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BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20230419T090000
DTEND;TZID=Europe/Brussels:20230419T170000
DTSTAMP:20260709T052119
CREATED:20241011T115921Z
LAST-MODIFIED:20241011T124316Z
UID:9089-1681894800-1681923600@edmforum.eu
SUMMARY:D&E Event 2023: Het ontwerpen van innovatieve elektronica
DESCRIPTION:D&E Event 2023\n\n\n\nTijdens het jaarlijkse Design Automation & Embedded Systems Event delen ontwikkelaars en toepassers van embedded systems (hardware én software) kennis van de laatste technologieën en wisselen zij visies en ervaringen uit met vakgenoten. In het lezingenprogramma wordt aandacht besteed aan specifieke thema’s. \n\n\n\nLive demonstraties op de beursvloer\n\n\n\nD&E is in een nieuw jasje gestoken met een frisse huisstijl\, een nieuwe locatie en live demonstraties. De demo’s zijn een waardevolle aanvulling op het programma en vinden de hele dag plaats naast de technisch inhoudelijke lezingen. Zo kan je zelf aan de slag gaan met nieuwe producten en met eigen ogen zien hoe alles werkt! \n\n\n\nLocatie: 1931 Congrescentrum\, ‘s-Hertogenbosch\, Nederland \n\n\n\n\n\nKeynote speakers\n\n\n\nDe lezingen worden dit jaar aangevuld met de bijdrage van een aantal uiterst waardevolle keynote speakers :Geert Willems (Imec België) : Milieuimpact van elektronica: Hoe bepalen we dit? … en hoe verminderen we het? \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Milieuimpact van elektronica: Hoe bepalen en hoe verminderen?\n                    \n                \n                \n                    \n                         1 file(s)  3 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\nArtikel Engineersonline.nl: “De impact van elektronica op het milieu is groot\, maar niemand weet hoé groot” \n\n\n\nDick van Hees (ASML en MRMc) & Ruud van Beek (ASML) : Early Involvement 2.0: Hoe maak ik een design first time right? \n\n\n\nProgramma
URL:https://edmforum.eu/event/de-event-2023-het-ontwerpen-van-innovatieve-elektronica/
CATEGORIES:Events with EDM contribution
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20230324T093000
DTEND;TZID=Europe/Brussels:20230324T170000
DTSTAMP:20260709T052119
CREATED:20231212T224143Z
LAST-MODIFIED:20240731T145821Z
UID:1889-1679650200-1679677200@edmforum.eu
SUMMARY:Electronic Assembly Technology
DESCRIPTION:The course treats the technology\, design and manufacturing of Printed Circuit Boards (PCB) and the assembly of components on the PCB to manufacture an Electronic Assembly or Printed Board Assembly (PBA). The PBA is the generic building block of electronic products and systems. The course also provides the basics of electronics’ quantified quality. It provides insight into the body-of-knowledge on which the DfX guidelines and tools of the EDM Forum are based. \n\n\n\nRequired background knowledgeNo specific background knowledge required. Some basic knowledge of electronics is helpful. \n\n\n\nCourse Objectives \n\n\n\n\nBasics of PCB Technology\, manufacturing and Design-for-Manufacturing\n\n\n\nBasics of PBA Technology\, assembly and Design-for-Assembly\n\n\n\nBasics of PBA quality\n\n\n\n\nWho should attendAll that may benefit from a basic knowledge of design\, manufacturing\, quality and reliability of electronic assemblies. \n\n\n\nLecturerGeert Willems\, PhD\, imec –  EDM Forum 
URL:https://edmforum.eu/event/electronic-assembly-technology-3/
LOCATION:imec Tower\, Remisebosweg 1\, Leuven\, 3001\, Belgium
CATEGORIES:Masterclass
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20230203T130000
DTEND;TZID=Europe/Brussels:20230203T150000
DTSTAMP:20260709T052119
CREATED:20231212T224228Z
LAST-MODIFIED:20240725T155058Z
UID:1928-1675429200-1675436400@edmforum.eu
SUMMARY:Webinar 2023-2-3: Successful Innovation With Smart Products and the IoT
DESCRIPTION:13h00Introduction13h10Smart products at Pattyn13h40Smart Product ExplorationSirris14h05Smart products at Ethernetics14h35A System Engineering Approach to Smart product Explorationimec14h55What’s next?\n\n\n\n\n\nFor members only \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Succesful Innovation with Smart Products and IoT\n                    \n                \n                \n                    \n                         1 file(s)  2.21 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n                \n            \n            \n                A System Engineering Approach to Smart Product Exploration\n                 1.70 MB  0 Downloads\n            \n        \n    \n     July 25\, 2024  Login to download.
URL:https://edmforum.eu/event/successful-innovation-with-smart-products-and-the-iot/
CATEGORIES:Webinar
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20221125T093000
DTEND;TZID=Europe/Brussels:20221125T170000
DTSTAMP:20260709T052119
CREATED:20231212T224156Z
LAST-MODIFIED:20240731T150315Z
UID:1900-1669368600-1669395600@edmforum.eu
SUMMARY:Master Class System Engineering
DESCRIPTION:This master class presents the System Engineering methodology developed by the International Counsel of System Engineers (INCOSE\, www.incose.org)\, consolidated in ISO/IEC/IEEE system and software engineering standards. We tailor and apply it to electronic products and smart systems with embedded electronics. We discuss in-depth the New Product Exploration (NPE)\, Planning (NPP) and Introduction (NPI) stages of system development that bring an electronic products from idea to the end user.The specific characteristics of the electronic supply chain and the associated smart product development challenges are presented. A development methodology capable to cope with these challenges is explained as well as the important role of Design-for-eXcellence. \n\n\n\nCourse objectives\n\n\n\n\nIntroduction to ISO/IEC/IEEE System and Software Engineering standards.\n\n\n\nInsight in product life-cycle stages and processes of electronics and smart systems.\n\n\n\nElements of an electronic product and  smart system development methodology.\n\n\n\nWhat capabilities does a smart system engineering organization needs and can we assess this?\n\n\n\n\nOff interest to:\n\n\n\nAll stakeholders in electronic product and smart system development. \n\n\n\nLecturer\n\n\n\nGeert Willems\, imec \n\n\n\nAgenda: 9h30 Basics of System Engineering           System Structure           System Life Cycle Processes           System Life Cycle Management           Technology versus system development11h00 Break11h15  State-of-the-art of the electronics industry              New Product Exploration              New Product Planning12h45 Lunch13h30 New Product Introduction             Electronics Technology qualification: “A white box approach”15h00 Break15h15 Electronics supply chain and quality            Capabilities of the System Engineering Organization16h45 Q&A – wrap-up
URL:https://edmforum.eu/event/master-class-system-engineering/
LOCATION:imec Tower\, Remisebosweg 1\, Leuven\, 3001\, Belgium
CATEGORIES:Masterclass
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20221104T133000
DTEND;TZID=Europe/Brussels:20221104T163000
DTSTAMP:20260709T052119
CREATED:20231212T224156Z
LAST-MODIFIED:20240726T075601Z
UID:1899-1667568600-1667579400@edmforum.eu
