics complexity means more opportunities to fail and\, therefore\, intrinsically a reduced reliability.This seminar will explain quality and reliability assessment and quantification\, take you through the failure mechanisms in electronics and show you why and how Physics-of-Failure must be the cornerstone of modern reliability engineering.This Master Class provides a more in-depth discussion of the topics addressed in the “PBA reliability and test facility visit” seminar. It is complementary to the Master Class “Electronic Assembly Technology”. Participants are assumed to be familiar with PCB and PBA technology. \nAgenda:1.      Quality Quantification2.      Reliability related basics3.      PBA failure mechanisms4.      Reliability Assessment         o   The traditional approach         o   A Reliability Physics based approach5.      Reliability quantification
URL:https://edmforum.eu/event/electronic-assembly-reliability/
LOCATION:imec Tower\, Remisebosweg 1\, Leuven\, 3001\, Belgium
CATEGORIES:Masterclass
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20240308T130000
DTEND;TZID=Europe/Brussels:20240308T170000
DTSTAMP:20260709T073034
CREATED:20231127T103939Z
LAST-MODIFIED:20240729T084156Z
UID:1392-1709902800-1709917200@edmforum.eu
SUMMARY:Electronic Assembly Technology seminar and factory visit
DESCRIPTION:For all who need a basic knowledge of electronic assembly technology and processes\, specifically managers and engineers involved in the design\, industrialisation and purchasing of electronics\, and product and quality engineers dealing with electronics.This seminar provides basic insight in the technology and production processes of the basic building block of electronic systems: the Printed (Circuit) Board Assembly (PBA). To understand the relationship between cost\, quality and reliability of electronics\, a basic understanding of the capabilities and the limitations of the PBA technology as well as the factors that drive cost and quality is a great help. This seminar provides a basic step towards this understanding by providing an introductory presentation discussing electronic assembly technology and processes followed by a visit to the electronics assembly plant of Page Electronica.This seminar is complementary to the PCB Technology and the PBA Reliability seminars and factory visits. \n\n\n\n\nAGENDA\n\n\n13h00  Doors13h20  Welcome by Luc Page13h30  Introduction to electronic assembly technology and processes – Geert Willems (imec – EDM forum)The basics of electronic assembly technology and processes are explained with focus on leadfree soldering. The session gives insight in the possibilities and boundary conditions of electronic assembly and provides the basics for cost-effective Design-for-Assembly.15h00  Factory tour16h30  Closing Q&A session. \n\n\n\n\n\n\nPage electronica offers a shuttle service between Poperinge railway station and its factory. Please\, send e-mail to EDM@imec.be to reserve your shuttle seat (5 minutes drive).Train arrivals from Kortrijk: __h53Train departures to Kortrijk: __h07
URL:https://edmforum.eu/event/electronic-assembly-technology-seminar-and-factory-visit/
LOCATION:Page Electronica\, Frankrijklaan 22\, Poperinge\, 8970\, Belgium
CATEGORIES:Technology seminar
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20231124T093000
DTEND;TZID=Europe/Brussels:20231124T170000
DTSTAMP:20260709T073034
CREATED:20231212T224159Z
LAST-MODIFIED:20240731T151325Z
UID:1903-1700818200-1700845200@edmforum.eu
SUMMARY:Electronic Assembly technology
DESCRIPTION:The course treats the technology\, design and manufacturing of Printed Circuit Boards (PCB) and the assembly of components on the PCB to manufacture an Electronic Assembly or Printed Board Assembly (PBA). The PBA is the generic building block of electronic products and systems. The course also provides the basics of electronics’ quantified quality. It provides insight into the body-of-knowledge on which the DfX guidelines and tools of the EDM Forum are based. \n\n\n\nRequired background knowledgeNo specific background knowledge required. Some basic knowledge of electronics is helpful. \n\n\n\nCourse Objectives \n\n\n\n\nBasics of PCB Technology\, manufacturing and Design-for-Manufacturing\n\n\n\nBasics of PBA Technology\, assembly and Design-for-Assembly\n\n\n\nBasics of PBA quality \n\n\n\n\nWho should attendAll that may benefit from a basic knowledge of design\, manufacturing\, quality and reliability of electronic assemblies. \n\n\n\nLecturerGeert Willems\, PhD\, imec –  EDM Forum 
URL:https://edmforum.eu/event/system-engineering-of-electronics-and-smart-products-2/
LOCATION:Imec Leuven\, Kapeldreef 75\, Leuven\, 3001\, Belgium
CATEGORIES:Masterclass
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20231011T130000
DTEND;TZID=Europe/Brussels:20231011T180000
DTSTAMP:20260709T073034
CREATED:20230919T153921Z
LAST-MODIFIED:20240726T075646Z
UID:1336-1697029200-1697047200@edmforum.eu
SUMMARY:EDM Workshop 35: Environmental Impact of Digitalization
DESCRIPTION:Today no company can ignore the sustainability and environmental impact of its products and business. The digitalization of society associated with the proliferation of electronics everywhere implies that electronics is a key element in the environmental impact of a growing number of products\, systems\, installations and services. This workshop dives into the challenges of assessing the environmental impact of electronics through-out its lifetime. \n\n\n\nAn Vercalsteren of VITO will introduce the basic elements and the state-of-the-art of Life Cycle Assessment (LCA). LCA is generally applied to assess the environmental impact of a product or service over its full life cycle. \n\n\n\nUnfortunately\, the actual state-of-the-art of the Life Cycle Assessment and the Life Cycle Inventory (LCI) databases\, do not allow an accurate assessment of the environmental impact of electronics. Furthermore\, the