SUMMARY:EDM Workshop 34: Smart Product Exploration
DESCRIPTION:Intelligence and connectivity are essential properties of an increasing number of products in a wide range of applications. Making a product smart and connected opens possibilities but also raises questions: what do our customers really need? What value do we need to offer? How to reduce risks? What technology and expertise are needed? How to establish a successful business?In this workshop we introduce a system engineering based methodology to master the fuzzy front-end of smart product development which we call the New Product Exploration stage. In this stage the stakeholder’s needs and problems and their potential solutions are explored. It addresses key questions like: \n\n\n\n– How can we obtain a validated solution concept efficiently without cost and time budget overruns. \n\n\n\n– What expertise and capabilities do we need to develop\, produce and manage the life-cycle of the smart product solution? After a short introduction to system life-cycle stages and processes\, the New Product Exploration methodology is introduced based on the ISO/IEC/IEEE 15288 and 24784-1 system engineering. We discuss how the problems and needs of stakeholders can be explored and how a solution can be validated.In a second part we focus on the organization developing the system solution. What are the capabilities an organziation needs to have to be able to develop smart products and create a successful business with and/or around a smart product\, and what is the status of these capabilities? What is the status of our product development and its life-cycle management? We will present an organization and product maturity assessment tool. \n\n\n\nAgenda \n\n\n\n13h30A System Engineering Approach to Smart Product Exploration.Geert Willems – imec14h20System Engineering Based Smart Product Exploration.Thomas De Meester – imec15h30Networking and tool demonstration\n\n\n\n\n\nFor members only \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        A System Engineering Approach to Smart Product Exploration\n                    \n                \n                \n                    \n                         1 file(s)  6.93 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        System Engineering Based Smart Product Exploration\n                    \n                \n                \n                    \n                         1 file(s)  4.88 MB\n                    \n                    \n                        Login to download.
URL:https://edmforum.eu/event/34th-edm-workshop-smart-product-exploration/
LOCATION:Imec Leuven\, Kapeldreef 75\, Leuven\, 3001\, Belgium
CATEGORIES:Workshop
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20220614T150000
DTEND;TZID=Europe/Brussels:20220614T160000
DTSTAMP:20260709T052119
CREATED:20231212T224228Z
LAST-MODIFIED:20240725T150026Z
UID:1927-1655218800-1655222400@edmforum.eu
SUMMARY:Webinar 2022-6-17: Solution Space Exploration and validation
DESCRIPTION:This webinar series is an initiative of the COOCK project ‘Oriënteren en Beslissen in Slimme Product Exploratie’ funded by VLAIO. More information about this project can be found on the project page.Intelligence and connectivity are becoming essential product properties. Making a product smart and connected opens possibilities but also raises questions: How to be successful? How to reduce risks? How to keep focus? How to present your solution? What value does it offer? What technology and expertise are needed?This three part webinar series addresses the above questions and many more\, in a systematic way. Our approach is based on the System Engineering methodology developed by the INCOSE consortium of system engineering\, that is consolidated in the ISO/IEC/IEEE 15288 and ISO/IEC/IEEE 24748-1 standards. The goal is to minimize the “fuzziness” in the smart product exploration and validation.In this “Solution Space Exploration and Validation” we address the fuzzy front-end of product development which transforms first ideas of a (smart) product-based solution into a validated concept upon which a Product Requirements Document (PRD) can be based. The PRD forms the basis of the product’s architecture definition\, the first phase of the actual product development.  \n\n\n\n\n\n\n\n\n\n\n\nFor members only \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        A System Engineering Approach to Smart Product Exploration: System Analysis\, Verification and Validation\n                    \n                \n                \n                    \n                         1 file(s)  836.34 KB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Solution Space and Concept Validation\n                    \n                \n                \n                    \n                         1 file(s)  1.91 MB\n                    \n                    \n                        Login to download.
URL:https://edmforum.eu/event/solution-space-exploration-and-validation/
CATEGORIES:Webinar
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20220603T150000
DTEND;TZID=Europe/Brussels:20220603T160000
DTSTAMP:20260709T052119
CREATED:20231212T224228Z
LAST-MODIFIED:20240725T144041Z
UID:1926-1654268400-1654272000@edmforum.eu
SUMMARY:Webinar 2022-6-3: Problem Space and Stakeholder Needs Exploration
DESCRIPTION:This webinar series is an initiative of the COOCK project ‘Oriënteren en Beslissen in Slimme Product Exploratie’ funded by VLAIO. More information about this project can be found on the project page.Intelligence and connectivity are becoming essential product properties. Making a product smart and connected opens possibilities but also raises questions: How to be successful? How to reduce risks? How to keep focus? How to present your solution? What value does it offer? What technology and expertise are needed?This three part webinar series addresses the above questions and many more\, in a systematic way. Our approach is based on the System Engineering methodology developed by the INCOSE consortium of system engineering\, that is consolidated in the ISO/IEC/IEEE 15288 and ISO/IEC/IEEE 24748-1 standards. The goal is to minimize the “fuzziness” in the smart product exploration and validation.In this second webinar “Problem Space and Stakeholder Needs Exploration” we address the question how to explore\, understand and validate the needs of the stakeholders of the product to be developed\, as well as the problems or opportunities for which the new product needs offers an answer. The latter is called problem space research.  \n\n\n\n\n\n\n\n\n\n\n\nOnly for members \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        A System Engineering Approach to Smart Product Exploration: Business Analysis and Stakeholder  Needs & Requirements\n                    \n                \n                \n                    \n                         1 file(s)  1.17 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Problem Space and Stakeholder Needs Exploration\n                    \n                \n                \n                    \n                         1 file(s)  948.61 KB\n                    \n                    \n                        Login to download.