cumbersome nature of LCA severely limits its useability as an eco-design supporting tool. Geert Willems\, imec-EDM Forum\, will explain how a lean eco-design methodology based on parametric LCI-models may be a workable alternative\, also for the SME. The parametric LCI-models provide an answer to the shortcomings of LCI data records as they are used today. Parametric LCI models for PCB manufacturing and Printed Board Assembly will be presented. \n\n\n\nCedric Rollin\, imec-SSTS\, will discuss the environmental impact of IC manufacturing and the challenges of its impact assessment. Sustainable Semiconductor Technologies and Systems is a new department and research program at imec joined by World leading companies like Apple\, Microsoft\, Amazon\, Meta and several to engage into more sustainable IC manufacturing. \n\n\n\nAlso the use of electronics for mobile communication\, cloud computing\, data streaming\, machine learning\, etc.\, may contribute significantly to e.g. climate change if not managed properly. Jean-Pierre Raskin\, UCLouvain\, will discuss the environmental impact of a digital society in operation. \n\n\n\nThe workshop will close with a Q&A session followed by a networking opportunity with some alcohol-free drinks and snacks. \n\n\n\n\n\n\n\nAgenda \n\n\n\n\n\n\n\n13h00  Welcome13h30Intro to Life Cycle Assessment\, LCI and LCIAAn Vercalsteren\, VITO14h00 Internet-of-Things for the better or the worstJean-Pierre Raskin\, UCLouvain14h30 Lean eco-design of electronics based on parametric Life Cycle Inventory analysisGeert Willems\, imec-EDM Forum15h00 Parametric LCI of PCB manufacturing and assemblyMaarten Cauwe imec-CMST\, Geert Willems imec-EDM Forum15h30 Assessing the environmental impact of integrated circuit chip manufacturingCedric Rolin\, imec-SSTS16h00 Q&A and discussion16h30 Networking18h00 Closure\n\n\n\n\n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Intro EDM Workshop 35\n                    \n                \n                \n                    \n                         1 file(s)  834.38 KB\n                    \n                    \n                        Download\n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n\n\nFor members only \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Introduction to Life Cycle Assessment\, LCI and LCIA\n                    \n                \n                \n                    \n                         1 file(s)  3.91 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Internet-of-Things for the Best and the Worst\n                    \n                \n                \n                    \n                         1 file(s)  3.56 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Lean Eco-design of Electronics Based on Parametric LCI Analysis\n                    \n                \n                \n                    \n                         1 file(s)  2.74 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Parametric LCI of PCB Manufacturing and Assembly\n                    \n                \n                \n                    \n                         1 file(s)  1.71 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Assessing the Environmental Impact of IC Chip Manufacturing\n                    \n                \n                \n                    \n                         1 file(s)  3.39 MB\n                    \n                    \n                        Login to download.
URL:https://edmforum.eu/event/35th-edm-workshop-environmental-impact-of-digitalization/
LOCATION:Imec Leuven\, Kapeldreef 75\, Leuven\, 3001\, Belgium
CATEGORIES:Workshop
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20230929T093000
DTEND;TZID=Europe/Brussels:20230929T170000
DTSTAMP:20260709T073034
CREATED:20230919T153431Z
LAST-MODIFIED:20240731T151446Z
UID:1333-1695979800-1696006800@edmforum.eu
SUMMARY:System Engineering of Electronics and Smart products
DESCRIPTION:This master class presents the System Engineering methodology developed by the International Counsel of System Engineers (INCOSE\, www.incose.org)\, consolidated in ISO/IEC/IEEE system and software engineering standards. We tailor and apply it to electronic products and smart systems with embedded electronics. We discuss in-depth the New Product Exploration (NPE)\, Planning (NPP) and Introduction (NPI) stages of system development that bring electronic products from idea to the end user.The specific characteristics of the electronic supply chain and the associated smart product development challenges are presented. A development methodology capable to cope with these challenges is explained as well as the important role of Design-for-eXcellence. \n\n\n\nRequired background knowNo specific background knowledge required. \n\n\n\nCourse objectives \n\n\n\n\nIntroduction to ISO/IEC/IEEE System and Software Engineering standards.\n\n\n\nInsight in product life-cycle stages and processes of electronics and smart systems.\n\n\n\nElements of an electronic product and  smart system development methodology.\n\n\n\nWhat capabilities does a smart system engineering organization needs and can we assess this? \n\n\n\n\nOf interest to:All stakeholders in electronic product and smart system development. \n\n\n\nLecturerGeert Willems\, EDM Forum\, imec
URL:https://edmforum.eu/event/masterclass-system-engineering-of-electronics-and-smart-products/
LOCATION:imec Tower\, Remisebosweg 1\, Leuven\, 3001\, Belgium
CATEGORIES:Masterclass
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20230606T130000
DTEND;TZID=Europe/Brussels:20230606T163000
DTSTAMP:20260709T073034
CREATED:20231212T223639Z
LAST-MODIFIED:20240729T083741Z
UID:1793-1686056400-1686069000@edmforum.eu
SUMMARY:PCB Technology seminar and factory visit