URL:https://edmforum.eu/event/problem-space-and-stakeholder-needs-exploration/
CATEGORIES:Webinar
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20220520T150000
DTEND;TZID=Europe/Brussels:20220520T160000
DTSTAMP:20260709T052119
CREATED:20231212T224225Z
LAST-MODIFIED:20240725T145355Z
UID:1925-1653058800-1653062400@edmforum.eu
SUMMARY:Webinar 2022-5-20: Introduction to Smart Product Exploration
DESCRIPTION:This webinar series is an initiative of the COOCK project ‘Oriënteren en Beslissen in Slimme Product Exploratie’ funded by VLAIO. More information about this project can be found on the project page.Intelligence and connectivity are becoming essential product properties. Making a product smart and connected opens possibilities but also raises questions: How to be successful? How to reduce risks? How to keep focus? How to present your solution? What value does it offer? What technology and expertise are needed?This three part webinar series addresses the above questions and many more\, in a systematic way. Our approach is based on the System Engineering methodology developed by the INCOSE consortium of system engineering\, that is consolidated in the ISO/IEC/IEEE 15288 and ISO/IEC/IEEE 24748-1 standards. The goal is to minimize the “fuzziness” in the smart product exploration and validation.In the first webinar (20/5/2022 – 3pm) “Introduction to (smart) Product Exploration” imec introduces its “Smart Product Maturity Scan” tool. We will show how this tool can support your company in exploring smart product opportunities and risks\, and to assess the in-house capabilities and those of the supply chain. \n\n\n\n\n\n\n\n\n\n\n\nFor members only \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        A System Engneering Approach to Smart Product Exploration\n                    \n                \n                \n                    \n                         1 file(s)  1.86 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Introduction to Smart Product Exploration\n                    \n                \n                \n                    \n                         1 file(s)  932.56 KB\n                    \n                    \n                        Login to download.
URL:https://edmforum.eu/event/introduction-to-smart-product-exploration/
CATEGORIES:Webinar
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20220207T130000
DTEND;TZID=Europe/Brussels:20220207T150000
DTSTAMP:20260709T052119
CREATED:20231212T224225Z
LAST-MODIFIED:20240725T153730Z
UID:1924-1644238800-1644246000@edmforum.eu
SUMMARY:Webinar 2022-2-7: Successfully making your products smarter
DESCRIPTION:13h00Value creation13h10Smart products at AVR13h40Smart product explorationSirris14h05Smart products at Mealhero14h35Smart product explorationimec14h55What’s next?\n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Succesfully Making Your Products Smarter\n                    \n                \n                \n                    \n                         1 file(s)  32.00 KB\n                    \n                    \n                        Login to download.
URL:https://edmforum.eu/event/successfully-making-your-products-smarter/
CATEGORIES:Webinar
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20210623T140000
DTEND;TZID=Europe/Brussels:20210623T150000
DTSTAMP:20260709T052119
CREATED:20231212T224225Z
LAST-MODIFIED:20240726T075531Z
UID:1921-1624456800-1624460400@edmforum.eu
SUMMARY:Webinar 2021-6-23: Mastering (smart) Product Exploration
DESCRIPTION:Does your company aspire to innovate with smart products?Or are you already in the process of exploring the creation of a smart\, connected product? In this webinar\, imec introduces the tools we have developed to support your company in developing a smart product. The tools elaborate on domains and expertise key for smart product development. The webinar is relevant for anyone witha role in product development and product life-cycle management (R&D\, business leaders\, product project managers…) \n\n\n\n\n\nFor members only \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Mastering (smart) Product Exploration\n                    \n                \n                \n                    \n                         1 file(s)  1.69 MB\n                    \n                    \n                        Login to download.
URL:https://edmforum.eu/event/mastering-smart-product/
CATEGORIES:Webinar
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20210518T140000
DTEND;TZID=Europe/Brussels:20210518T160000
DTSTAMP:20260709T052119
CREATED:20240712T132011Z
LAST-MODIFIED:20240726T075436Z
UID:3107-1621346400-1621353600@edmforum.eu
SUMMARY:EDM Workshop 33: Electronics Cooling and Interconnect Technologies for Vehicle Computers
DESCRIPTION:High-Performance CPU/GPU processors are required for self-driving cars to perform vision processing\, object recognition and interaction with intelligent traffic systems in real-time and reliable for 15 years. \n\n\n\nA consortium of Belgian\, Dutch and German companies and research organisations with expertise along the entire automotive value chain\, intends to meet the challenges to develop high performance electronic systems that can withstand the harsh vehicle conditions. This is realised through innovations in integrated circuit design\, manufacturing and packaging to create automotive grade solutions in three key areas: computation\, communication and integration. \n\n\n\nThe three Flemish partners (Materialise\, Interflux Electronics & imec) provides advanced and reliable liquid cooling solutions to enable the required high heat dissipation (300W). Additionally\, the solderability of very large BGA processor components is improved with the introduction of low melting point soldering technology. These key innovations will be presented in this virtual workshop. \n\n\n\nAgenda \n\n\n\n14h00HIPER: Introduction to colklaborative research project on High Performance Vehicle Provcessors.Bart Vandevelde – imec14h20Advanced 3D printing solutions for advanced processor coolingPart A: 3D printing technology      Willem Verleysen – MaterialisePart B: Simulation and characterisation of cooling performance of 3D printed heat sinks            Majid Nazemi – Materialise and Antonio Pappaterra – imec15h10Low melting point solder technology for advanced processor componentsRalph Lauwaert – Interflux Electronics15h40Q&A\n\n\n\nOnline workshop \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Intro EDM Workshop 33\n                    \n                \n                \n                    \n                         1 file(s)  340.25 KB\n                    \n                    \n                        Download\n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n\n\nFor members only \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        HIPER: Introduction to Research Project on High Performance Vehicle Processors\n                    \n                \n                \n                    \n                         1 file(s)  1 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Advanced 3D Printing Solutions for Advanced Processor Cooling: 3D Printing Technology\n                    \n                \n                \n                    \n                         1 file(s)  6 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Simulation and Characterisation of Cooling Performance of 3D Printed Heat Sinks\n                    \n                \n                \n                    \n                         1 file(s)  4 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Low Melting Point Solder Technology for Advanced Processor Components\n                    \n                \n                \n                    \n                         1 file(s)  3 MB\n                    \n                    \n                        Login to download.
URL:https://edmforum.eu/event/edm-workshop-34-electronics-cooling-and-interconnect-technologies-for-vehicle-computers/
CATEGORIES:Workshop
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20210125T130000
DTEND;TZID=Europe/Brussels:20210125T154500
DTSTAMP:20260709T052119
CREATED:20231212T224225Z
LAST-MODIFIED:20240725T152413Z
UID:1922-1611579600-1611589500@edmforum.eu
SUMMARY:Webinar 2021-1-25: Accelerate and Strengthen Your Idea for a Smart Product
DESCRIPTION:Agenda \n\n\n\n13h00Introduction13h10How do companies approach their smart product innovation?Witnesses: Gilbos and Shayp14h20Smart Product ExplorationThomas De Meester – imec14h40Tools for orientation and decision making  Smart Product Scenarios – Ludwig De Locht – Sirris  Fit with market – Nick Boucart – Sirris  Smart product maturity – Thomas De Meester – imec  Follow-up tools – Geert Willems – imec  Proof-of-Concepts – Thomas De Meester – imec15h25What’s next for your company?Pieter Beyl – Sirris\n\n\n\n\n\nFor members only \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Accelerate and Strengthen Your Idea for a Smart Product\n                    \n                \n                \n                    \n                         1 file(s)  3.35 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Smart Product Development at Gilbos\n                    \n                \n                \n                    \n                         1 file(s)  770.09 KB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Smart Product Development at Shayp\n                    \n                \n                \n                    \n                         1 file(s)  6.09 MB\n                    \n                    \n                        Login to download.
URL:https://edmforum.eu/event/mastering-smart-product-2/
CATEGORIES:Webinar
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20201029T093000
DTEND;TZID=Europe/Brussels:20201029T170000
DTSTAMP:20260709T052119
CREATED:20231212T224143Z
LAST-MODIFIED:20240731T150710Z
UID:1890-1603963800-1603990800@edmforum.eu
SUMMARY:Electronic Product Development
DESCRIPTION:Due to the on-going Corona pandemic no live participation by non-imec employees to training sessions and seminars at imec is allowed. Online participation is possible through live streaming and MS Teams interaction session. \n\n\n\nAbout the course:The course discusses the New Product Exploration (NPE)\, Planning (NPP) and Introduction (NPI) development stages that bring an electronic product from idea to the end user. The relationship with the product life cycle stages and life cycle processes defined per ISO/IEC/IEEE System and Software Engineering standards is explained.  The specific characteristics of the electronic supply chain and the associated smart product development challenges are presented. A development methodology capable to cope with these challenges is explained as well as the important role of Design-for-eXcellence.A short introduction to Printed Circuit Board technology\, manufacturing and assembly closes the session. \n\n\n\nCourse objectives:– Insight in product development stages and processes of electronics.– Get to know the challenges of electronics development and the electronics supply chain.– Introduction to ISO/IEC/IEEE System and Software Engineering standards.– Elements of a Smart Product Development methodology.– What is Design-for-eXcellence and why is it important. \n\n\n\nOf interest to:All stakeholders in electronic product development. \n\n\n\nLecturer: Geert Willems\, Ph.D.\, imecPresentation: video streamingInteraction: MS Teams parallel sessionimec employees can participate on-site (max. 20) \n\n\n\nAgenda: 9h30  Electronic System Structure          Product Life Cycle          New Product Exploration11h00 Break11h15 New Product Planning           New Product Introduction12h45  Lunch13h30  The Electronics Supply Chain            Quality and Non-Quality Cost            Design-for-eXcellence of Electronics15h00 Break15h15  Printed Board Assembly (PBA) basics            Printed Circuit Board (PCB) basics16h45  Q&A – wrap-up17h00  End
URL:https://edmforum.eu/event/electronic-product-development-2/
CATEGORIES:Masterclass
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20200110T140000
DTEND;TZID=Europe/Brussels:20200110T173000
DTSTAMP:20260709T052119
CREATED:20231212T224139Z
LAST-MODIFIED:20240726T075229Z
UID:1886-1578664800-1578677400@edmforum.eu
SUMMARY:EDM Workshop 32: Towards an Improved Lifetime Prediction of Electronics
DESCRIPTION:In a growing market of complex intelligent products requiring a lifetime longer than consumer electronics (> 2 years)\, realising products “with predictable life time”under known loading conditions gives a competitive advantage to companies. \n\n\n\nEvaluating potential reliability risks and predicting the lifetime at the “design stage”gives a benefit in time-to-market and both engineering and product cost by mitigating quality and reliability risks in the design phase before prototype testing\, production and especially product deployment. \n\n\n\nThis workshop is the final event for the INPROVOL project\, a Vlaio funded collective research project with focus on developing tools\, guidelines and methodologies to support the industry in designing and manufacturing products with a better knowledge of its life time. Bart Vandevelde (imec) will present as project leader a summary of the main results of this project. \n\n\n\nRainer Dudek (Fraunhofer ENAS) will present unique results of a real-life thermal cycling test lasting already for more than eight years. His results allow to benchmark the different acceleration models (such as Norris-Landzberg) to the real test failure data. \n\n\n\nPiet Watté(Signify) will present how Signify\, previously known as Philips Lighting\, deals with engineering models to predict the lifetime for products such as LED drivers. \n\n\n\nWhere reliability is related to the lifetime under normal operating conditions\, the robustness of a product expresses the product’s capability of withstanding product life cycle conditions that go beyond normal\, as-designed conditions. Geert Willems (imec)\, will discuss how to augment the robustness of electronics and will introduce InProVoL’s Design-for-Robustness and Robustness Testing and Qualification guidelines. \n\n\n\nAgenda \n\n\n\n14h00Welcome14h10Reliability by design approach for life time prediction of electronic systems (INPROVOL project summary) Bart Vandevelde – imec14h40Challenging the acceleration factor models by a Long-Term life Testing on a soldered board assemblyRainer Dudek\, Fraunhofer ENAS15h10  Engineering model for the life prediction of LED drivers Piet Watté – Signify15h40Design-for-Robustness for electronicsGeert Willems – imec16h10Q&A\, networking and booth\n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Intro EDM Workshop 32\n                    \n                \n                \n                    \n                         1 file(s)  398.86 KB\n                    \n                    \n                        Download\n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n\n\nFor members only \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Reliability by Design Approach for Life Time Prediction of Electronic Systems\n                    \n                \n                \n                    \n                         1 file(s)  3.72 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Challenging the Acceleration Factor Models by a Long-Term Life Testing on a Soldered Board Assembly\n                    \n                \n                \n                    \n                         1 file(s)  2.97 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Engineering Model for the Life Prediction of LED Drivers\n                    \n                \n                \n                    \n                         1 file(s)  1.82 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Design-for-Robustness for Electronics\n                    \n                \n                \n                    \n                         1 file(s)  2.61 MB\n                    \n                    \n                        Login to download.