DESCRIPTION:This seminar is there for all who need a basic knowledge of Printed Circuit Board technology\, specifically managers and engineers involved in design\, industrialisation\, qualification\, purchasing\, quality control of electronics.This seminar provides basic insight in the technology and production processes of a key part of all electronics: the Printed Circuit Board that connects the electronic components in an electronic assembly.To understand the relationship between cost\, quality and reliability of electronics\, a basic understanding of the capabilities and the limitations of the PCB technology as well as the factors that drive cost and quality is a great help. This seminar provides a basic step towards this understanding. \n\n\n\nReception13h00 – Start 13h15Welcome at ACB by Joachim Verhegge (ACB)PCB technology basics by Joachim Verhegge (ACB)Introduction to PCB manufacturing technology discussing the basic materials and PCB manufacturing processes:lithography\, etching\, lamination\, drilling\, plating\, solder mask deposition\, finishing\, inspection. Theprocess sequence for multilayer PCB’s is explained.Overview of advanced PCB technology by Joachim Verhegge (ACB)Overview of advanced PCB technologies for high complexity\, high-density interconnect and flexible PCBs. Some guidelines on the use of microvias.Factory tourExtensive tour of ACB’s factory facilities.End: around 16h30
URL:https://edmforum.eu/event/pcb-technology-seminar-and-factory-visit/
LOCATION:ACB\, Vosmeer 3\, Dendermonde\, +3252202030\, 9200\, Belgium
CATEGORIES:Technology seminar
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20230419T090000
DTEND;TZID=Europe/Brussels:20230419T170000
DTSTAMP:20260709T073034
CREATED:20241011T115921Z
LAST-MODIFIED:20241011T124316Z
UID:9089-1681894800-1681923600@edmforum.eu
SUMMARY:D&E Event 2023: Het ontwerpen van innovatieve elektronica
DESCRIPTION:D&E Event 2023\n\n\n\nTijdens het jaarlijkse Design Automation & Embedded Systems Event delen ontwikkelaars en toepassers van embedded systems (hardware én software) kennis van de laatste technologieën en wisselen zij visies en ervaringen uit met vakgenoten. In het lezingenprogramma wordt aandacht besteed aan specifieke thema’s. \n\n\n\nLive demonstraties op de beursvloer\n\n\n\nD&E is in een nieuw jasje gestoken met een frisse huisstijl\, een nieuwe locatie en live demonstraties. De demo’s zijn een waardevolle aanvulling op het programma en vinden de hele dag plaats naast de technisch inhoudelijke lezingen. Zo kan je zelf aan de slag gaan met nieuwe producten en met eigen ogen zien hoe alles werkt! \n\n\n\nLocatie: 1931 Congrescentrum\, ‘s-Hertogenbosch\, Nederland \n\n\n\n\n\nKeynote speakers\n\n\n\nDe lezingen worden dit jaar aangevuld met de bijdrage van een aantal uiterst waardevolle keynote speakers :Geert Willems (Imec België) : Milieuimpact van elektronica: Hoe bepalen we dit? … en hoe verminderen we het? \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Milieuimpact van elektronica: Hoe bepalen en hoe verminderen?\n                    \n                \n                \n                    \n                         1 file(s)  3 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\nArtikel Engineersonline.nl: “De impact van elektronica op het milieu is groot\, maar niemand weet hoé groot” \n\n\n\nDick van Hees (ASML en MRMc) & Ruud van Beek (ASML) : Early Involvement 2.0: Hoe maak ik een design first time right? \n\n\n\nProgramma
URL:https://edmforum.eu/event/de-event-2023-het-ontwerpen-van-innovatieve-elektronica/
CATEGORIES:Events with EDM contribution
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20230324T093000
DTEND;TZID=Europe/Brussels:20230324T170000
DTSTAMP:20260709T073034
CREATED:20231212T224143Z
LAST-MODIFIED:20240731T145821Z
UID:1889-1679650200-1679677200@edmforum.eu
SUMMARY:Electronic Assembly Technology
DESCRIPTION:The course treats the technology\, design and manufacturing of Printed Circuit Boards (PCB) and the assembly of components on the PCB to manufacture an Electronic Assembly or Printed Board Assembly (PBA). The PBA is the generic building block of electronic products and systems. The course also provides the basics of electronics’ quantified quality. It provides insight into the body-of-knowledge on which the DfX guidelines and tools of the EDM Forum are based. \n\n\n\nRequired background knowledgeNo specific background knowledge required. Some basic knowledge of electronics is helpful. \n\n\n\nCourse Objectives \n\n\n\n\nBasics of PCB Technology\, manufacturing and Design-for-Manufacturing\n\n\n\nBasics of PBA Technology\, assembly and Design-for-Assembly\n\n\n\nBasics of PBA quality\n\n\n\n\nWho should attendAll that may benefit from a basic knowledge of design\, manufacturing\, quality and reliability of electronic assemblies. \n\n\n\nLecturerGeert Willems\, PhD\, imec –  EDM Forum 
URL:https://edmforum.eu/event/electronic-assembly-technology-3/
LOCATION:imec Tower\, Remisebosweg 1\, Leuven\, 3001\, Belgium
CATEGORIES:Masterclass
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20230203T130000
DTEND;TZID=Europe/Brussels:20230203T150000
DTSTAMP:20260709T073034
CREATED:20231212T224228Z
LAST-MODIFIED:20240725T155058Z
UID:1928-1675429200-1675436400@edmforum.eu
SUMMARY:Webinar 2023-2-3: Successful Innovation With Smart Products and the IoT
DESCRIPTION:13h00Introduction13h10Smart products at Pattyn13h40Smart Product ExplorationSirris14h05Smart products at Ethernetics14h35A System Engineering Approach to Smart product Explorationimec14h55What’s next?\n\n\n\n\n\nFor members only \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Succesful Innovation with Smart Products and IoT\n                    \n                \n                \n                    \n                         1 file(s)  2.21 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n                \n            \n            \n                A System Engineering Approach to Smart Product Exploration\n                 1.70 MB  0 Downloads\n            \n        \n    \n     July 25\, 2024  Login to download.