URL:https://edmforum.eu/event/cedm-workshop-32/
LOCATION:Imec Leuven\, Kapeldreef 75\, Leuven\, 3001\, Belgium
CATEGORIES:Workshop
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20191114T100000
DTEND;TZID=Europe/Brussels:20191114T110000
DTSTAMP:20260709T052119
CREATED:20231212T224244Z
LAST-MODIFIED:20240725T140038Z
UID:1942-1573725600-1573729200@edmforum.eu
SUMMARY:Webinar 2019-11-4: Safety Assurance of Autonomous Systems
DESCRIPTION:Presented by: Davy Pissoort – KU Leuven \n\n\n\nAutonomous systems offer humankind tremendous opportunities\, like freeing us from mundane tasks\, carrying out risky procedures and generally giving us more time to enjoy the things we like doing. As long as these systems are operating in a human-less environment\, like enclosed surroundings in a factory\, they are readily accepted. However\, people lack trust in autonomous systems if their own safety is dependent on a machine’s correct operation. Whenever someone mentions self-driving cars\, the question of safety is raised immediately. Even though the widespread introduction of autonomous vehicles would almost eliminate the more-than 20.000 deaths on European roads each year\, it will not happen until we can provide the assurance that these systems will be safe and perform as intended\, no matter what.Unfortunately\, existing safety assurance approaches and standards are developed primarily for systems where a human can take over in case of emergency and\, hence\, do not extend to fully autonomous systems. What’s more\, current safety assurance approaches generally assume that once the system is deployed\, it will not learn or evolve by itself. This ignores many of the new safety challenges that come along with autonomous systems: unsafe software behavior\, open-context nature\, functional insufficiencies\, human-machine interaction\, just to name a few.This talk will introduce the latest evolutions in the area of safety assurance of autonomous systems\, including: Safety of the Intended Function\, dynamic safety assurance\, safety monitors\, run-time safety cases\, etc. \n\n\n\n\n\nFor members only \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Safety Assurance of Autonomous Systems \n                    \n                \n                \n                    \n                         1 file(s)  4.69 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Safety Assurance of Autonomous Systems – video\n                    \n                \n                \n                    \n                         1 file(s)  33.93 MB\n                    \n                    \n                        Login to download.
URL:https://edmforum.eu/event/webinar-14safety-assurance-of-autonomous-systems/
CATEGORIES:Webinar
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20190621T130000
DTEND;TZID=Europe/Brussels:20190621T170000
DTSTAMP:20260709T052119
CREATED:20240729T082324Z
LAST-MODIFIED:20240729T082346Z
UID:5961-1561122000-1561136400@edmforum.eu
SUMMARY:PCB Technology Seminar and Factory Visit
DESCRIPTION:The “Smart” in “Smart Products” – whatever these products do – is based on electronics. Electronics is everywhere. This seminar provides basic insight in the technology and production processes of a key part of all electronics: the Printed Circuit Board that connects the electronic components in an electronic assembly. To understand the relationship between cost\, quality and reliability of electronics\, it is mandatory to have a basic understanding of the capabilities and the limitations of the PCB technology as well as the factors that drive cost and quality. This seminar provides a basic step towards this understanding. \n\n\n\nAgenda \n\n\n\n\nReception13h00 – Start 13h15\n\n\n\nWelcome at ACB by Joachim Verhegge (ACB)A short presentation of ACB.\n\n\n\nPCB technology basics by Joachim Verhegge (ACB)Introduction to PCB manufacturing technology discussing the basic materials and PCB manufacturing processes:lithography\, etching\, lamination\, drilling\, plating\, solder mask deposition\, finishing\, inspection. Theprocess sequence for multilayer PCB’s is explained.\n\n\n\nOverview of advanced PCB technology by Joachim Verhegge (ACB)Overview of advanced PCB technologies for high complexity\, high-density interconnect and flexible PCBs.\n\n\n\nFactory tourExtensive tour of ACB’s factory facilities.\n\n\n\nEnd: around 16h30
URL:https://edmforum.eu/event/pcb-technology-seminar-and-factory-visit-6/
LOCATION:ACB\, Vosmeer 3\, Dendermonde\, +3252202030\, 9200\, Belgium
CATEGORIES:Technology seminar
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20190613T140000
DTEND;TZID=Europe/Brussels:20190613T170000
DTSTAMP:20260709T052119
CREATED:20240712T161008Z
LAST-MODIFIED:20240726T075203Z
UID:3138-1560434400-1560445200@edmforum.eu
SUMMARY:EDM Workshop 31: Space Electronics for the 21st Century
DESCRIPTION:Quality and reliability are key elements of space electronics. Space agencies like ESA prefer flight-proven technologies in their spacecraft and require extensive equipment testing and qualification to guarantee reliability. Adhering to flight-proven technologies has drawbacks. A highly performing\, reliable solution without adaptation to the technological evolution does not remain performant nor reliable in the 21st century’s technological and operational context. This workshop will provide insight in the status of space electronics design and manufacturing for ESA spacecraft and on the steps to take to create better electronics for future ESA space missions. \n\n\n\nJussi Hokka of ESA will discuss the challenges and the impact that imposes the trend towards more complex and densely populated electronic assemblies\, the increasing operating temperature and the lead-ban on space electronics in the coming five to ten years. \n\n\n\nA highly integrated spacecraft control unit is crucial to succeed in the system design of small satellites with high autonomy as Proba-V. Steven De Cuyper of QinetiQ will explain the development and manufacturing of such electronics per ESA procedures and standards. \n\n\n\nCertain well-proven technologies required by these ESA standards put severe limits to the use of modern industrially well-proven technologies in space electronics. Geert Willems of imec will identify these limiting technologies\, their background and the alternatives that allow building lower weight\, better performing\, more reliable and more environmentally friendly space electronics at a lower cost. \n\n\n\nAssessing the environmental impact of space missions is taking a bigger role in mission development for ESA. Electronics is identified as one of the environmental hot spots in spacecrafts. An Vercalsteren of VITO will illustrate this as well as some eco-design alternatives based on the ESA GreenSat study using Proba-V as a reference case. \n\n\n\nMore complex and denser electronic assemblies require the use of PCB substrates that use microvia\, high aspect ratio core vias and small track widths and spacing.  Joachim Verhegge of ACB will discuss this High-Density Interconnect (HDI) demand and the balanced approach between capabilities and reliability required for space electronics \n\n\n\n\n\n\n14h00Welcome14h10ESA’s view on Space Electronics requirements and future needs.Jussi Hokka – ESA14h30 Electronics for earth orbit satellite missions: Proba-V Steven De Cuyper – QinetiQ15h00Improving Space Electronics: a review of opportunitiesGeert Willems – imec15h20Life Cycle Assessment and eco-design of the PROBA-V space mission focus on space electronicsAn Vercalsteren\, VITO15h40High-density Printed Circuit Boards for Space ElectronicsJoachim Verhegge\, ACB16h00Networking\n\n\n\n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Intro EDM Workshop 31\n                    \n                \n                \n                    \n                         1 file(s)  184.59 KB\n                    \n                    \n                        Download\n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n\n\nFor members only \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Electronics for Earth Orbit Satellite Missions: Proba-V\n                    \n                \n                \n                    \n                         1 file(s)  929.80 KB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Improving Space Electronics: A Review of Opportunities\n                    \n                \n                \n                    \n                         1 file(s)  2.07 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Life Cycle Assessment and Eco-design of the PROBA-V Space Mission\n                    \n                \n                \n                    \n                         1 file(s)  1.94 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        High-Density Printed Circuit Boards for Space Electronics\n                    \n                \n                \n                    \n                         1 file(s)  2.71 MB\n                    \n                    \n                        Login to download.
URL:https://edmforum.eu/event/edm-workshop-31-space-electronics-for-the-21st-century/
LOCATION:Imec Leuven\, Kapeldreef 75\, Leuven\, 3001\, Belgium
CATEGORIES:Workshop
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20190528T100000
DTEND;TZID=Europe/Brussels:20190528T110000
DTSTAMP:20260709T052119
CREATED:20231212T224244Z
LAST-MODIFIED:20240725T125228Z
UID:1941-1559037600-1559041200@edmforum.eu
SUMMARY:Webinar 2019-5-28: Reliabilty of Alternative Solder Materials - part 2
DESCRIPTION:Autonomous systems offer humankind tremendous opportunities\, like freeing us from mundane tasks\, carrying out risky procedures and generally giving us more time to enjoy the things we like doing. As long as these systems are operating in a human-less environment\, like enclosed surroundings in a factory\, they are readily accepted. However\, people lack trust in autonomous systems if their own safety is dependent on a machine’s correct operation. Whenever someone mentions self-driving cars\, the question of safety is raised immediately. Even though the widespread introduction of autonomous vehicles would almost eliminate the more-than 20.000 deaths on European roads each year\, it will not happen until we can provide the assurance that these systems will be safe and perform as intended\, no matter what.Unfortunately\, existing safety assurance approaches and standards are developed primarily for systems where a human can take over in case of emergency and\, hence\, do not extend to fully autonomous systems. What’s more\, current safety assurance approaches generally assume that once the system is deployed\, it will not learn or evolve by itself. This ignores many of the new safety challenges that come along with autonomous systems: unsafe software behavior\, open-context nature\, functional insufficiencies\, human-machine interaction\, just to name a few.This talk will introduce the latest evolutions in the area of safety assurance of autonomous systems\, including: Safety of the Intended Function\, dynamic safety assurance\, safety monitors\, run-time safety cases\, etc. \n\n\n\n\n\nFor members only \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Reliability of Alternative Solder Materials – part 2\n                    \n                \n                \n                    \n                         1 file(s)  1.91 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Reliability of Alternative Solder Materials – part 2 – video\n                    \n                \n                \n                    \n                         1 file(s)  32.75 MB\n                    \n                    \n                        Login to download.
URL:https://edmforum.eu/event/webinar-13reliabilty-of-alternative-solder-materials-part-2/
CATEGORIES:Webinar
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20190321T140000
DTEND;TZID=Europe/Brussels:20190321T190000
DTSTAMP:20260709T052119
CREATED:20241011T101118Z
LAST-MODIFIED:20241011T101147Z
UID:9078-1553176800-1553194800@edmforum.eu
SUMMARY:IMAPS Benelux Spring Event 2019: Electronic packaging for Green Applications
DESCRIPTION:Through regular events and programs\, IMAPS chapters serve as local networks that allow microelectronics professionals to build business relationships\, share industry information\, and find technical solutions. IMAPS chapters organize and sponsor symposia/conferences\, vendor’s days\, technical presentations\, and social events. \n\n\n\nAgenda: 14:00 Registration\, coffee\, exhibition14:30 Green encapsulants … a continuous trend in electronics (Jochen Schuermans\, Roartis)15:00 Low temperature solder interconnect for solar cells (Dr. N. van Veen\, Mat-Tech BV)15:30 Silicones for a Greener World (Herman Meynen\, DowDuPont Specialty Products)16:00 Coffee\, exhibition + opportunity to visit the imec / Energyville labs17:00 Latest materials and technologies in cSi (crystalline Silicon) and TFPV (thin film photo-voltaic) module packaging (Aranzazu Aguirre\, Energyville-imec)17:30 Current sensors for an electrified present and future (Tim Vangerven\, Melexis Technologies)18:00 Sandwiches19:00 Closing \n\n\n\n\n\nLocation : Energyville 1\, Thor Park 8310\, 3600 Genk \n\n\n\nParticipation fee: IMAPS member (Benelux or international): 50 €Non member: 120 €Student: 20 €Student with poster: 0 €
URL:https://edmforum.eu/event/imaps-benelux-spring-event-2019-electronic-packaging-for-green-applications/
CATEGORIES:Partner Events
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20190318T000000
DTEND;TZID=Europe/Brussels:20190322T235959
DTSTAMP:20260709T052119
CREATED:20241011T100351Z
LAST-MODIFIED:20241011T100411Z
UID:9075-1552867200-1553299199@edmforum.eu
SUMMARY:KULeuven course: Introduction to System Safety
DESCRIPTION:A five-day primer in system safety engineeringThe Introduction to System Safety course is a five-day primer in system safety engineering. The course contains a mix of lectures\, discussions and small group exercises\, supported by international examples. Whilst the course touches on broader issues in theorizing risk and managing safety within organisations\, its main focus is to equip safety practitioners with the practical understanding necessary to engage with safety activities. The course is organized in collaboration with the University of York and is based on material of their MSc of Science in Safety Critical Systems Engineering program. \n\n\n\n\n\nThe course is structured according to the engineering lifecycle of a service or physical system\, and covers: \n\n\n\n\nConcepts and terminology for safety;\n\n\n\nOverview of the engineering lifecycle from a safety perspective\, including the role and intent of key safety activities;\n\n\n\nHazard identification and setting of safety requirements;\n\n\n\nTechniques for safety analysis to support design\, including:\n\nFailure Modes and Effects Analysis (FMEA);\n\n\n\nFunctional Failure Analysis (FFA);\n\n\n\nHazard and Operability Studies (HAZOP);\n\n\n\nFault Tree Analysis (FTA).\n\n\n\n\n\nSafety cases\, including notations for recording arguments and evidence;\n\n\n\nSpecific issues in safety analysis\, including\, Human Factors\, Software and Data Safety.\n\n\n\n\nPRESENTERSThe course is a University of York course and will be presented by dr. Oleg Lisagor and dr. Christian FairburnIn addition\, expertise from Prof. Jeroen Boydens and Prof. Davy Pissoort from KU Leuven will be added to the course. \n\n\n\nDr. Oleg LisagorDr. Lisagor is a lecturer at the High Integrity Systems Engineering group at the Dept. of Computer Science of the University of York and a Head of one of University’s Colleges. His research interest is Model-based Safety Assessment of complex\, large-scale and software-intensive systems. He has collaborated in and lead work packages of several collaborative research projects such as MISSA\, ISAAC\, Aribus DepNet and OPENCOSS. Dr. Lisagor’s past research collaborators include Airbus\, Alenia Aeronautica\, Dassault Aviation\, Thales\, ONERA and FBK. More information can be found here: Curriculum Vitae \n\n\n\nDr. Christian FairburnDr. Fairburn is the Director of Reliable Interaction Ltd\, a specialist in Human Factors and Ergonomics\, and a part time lecturer at the High Intergrity Systems Engineering group at the Dept. of Computer Science of the University of York. He has worked in the areas of Air Traffic Control \, cockpit controls and displays\, mixed reality (Live/Virtual/Constructive) training systems\, autonomous vehicles\, civil security\, and many more. Dr. Fairburn has qualifications in both Psychology and Computer Science and maintains active connections with leading academics in these areas. More