URL:https://edmforum.eu/event/successful-innovation-with-smart-products-and-the-iot/
CATEGORIES:Webinar
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20221125T093000
DTEND;TZID=Europe/Brussels:20221125T170000
DTSTAMP:20260709T073034
CREATED:20231212T224156Z
LAST-MODIFIED:20240731T150315Z
UID:1900-1669368600-1669395600@edmforum.eu
SUMMARY:Master Class System Engineering
DESCRIPTION:This master class presents the System Engineering methodology developed by the International Counsel of System Engineers (INCOSE\, www.incose.org)\, consolidated in ISO/IEC/IEEE system and software engineering standards. We tailor and apply it to electronic products and smart systems with embedded electronics. We discuss in-depth the New Product Exploration (NPE)\, Planning (NPP) and Introduction (NPI) stages of system development that bring an electronic products from idea to the end user.The specific characteristics of the electronic supply chain and the associated smart product development challenges are presented. A development methodology capable to cope with these challenges is explained as well as the important role of Design-for-eXcellence. \n\n\n\nCourse objectives\n\n\n\n\nIntroduction to ISO/IEC/IEEE System and Software Engineering standards.\n\n\n\nInsight in product life-cycle stages and processes of electronics and smart systems.\n\n\n\nElements of an electronic product and  smart system development methodology.\n\n\n\nWhat capabilities does a smart system engineering organization needs and can we assess this?\n\n\n\n\nOff interest to:\n\n\n\nAll stakeholders in electronic product and smart system development. \n\n\n\nLecturer\n\n\n\nGeert Willems\, imec \n\n\n\nAgenda: 9h30 Basics of System Engineering           System Structure           System Life Cycle Processes           System Life Cycle Management           Technology versus system development11h00 Break11h15  State-of-the-art of the electronics industry              New Product Exploration              New Product Planning12h45 Lunch13h30 New Product Introduction             Electronics Technology qualification: “A white box approach”15h00 Break15h15 Electronics supply chain and quality            Capabilities of the System Engineering Organization16h45 Q&A – wrap-up
URL:https://edmforum.eu/event/master-class-system-engineering/
LOCATION:imec Tower\, Remisebosweg 1\, Leuven\, 3001\, Belgium
CATEGORIES:Masterclass
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20221104T133000
DTEND;TZID=Europe/Brussels:20221104T163000
DTSTAMP:20260709T073034
CREATED:20231212T224156Z
LAST-MODIFIED:20240726T075601Z
UID:1899-1667568600-1667579400@edmforum.eu
SUMMARY:EDM Workshop 34: Smart Product Exploration
DESCRIPTION:Intelligence and connectivity are essential properties of an increasing number of products in a wide range of applications. Making a product smart and connected opens possibilities but also raises questions: what do our customers really need? What value do we need to offer? How to reduce risks? What technology and expertise are needed? How to establish a successful business?In this workshop we introduce a system engineering based methodology to master the fuzzy front-end of smart product development which we call the New Product Exploration stage. In this stage the stakeholder’s needs and problems and their potential solutions are explored. It addresses key questions like: \n\n\n\n– How can we obtain a validated solution concept efficiently without cost and time budget overruns. \n\n\n\n– What expertise and capabilities do we need to develop\, produce and manage the life-cycle of the smart product solution? After a short introduction to system life-cycle stages and processes\, the New Product Exploration methodology is introduced based on the ISO/IEC/IEEE 15288 and 24784-1 system engineering. We discuss how the problems and needs of stakeholders can be explored and how a solution can be validated.In a second part we focus on the organization developing the system solution. What are the capabilities an organziation needs to have to be able to develop smart products and create a successful business with and/or around a smart product\, and what is the status of these capabilities? What is the status of our product development and its life-cycle management? We will present an organization and product maturity assessment tool. \n\n\n\nAgenda \n\n\n\n13h30A System Engineering Approach to Smart Product Exploration.Geert Willems – imec14h20System Engineering Based Smart Product Exploration.Thomas De Meester – imec15h30Networking and tool demonstration\n\n\n\n\n\nFor members only \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        A System Engineering Approach to Smart Product Exploration\n                    \n                \n                \n                    \n                         1 file(s)  6.93 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        System Engineering Based Smart Product Exploration\n                    \n                \n                \n                    \n                         1 file(s)  4.88 MB\n                    \n                    \n                        Login to download.
URL:https://edmforum.eu/event/34th-edm-workshop-smart-product-exploration/
LOCATION:Imec Leuven\, Kapeldreef 75\, Leuven\, 3001\, Belgium
CATEGORIES:Workshop
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20220614T150000
DTEND;TZID=Europe/Brussels:20220614T160000
DTSTAMP:20260709T073034
CREATED:20231212T224228Z
LAST-MODIFIED:20240725T150026Z
UID:1927-1655218800-1655222400@edmforum.eu
SUMMARY:Webinar 2022-6-17: Solution Space Exploration and validation
DESCRIPTION:This webinar series is an initiative of the COOCK project ‘Oriënteren en Beslissen in Slimme Product Exploratie’ funded by VLAIO. More information about this project can be found on the project page.Intelligence and connectivity are becoming essential product properties. Making a product smart and connected opens possibilities but also raises questions: How to be successful? How to reduce risks? How to keep focus? How to present your solution? What value does it offer? What technology and expertise are needed?This three part webinar series addresses the above questions and many more\, in a systematic way. Our approach is based on the System Engineering methodology developed by the INCOSE consortium of system engineering\, that is consolidated in the ISO/IEC/IEEE 15288 and ISO/IEC/IEEE 24748-1 standards. The goal is to minimize the “fuzziness” in the smart product exploration and validation.In this “Solution Space Exploration and Validation” we address the fuzzy front-end of product development which transforms first ideas of a (smart) product-based solution into a validated concept upon which a Product Requirements Document (PRD) can be based. The PRD forms the basis of the product’s architecture definition\, the first phase of the actual product development.  \n\n\n\n\n\n\n\n\n\n\n\nFor members only \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        A System Engineering Approach to Smart Product Exploration: System Analysis\, Verification and Validation\n                    \n                \n                \n                    \n                         1 file(s)  836.34 KB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Solution Space and Concept Validation\n                    \n                \n                \n                    \n                         1 file(s)  1.91 MB\n                    \n                    \n                        Login to download.
URL:https://edmforum.eu/event/solution-space-exploration-and-validation/
CATEGORIES:Webinar
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20220603T150000
DTEND;TZID=Europe/Brussels:20220603T160000
DTSTAMP:20260709T073034
CREATED:20231212T224228Z
LAST-MODIFIED:20240725T144041Z
UID:1926-1654268400-1654272000@edmforum.eu
SUMMARY:Webinar 2022-6-3: Problem Space and Stakeholder Needs Exploration
DESCRIPTION:This webinar series is an initiative of the COOCK project ‘Oriënteren en Beslissen in Slimme Product Exploratie’ funded by VLAIO. More information about this project can be found on the project page.Intelligence and connectivity are becoming essential product properties. Making a product smart and connected opens possibilities but also raises questions: How to be successful? How to reduce risks? How to keep focus? How to present your solution? What value does it offer? What technology and expertise are needed?This three part webinar series addresses the above questions and many more\, in a systematic way. Our approach is based on the System Engineering methodology developed by the INCOSE consortium of system engineering\, that is consolidated in the ISO/IEC/IEEE 15288 and ISO/IEC/IEEE 24748-1 standards. The goal is to minimize the “fuzziness” in the smart product exploration and validation.In this second webinar “Problem Space and Stakeholder Needs Exploration” we address the question how to explore\, understand and validate the needs of the stakeholders of the product to be developed\, as well as the problems or opportunities for which the new product needs offers an answer. The latter is called problem space research.  \n\n\n\n\n\n\n\n\n\n\n\nOnly for members \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        A System Engineering Approach to Smart Product Exploration: Business Analysis and Stakeholder  Needs & Requirements\n                    \n                \n                \n                    \n                         1 file(s)  1.17 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Problem Space and Stakeholder Needs Exploration\n                    \n                \n                \n                    \n                         1 file(s)  948.61 KB\n                    \n                    \n                        Login to download.
URL:https://edmforum.eu/event/problem-space-and-stakeholder-needs-exploration/
CATEGORIES:Webinar
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20220520T150000
DTEND;TZID=Europe/Brussels:20220520T160000
DTSTAMP:20260709T073034
CREATED:20231212T224225Z
LAST-MODIFIED:20240725T145355Z
UID:1925-1653058800-1653062400@edmforum.eu
SUMMARY:Webinar 2022-5-20: Introduction to Smart Product Exploration
DESCRIPTION:This webinar series is an initiative of the COOCK project ‘Oriënteren en Beslissen in Slimme Product Exploratie’ funded by VLAIO. More information about this project can be found on the project page.Intelligence and connectivity are becoming essential product properties. Making a product smart and connected opens possibilities but also raises questions: How to be successful? How to reduce risks? How to keep focus? How to present your solution? What value does it offer? What technology and expertise are needed?This three part webinar series addresses the above questions and many more\, in a systematic way. Our approach is based on the System Engineering methodology developed by the INCOSE consortium of system engineering\, that is consolidated in the ISO/IEC/IEEE 15288 and ISO/IEC/IEEE 24748-1 standards. The goal is to minimize the “fuzziness” in the smart product exploration and validation.In the first webinar (20/5/2022 – 3pm) “Introduction to (smart) Product Exploration” imec introduces its “Smart Product Maturity Scan” tool. We will show how this tool can support your company in exploring smart product opportunities and risks\, and to assess the in-house capabilities and those of the supply chain. \n\n\n\n\n\n\n\n\n\n\n\nFor members only \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        A System Engneering Approach to Smart Product Exploration\n                    \n                \n                \n                    \n                         1 file(s)  1.86 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Introduction to Smart Product Exploration\n                    \n                \n                \n                    \n                         1 file(s)  932.56 KB\n                    \n                    \n                        Login to download.
URL:https://edmforum.eu/event/introduction-to-smart-product-exploration/
CATEGORIES:Webinar
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20220207T130000
DTEND;TZID=Europe/Brussels:20220207T150000
DTSTAMP:20260709T073034
CREATED:20231212T224225Z
LAST-MODIFIED:20240725T153730Z
UID:1924-1644238800-1644246000@edmforum.eu
SUMMARY:Webinar 2022-2-7: Successfully making your products smarter
DESCRIPTION:13h00Value creation13h10Smart products at AVR13h40Smart product explorationSirris14h05Smart products at Mealhero14h35Smart product explorationimec14h55What’s next?\n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Succesfully Making Your Products Smarter\n                    \n                \n                \n                    \n                         1 file(s)  32.00 KB\n                    \n                    \n                        Login to download.
URL:https://edmforum.eu/event/successfully-making-your-products-smarter/
CATEGORIES:Webinar
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20210623T140000
DTEND;TZID=Europe/Brussels:20210623T150000
DTSTAMP:20260709T073034
CREATED:20231212T224225Z
LAST-MODIFIED:20240726T075531Z
UID:1921-1624456800-1624460400@edmforum.eu
SUMMARY:Webinar 2021-6-23: Mastering (smart) Product Exploration
DESCRIPTION:Does your company aspire to innovate with smart products?Or are you already in the process of exploring the creation of a smart\, connected product? In this webinar\, imec introduces the tools we have developed to support your company in developing a smart product. The tools elaborate on domains and expertise key for smart product development. The webinar is relevant for anyone witha role in product development and product life-cycle management (R&D\, business leaders\, product project managers…) \n\n\n\n\n\nFor members only \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Mastering (smart) Product Exploration\n                    \n                \n                \n                    \n                         1 file(s)  1.69 MB\n                    \n                    \n                        Login to download.
URL:https://edmforum.eu/event/mastering-smart-product/
CATEGORIES:Webinar
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20210518T140000
DTEND;TZID=Europe/Brussels:20210518T160000
DTSTAMP:20260709T073034
CREATED:20240712T132011Z
LAST-MODIFIED:20240726T075436Z
UID:3107-1621346400-1621353600@edmforum.eu
SUMMARY:EDM Workshop 33: Electronics Cooling and Interconnect Technologies for Vehicle Computers
DESCRIPTION:High-Performance CPU/GPU processors are required for self-driving cars to perform vision processing\, object recognition and interaction with intelligent traffic systems in real-time and reliable for 15 years. \n\n\n\nA consortium of Belgian\, Dutch and German companies and research organisations with expertise along the entire automotive value chain\, intends to meet the challenges to develop high performance electronic systems that can withstand the harsh vehicle conditions. This is realised through innovations in integrated circuit design\, manufacturing and packaging to create automotive grade solutions in three key areas: computation\, communication and integration. \n\n\n\nThe three Flemish partners (Materialise\, Interflux Electronics & imec) provides advanced and reliable liquid cooling solutions to enable the required high heat dissipation (300W). Additionally\, the solderability of very large BGA processor components is improved with the introduction of low melting point soldering technology. These key innovations will be presented in this virtual workshop. \n\n\n\nAgenda \n\n\n\n14h00HIPER: Introduction to colklaborative research project on High Performance Vehicle Provcessors.Bart Vandevelde – imec14h20Advanced 3D printing solutions for advanced processor coolingPart A: 3D printing technology      Willem Verleysen – MaterialisePart B: Simulation and characterisation of cooling performance of 3D printed heat sinks            Majid Nazemi – Materialise and Antonio Pappaterra – imec15h10Low melting point solder technology for advanced processor componentsRalph Lauwaert – Interflux Electronics15h40Q&A\n\n\n\nOnline workshop \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Intro EDM Workshop 33\n                    \n                \n                \n                    \n                         1 file(s)  340.25 KB\n                    \n                    \n                        Download\n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n\n\nFor members only \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        HIPER: Introduction to Research Project on High Performance Vehicle Processors\n                    \n                \n                \n                    \n                         1 file(s)  1 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Advanced 3D Printing Solutions for Advanced Processor Cooling: 3D Printing Technology\n                    \n                \n                \n                    \n                         1 file(s)  6 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Simulation and Characterisation of Cooling Performance of 3D Printed Heat Sinks\n                    \n                \n                \n                    \n                         1 file(s)  4 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Low Melting Point Solder Technology for Advanced Processor Components\n                    \n                \n                \n                    \n                         1 file(s)  3 MB\n                    \n                    \n                        Login to download.