information can be found at his LinkedIn profile. \n\n\n\nProf. Jeroen BoydensProf. Boydens is the head of the Software Coding division of the Mechatronics Group at the Dept. of Computer Science of the University of KU Leuven. His current research focuses on Software-implemented Reliability in a context of Functional Safety. He coordinates and collaborates in several national and international research projects\, such as MSCA ETN SAS\, MSCA ETN PETER\, MSCA ETN PETER\, and IWT TeTra RELIM. Prof. Boydens’ research collaborations include CNHIndustrial\, Barco\, Melexis\, DANA and Televic. \n\n\n\nProf. Davy PissoortProf. Pissoort is the head of the FMEC division (focusing on Electrical and Electronic Systems) of the Mechatronics Group at the Dept. of Electrical Engineering of KU Leuven. His current research focuses on electromagnetic compatibility\, hardware dependability and functional safety. He coordinates and collaborates in several national and international research projects\, such as MSCA ETN SAS\, MSCA ETN PETER\, CORNET EEWISE\, CORNET RESSIAR\, VIS-INPROVOL. Prof. Pissoort’s reach collaborations comprise companies as\, amongst others\, Valeo\, Bosch\, Horiba-Mira\, Barco\, Melexis\, ONSemiconductor\, Schlegel Electronic Materials\, etc. \n\n\n\nLocation: Crown Plazza Brugge\, Burg 10\, 8000 Brugge \n\n\n\nParticipation fee: € 4000 (excl. VAT)This price also includes:– 4 overnight stays in a standard room at the crown plaza on monday\, tuesday\, wednesday and thursday evening. Including breakfast on the next day.– Coffee breaks and lunch for each day of the courseNon-cummulative discounts are granted to:– User group members of the projects RESSIAR/TransSIMS and EEWISE/EWISE [10% discount]– Two or more members from the same company [15% discount]
URL:https://edmforum.eu/event/kuleuven-course-introduction-to-system-safety/
CATEGORIES:Partner Events
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20190312T130000
DTEND;TZID=Europe/Brussels:20190312T180000
DTSTAMP:20260709T052119
CREATED:20231212T223655Z
LAST-MODIFIED:20240729T083220Z
UID:1798-1552395600-1552413600@edmforum.eu
SUMMARY:PBA Reliability Seminar
DESCRIPTION:Internet-of-Things\, Electronics Everywhere\, self-driving cars\, body-area-networks monitoring your health\, etc. : ever increasing electronics complexity means more opportunities to fail and\, therefore\, intrinsically a reduced reliability.During this seminar\, Geert Willems of imec-cEDM will explain the “bathtub curve”\, take you through failure mechanisms in electronics and show you why and how Physics-of-Failure is becoming the cornerstone of modern reliability engineering.Content: \n\n\n\n\nFailure Probability/Reliability functions: “the bathtub curve”– Early failure – constant failure rate – wear-out – meaning of MTTF – Weibull– Constant failure rate modeling and why it is not suited for modern electronics.– EDM-D-100: Failure opportunities and the reliability function R(T) of a PBA\n\n\n\nBasics of Physics-of-Failure– The failure mechanism – the stress level – from stress to lifetime– Accelerated testing: Norris-Landzberg et al. and why this is not Physics-of-Failure.– Physics-of-Failure based testing\n\n\n\nDominant interconnection failure mechanisms in electronics– Solder joint failure– PCB via failure– Insulation failure: SIR – creep corrosion – (CAF – Sn-whiskers)\n\n\n\n\nAgenda:  \n\n\n\n12:45 Registration13:15 Welcome by Barco (Dora Deboeure)13:30 Basics in Electronics Reliability (Geert Willems\, imec & cEDM)15:00 Coffee break15:30 Tour in Reliability lab of Barco\, Kortrijk16:00 Experience tour Barco17:00 Networking drink at the Revo Bar
URL:https://edmforum.eu/event/pba-reliability-seminar/
LOCATION:Barco NV Beneluxpark 21\, Beneluxpark 21\, Kortrijk\, 8500\, Belgium
CATEGORIES:Technology seminar
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20190221T090000
DTEND;TZID=Europe/Brussels:20190222T170000
DTSTAMP:20260709T052119
CREATED:20241011T095247Z
LAST-MODIFIED:20241011T133424Z
UID:9072-1550739600-1550854800@edmforum.eu
SUMMARY:KULeuven course: Good EMC Engineering Practices for Large Machines\, Systems and Installations
DESCRIPTION:Learn how to avoid electromagnetic interactions that cause delays and increase costOn Thursday Feb 21 and Friday Feb 22 2019\, the M-Group and lab FMEC organizes a two day seminar on good EMC engineering practices for large machines\, systems and installations. \n\n\n\n\n\nMI is rapidly increasing in modern industry due to the increasing use of\, amongst others\, high-efficiency switching power conversion in DC power supplies\, motor drives\, HVAC and lighting. Despites this increasing EMI\, the reliability of machines\, systems and installations should be continuously ensured over their full operation life. Trends towards smart machines\, Industry 4.0 and Internet-of-Things comprise more wireless sensor networks\, continuously increasing clock frequencies\, higher complexity and integration\, lower voltage levels and noise margins\, etc. As a result\, achieving EMC for machines\, systems and installations is getting more challenging every day. This training course provides all the necessary information and many practical techniques for achieving in the most cost-effective way EMC for today’s and tomorrow’s smart machines\, systems and installations.This course is organized within the framework of the following Technology Transfer projects:– CORNET RESSIAR / TETRA TRANSSIMS “Requirements for Smart Sensor Systems for IoT-Applications in Retrofit Equipment “– CORNET EEWISE / TETRA EWISE “EMC for Emergent Wireless Systems” \n\n\n\nKey-Note speaker:Key-note speaker of this seminar is Keith Armstrong (UK). Keith has written many practical papers and books on design for EMC and EMC debugging. Much of his working life involves solving real-life EMC problems in high-technology products\, systems\, and installations\, for a variety of companies and organisations in a wide range of industries. Keith has always aimed to make products easy to design and manufacture\, work properly\, please their users\, and make money for their manufacturers. \n\n\n\nContents:A. CE + CE does not = CE! What to do instead\, for EMC.B. Complying with Ed.3 of the EMC Directive: 2014/30/EU: Requirements for Fixed Installations\, and the items (equipment\, subsystems\, systems\, etc.) they are made from. \n\n\n\nIntroductionEMC Directive; IEE wiring regulations; overall EMC control procedure \n\n\n\nGood EMC Practices for general useBuying electronic equipment; power distribution systems and power quality for EMC; galvanic isolation for EMC; reducing the accidental-RF-antenna efficiency of cables; segregation (zoning) of sites\, equipment\, and cables; cable routing and correct shield termination; galvanic isolators and PECs; creating an RF Reference; RF-bonding techniques for metalwork and cable shields \n\n\n\nEM Mitigation TechniquesEM zoning; safety earthing/grounding for safety and EMC; Mesh-bonding of Common Bonding Networks (MESH-CBNs) and of Insulated Bonding Networks (MESH-IBNs); damping the CM loop; what to do if you can’t use mesh-bonding; filtering power and signals for cabinets and EM Zones; shielding for cabinets and EM Zones; surge and lightning protection \n\n\n\nPreventing corrosionMaintaining good EMC over the operational lifecycleHigh Power Electromagnetics\, HPEM\, inc. IEMI\,EMP\,EMP\,NEMP\,HEMPSpecial EMC issues for rail and light rail systemsSome useful referencesBonus material: Close-field probing  \n\n\n\nParticipation fee: €600 (excl. VAT)A 15% discount applies for members of Agoria or the (E)EWISE and RESSIAR/TRANSSIMS project. The participation fee includes lunch and coffee breaks.