URL:https://edmforum.eu/event/edm-workshop-34-electronics-cooling-and-interconnect-technologies-for-vehicle-computers/
CATEGORIES:Workshop
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20210125T130000
DTEND;TZID=Europe/Brussels:20210125T154500
DTSTAMP:20260709T073034
CREATED:20231212T224225Z
LAST-MODIFIED:20240725T152413Z
UID:1922-1611579600-1611589500@edmforum.eu
SUMMARY:Webinar 2021-1-25: Accelerate and Strengthen Your Idea for a Smart Product
DESCRIPTION:Agenda \n\n\n\n13h00Introduction13h10How do companies approach their smart product innovation?Witnesses: Gilbos and Shayp14h20Smart Product ExplorationThomas De Meester – imec14h40Tools for orientation and decision making  Smart Product Scenarios – Ludwig De Locht – Sirris  Fit with market – Nick Boucart – Sirris  Smart product maturity – Thomas De Meester – imec  Follow-up tools – Geert Willems – imec  Proof-of-Concepts – Thomas De Meester – imec15h25What’s next for your company?Pieter Beyl – Sirris\n\n\n\n\n\nFor members only \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Accelerate and Strengthen Your Idea for a Smart Product\n                    \n                \n                \n                    \n                         1 file(s)  3.35 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Smart Product Development at Gilbos\n                    \n                \n                \n                    \n                         1 file(s)  770.09 KB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Smart Product Development at Shayp\n                    \n                \n                \n                    \n                         1 file(s)  6.09 MB\n                    \n                    \n                        Login to download.
URL:https://edmforum.eu/event/mastering-smart-product-2/
CATEGORIES:Webinar
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20201029T093000
DTEND;TZID=Europe/Brussels:20201029T170000
DTSTAMP:20260709T073034
CREATED:20231212T224143Z
LAST-MODIFIED:20240731T150710Z
UID:1890-1603963800-1603990800@edmforum.eu
SUMMARY:Electronic Product Development
DESCRIPTION:Due to the on-going Corona pandemic no live participation by non-imec employees to training sessions and seminars at imec is allowed. Online participation is possible through live streaming and MS Teams interaction session. \n\n\n\nAbout the course:The course discusses the New Product Exploration (NPE)\, Planning (NPP) and Introduction (NPI) development stages that bring an electronic product from idea to the end user. The relationship with the product life cycle stages and life cycle processes defined per ISO/IEC/IEEE System and Software Engineering standards is explained.  The specific characteristics of the electronic supply chain and the associated smart product development challenges are presented. A development methodology capable to cope with these challenges is explained as well as the important role of Design-for-eXcellence.A short introduction to Printed Circuit Board technology\, manufacturing and assembly closes the session. \n\n\n\nCourse objectives:– Insight in product development stages and processes of electronics.– Get to know the challenges of electronics development and the electronics supply chain.– Introduction to ISO/IEC/IEEE System and Software Engineering standards.– Elements of a Smart Product Development methodology.– What is Design-for-eXcellence and why is it important. \n\n\n\nOf interest to:All stakeholders in electronic product development. \n\n\n\nLecturer: Geert Willems\, Ph.D.\, imecPresentation: video streamingInteraction: MS Teams parallel sessionimec employees can participate on-site (max. 20) \n\n\n\nAgenda: 9h30  Electronic System Structure          Product Life Cycle          New Product Exploration11h00 Break11h15 New Product Planning           New Product Introduction12h45  Lunch13h30  The Electronics Supply Chain            Quality and Non-Quality Cost            Design-for-eXcellence of Electronics15h00 Break15h15  Printed Board Assembly (PBA) basics            Printed Circuit Board (PCB) basics16h45  Q&A – wrap-up17h00  End
URL:https://edmforum.eu/event/electronic-product-development-2/
CATEGORIES:Masterclass
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20200110T140000
DTEND;TZID=Europe/Brussels:20200110T173000
DTSTAMP:20260709T073034
CREATED:20231212T224139Z
LAST-MODIFIED:20240726T075229Z
UID:1886-1578664800-1578677400@edmforum.eu
SUMMARY:EDM Workshop 32: Towards an Improved Lifetime Prediction of Electronics
DESCRIPTION:In a growing market of complex intelligent products requiring a lifetime longer than consumer electronics (> 2 years)\, realising products “with predictable life time”under known loading conditions gives a competitive advantage to companies. \n\n\n\nEvaluating potential reliability risks and predicting the lifetime at the “design stage”gives a benefit in time-to-market and both engineering and product cost by mitigating quality and reliability risks in the design phase before prototype testing\, production and especially product deployment. \n\n\n\nThis workshop is the final event for the INPROVOL project\, a Vlaio funded collective research project with focus on developing tools\, guidelines and methodologies to support the industry in designing and manufacturing products with a better knowledge of its life time. Bart Vandevelde (imec) will present as project leader a summary of the main results of this project. \n\n\n\nRainer Dudek (Fraunhofer ENAS) will present unique results of a real-life thermal cycling test lasting already for more than eight years. His results allow to benchmark the different acceleration models (such as Norris-Landzberg) to the real test failure data. \n\n\n\nPiet Watté(Signify) will present how Signify\, previously known as Philips Lighting\, deals with engineering models to predict the lifetime for products such as LED drivers. \n\n\n\nWhere reliability is related to the lifetime under normal operating conditions\, the robustness of a product expresses the product’s capability of withstanding product life cycle conditions that go beyond normal\, as-designed conditions. Geert Willems (imec)\, will discuss how to augment the robustness of electronics and will introduce InProVoL’s Design-for-Robustness and Robustness Testing and Qualification guidelines. \n\n\n\nAgenda \n\n\n\n14h00Welcome14h10Reliability by design approach for life time prediction of electronic systems (INPROVOL project summary) Bart Vandevelde – imec14h40Challenging the acceleration factor models by a Long-Term life Testing on a soldered board assemblyRainer Dudek\, Fraunhofer ENAS15h10  Engineering model for the life prediction of LED drivers Piet Watté – Signify15h40Design-for-Robustness for electronicsGeert Willems – imec16h10Q&A\, networking and booth\n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Intro EDM Workshop 32\n                    \n                \n                \n                    \n                         1 file(s)  398.86 KB\n                    \n                    \n                        Download\n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n\n\nFor members only \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Reliability by Design Approach for Life Time Prediction of Electronic Systems\n                    \n                \n                \n                    \n                         1 file(s)  3.72 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Challenging the Acceleration Factor Models by a Long-Term Life Testing on a Soldered Board Assembly\n                    \n                \n                \n                    \n                         1 file(s)  2.97 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Engineering Model for the Life Prediction of LED Drivers\n                    \n                \n                \n                    \n                         1 file(s)  1.82 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Design-for-Robustness for Electronics\n                    \n                \n                \n                    \n                         1 file(s)  2.61 MB\n                    \n                    \n                        Login to download.
URL:https://edmforum.eu/event/cedm-workshop-32/
LOCATION:Imec Leuven\, Kapeldreef 75\, Leuven\, 3001\, Belgium
CATEGORIES:Workshop
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20191114T100000
DTEND;TZID=Europe/Brussels:20191114T110000
DTSTAMP:20260709T073034
CREATED:20231212T224244Z
LAST-MODIFIED:20240725T140038Z
UID:1942-1573725600-1573729200@edmforum.eu
SUMMARY:Webinar 2019-11-4: Safety Assurance of Autonomous Systems
DESCRIPTION:Presented by: Davy Pissoort – KU Leuven \n\n\n\nAutonomous systems offer humankind tremendous opportunities\, like freeing us from mundane tasks\, carrying out risky procedures and generally giving us more time to enjoy the things we like doing. As long as these systems are operating in a human-less environment\, like enclosed surroundings in a factory\, they are readily accepted. However\, people lack trust in autonomous systems if their own safety is dependent on a machine’s correct operation. Whenever someone mentions self-driving cars\, the question of safety is raised immediately. Even though the widespread introduction of autonomous vehicles would almost eliminate the more-than 20.000 deaths on European roads each year\, it will not happen until we can provide the assurance that these systems will be safe and perform as intended\, no matter what.Unfortunately\, existing safety assurance approaches and standards are developed primarily for systems where a human can take over in case of emergency and\, hence\, do not extend to fully autonomous systems. What’s more\, current safety assurance approaches generally assume that once the system is deployed\, it will not learn or evolve by itself. This ignores many of the new safety challenges that come along with autonomous systems: unsafe software behavior\, open-context nature\, functional insufficiencies\, human-machine interaction\, just to name a few.This talk will introduce the latest evolutions in the area of safety assurance of autonomous systems\, including: Safety of the Intended Function\, dynamic safety assurance\, safety monitors\, run-time safety cases\, etc. \n\n\n\n\n\nFor members only \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Safety Assurance of Autonomous Systems \n                    \n                \n                \n                    \n                         1 file(s)  4.69 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Safety Assurance of Autonomous Systems – video\n                    \n                \n                \n                    \n                         1 file(s)  33.93 MB\n                    \n                    \n                        Login to download.
URL:https://edmforum.eu/event/webinar-14safety-assurance-of-autonomous-systems/
CATEGORIES:Webinar
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20190621T130000
DTEND;TZID=Europe/Brussels:20190621T170000
DTSTAMP:20260709T073034
CREATED:20240729T082324Z
LAST-MODIFIED:20240729T082346Z
UID:5961-1561122000-1561136400@edmforum.eu
SUMMARY:PCB Technology Seminar and Factory Visit
DESCRIPTION:The “Smart” in “Smart Products” – whatever these products do – is based on electronics. Electronics is everywhere. This seminar provides basic insight in the technology and production processes of a key part of all electronics: the Printed Circuit Board that connects the electronic components in an electronic assembly. To understand the relationship between cost\, quality and reliability of electronics\, it is mandatory to have a basic understanding of the capabilities and the limitations of the PCB technology as well as the factors that drive cost and quality. This seminar provides a basic step towards this understanding. \n\n\n\nAgenda \n\n\n\n\nReception13h00 – Start 13h15\n\n\n\nWelcome at ACB by Joachim Verhegge (ACB)A short presentation of ACB.\n\n\n\nPCB technology basics by Joachim Verhegge (ACB)Introduction to PCB manufacturing technology discussing the basic materials and PCB manufacturing processes:lithography\, etching\, lamination\, drilling\, plating\, solder mask deposition\, finishing\, inspection. Theprocess sequence for multilayer PCB’s is explained.\n\n\n\nOverview of advanced PCB technology by Joachim Verhegge (ACB)Overview of advanced PCB technologies for high complexity\, high-density interconnect and flexible PCBs.\n\n\n\nFactory tourExtensive tour of ACB’s factory facilities.\n\n\n\nEnd: around 16h30
URL:https://edmforum.eu/event/pcb-technology-seminar-and-factory-visit-6/
LOCATION:ACB\, Vosmeer 3\, Dendermonde\, +3252202030\, 9200\, Belgium
CATEGORIES:Technology seminar
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20190613T140000
DTEND;TZID=Europe/Brussels:20190613T170000
DTSTAMP:20260709T073034
CREATED:20240712T161008Z
LAST-MODIFIED:20240726T075203Z
UID:3138-1560434400-1560445200@edmforum.eu
SUMMARY:EDM Workshop 31: Space Electronics for the 21st Century
DESCRIPTION:Quality and reliability are key elements of space electronics. Space agencies like ESA prefer flight-proven technologies in their spacecraft and require extensive equipment testing and qualification to guarantee reliability. Adhering to flight-proven technologies has drawbacks. A highly performing\, reliable solution without adaptation to the technological evolution does not remain performant nor reliable in the 21st century’s technological and operational context. This workshop will provide insight in the status of space electronics design and manufacturing for ESA spacecraft and on the steps to take to create better electronics for future ESA space missions. \n\n\n\nJussi Hokka of ESA will discuss the challenges and the impact that imposes the trend towards more complex and densely populated electronic assemblies\, the increasing operating temperature and the lead-ban on space electronics in the coming five to ten years. \n\n\n\nA highly integrated spacecraft control unit is crucial to succeed in the system design of small satellites with high autonomy as Proba-V. Steven De Cuyper of QinetiQ will explain the development and manufacturing of such electronics per ESA procedures and standards. \n\n\n\nCertain well-proven technologies required by these ESA standards put severe limits to the use of modern industrially well-proven technologies in space electronics. Geert Willems of imec will identify these limiting technologies\, their background and the alternatives that allow building lower weight\, better performing\, more reliable and more environmentally friendly space electronics at a lower cost. \n\n\n\nAssessing the environmental impact of space missions is taking a bigger role in mission development for ESA. Electronics is identified as one of the environmental hot spots in spacecrafts. An Vercalsteren of VITO will illustrate this as well as some eco-design alternatives based on the ESA GreenSat study using Proba-V as a reference case. \n\n\n\nMore complex and denser electronic assemblies require the use of PCB substrates that use microvia\, high aspect ratio core vias and small track widths and spacing.  Joachim Verhegge of ACB will discuss this High-Density Interconnect (HDI) demand and the balanced approach between capabilities and reliability required for space electronics \n\n\n\n\n\n\n14h00Welcome14h10ESA’s view on Space Electronics requirements and future needs.Jussi Hokka – ESA14h30 Electronics for earth orbit satellite missions: Proba-V Steven De Cuyper – QinetiQ15h00Improving Space Electronics: a review of opportunitiesGeert Willems – imec15h20Life Cycle Assessment and eco-design of the PROBA-V space mission focus on space electronicsAn Vercalsteren\, VITO15h40High-density Printed Circuit Boards for Space ElectronicsJoachim Verhegge\, ACB16h00Networking\n\n\n\n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Intro EDM Workshop 31\n                    \n                \n                \n                    \n                         1 file(s)  184.59 KB\n                    \n                    \n                        Download\n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n\n\nFor members only \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Electronics for Earth Orbit Satellite Missions: Proba-V\n                    \n                \n                \n                    \n                         1 file(s)  929.80 KB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Improving Space Electronics: A Review of Opportunities\n                    \n                \n                \n                    \n                         1 file(s)  2.07 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Life Cycle Assessment and Eco-design of the PROBA-V Space Mission\n                    \n                \n                \n                    \n                         1 file(s)  1.94 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        High-Density Printed Circuit Boards for Space Electronics\n                    \n                \n                \n                    \n                         1 file(s)  2.71 MB\n                    \n                    \n                        Login to download.
URL:https://edmforum.eu/event/edm-workshop-31-space-electronics-for-the-21st-century/
LOCATION:Imec Leuven\, Kapeldreef 75\, Leuven\, 3001\, Belgium
CATEGORIES:Workshop
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20190528T100000
DTEND;TZID=Europe/Brussels:20190528T110000
DTSTAMP:20260709T073034
CREATED:20231212T224244Z
LAST-MODIFIED:20240725T125228Z
UID:1941-1559037600-1559041200@edmforum.eu
SUMMARY:Webinar 2019-5-28: Reliabilty of Alternative Solder Materials - part 2
DESCRIPTION:Autonomous systems offer humankind tremendous opportunities\, like freeing us from mundane tasks\, carrying out risky procedures and generally giving us more time to enjoy the things we like doing. As long as these systems are operating in a human-less environment\, like enclosed surroundings in a factory\, they are readily accepted. However\, people lack trust in autonomous systems if their own safety is dependent on a machine’s correct operation. Whenever someone mentions self-driving cars\, the question of safety is raised immediately. Even though the widespread introduction of autonomous vehicles would almost eliminate the more-than 20.000 deaths on European roads each year\, it will not happen until we can provide the assurance that these systems will be safe and perform as intended\, no matter what.Unfortunately\, existing safety assurance approaches and standards are developed primarily for systems where a human can take over in case of emergency and\, hence\, do not extend to fully autonomous systems. What’s more\, current safety assurance approaches generally assume that once the system is deployed\, it will not learn or evolve by itself. This ignores many of the new safety challenges that come along with autonomous systems: unsafe software behavior\, open-context nature\, functional insufficiencies\, human-machine interaction\, just to name a few.This talk will introduce the latest evolutions in the area of safety assurance of autonomous systems\, including: Safety of the Intended Function\, dynamic safety assurance\, safety monitors\, run-time safety cases\, etc. \n\n\n\n\n\nFor members only \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Reliability of Alternative Solder Materials – part 2\n                    \n                \n                \n                    \n                         1 file(s)  1.91 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Reliability of Alternative Solder Materials – part 2 – video\n                    \n                \n                \n                    \n                         1 file(s)  32.75 MB\n                    \n                    \n                        Login to download.
URL:https://edmforum.eu/event/webinar-13reliabilty-of-alternative-solder-materials-part-2/
CATEGORIES:Webinar
END:VEVENT
END:VCALENDAR