URL:https://edmforum.eu/event/good-emc-engineering-practices-for-large-machines-systems-and-installations/
CATEGORIES:Partner Events
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20190221T000000
DTEND;TZID=Europe/Brussels:20190221T000000
DTSTAMP:20260709T052119
CREATED:20231212T224241Z
LAST-MODIFIED:20240725T100828Z
UID:1940-1550707200-1550707200@edmforum.eu
SUMMARY:Webinar 2019-2-21: Thermal Management of Electronic Systems
DESCRIPTION:Presented by: Bart Vandevelde – imec \n\n\n\nIn this webinar\, we will present the basics on thermal management for electronic systems. We will give an introduction on how to make first order basic calculations for the maximum temperatures in a system\, give an overview on possible cooling techniques and when you need forces air flow or liquid cooling. We will also give some guidance on how to perform a detailed thermal design of your system based on advanced simulation software and validating experiments. \n\n\n\n\n\nFor members only \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Thermal Management of Electronic Systems\n                    \n                \n                \n                    \n                         1 file(s)  3.28 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Thermal Management of Electronic Systems – video\n                    \n                \n                \n                    \n                         1 file(s)  32.06 MB\n                    \n                    \n                        Login to download.
URL:https://edmforum.eu/event/webinar-12thermal-management-of-electronic-systems/
CATEGORIES:Webinar
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20181122T100000
DTEND;TZID=Europe/Brussels:20181122T110000
DTSTAMP:20260709T052120
CREATED:20231212T224241Z
LAST-MODIFIED:20240725T101309Z
UID:1939-1542880800-1542884400@edmforum.eu
SUMMARY:Webinar 2018-11-22: Highly Accelerated Life Testing
DESCRIPTION:Presented by: Davy Pissoort – KU Leuven \n\n\n\nOver the last decade\, a new efficient way of improving the robustness of an electronic product has been developed: Highly Accelerated Lifetime Testing (HALT). With HALT\, one will stress the product far beyond its operational specifications in order to quickly find and fix the weakest points in the design. As such\, HALT stimulates failures in contrast to conventional\, accelerated environmental tests which are pass/fail tests that try to simulate the normal\, expected environment that the product will encounter (design verification tests). As such\, HALT allows to drastically increase the operational margins of the product and\, hence\, the over-all reliability of the product. In this presentation we will give an overview of how a typical HALT tests is done as well as the main do’s and don’ts. \n\n\n\n\n\nFor members only \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Highly Accelerated Life Testing\n                    \n                \n                \n                    \n                         1 file(s)  1.98 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Highly Accelerated Life Testing – video\n                    \n                \n                \n                    \n                         1 file(s)  26.54 MB\n                    \n                    \n                        Login to download.
URL:https://edmforum.eu/event/webinar-11halt/
CATEGORIES:Webinar
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20181107T140000
DTEND;TZID=Europe/Brussels:20181107T161500
DTSTAMP:20260709T052120
CREATED:20231212T224212Z
LAST-MODIFIED:20240726T075137Z
UID:1911-1541599200-1541607300@edmforum.eu
SUMMARY:EDM Workshop 30: Smart NPI
DESCRIPTION:Smart products that build-up the Internet of Things are often highly innovative and mandate a short time-to-market. A traditional product development approach applying experience based (conservative) design rules and extensive qualification tests is obsolete. A high level of predictive power regarding manufacturability\, supply chain readiness\, quality and reliability\, cost\, etc. is demanded from an agile New Product Introduction methodology for Smart Products. Geert Willems\, imec\, will present the basic elements of a Predictive NPI approach as well as its practical implementation. \n\n\n\nShort time-to-market for new products and rapid scale-up of production\, keeping product cost low and quality high\, are especially challenging for a startup company. To accomplish this allóra Factory works intensively together with imec’s\, Center of Electronics Design & Manufacturing (cEDM) from imec. Tom De Ryck will present allóra Factory’s NPI process and how they leverage the cEDM offering. \n\n\n\nTo transform a Smart Product idea into a prototype and industrial product rapidly one needs to know the manufacturing capabilities. Involving manufacturing knowledge and experience is imperative. Eurocircuits\, a local prototype Printed Circuit Board supplier\, introduced the philosophy of “The Optimum Design Flow” and offers its online “Smart Menus”\, “DRC-“ and “DFM functionality” for this purpose. Dirk Stans will explain how these tools facilitate the rapid\, low cost production of prototypes “Right First Time” within budget and on time. \n\n\n\nFrom the perspective of an internationally operating OEM company\, Lena Eeckhout\, Barco\, will elaborate further on the challenges of matching electronic product design to the capabilities of multiple manufacturing suppliers. She will explain on how the concept of the “Printed Board Assembly (PBA) passport” opens the doors to an international supply chain. \n\n\n\nAgenda \n\n\n\n14h00Introduction14h05Predictive New Product Introduction for Smart ProductsGeert Willems\, imec14h35New Product Introduction Process in a Startup CompanyTom De Ryck\, allóra Factory15h05 Think before you act\, leads to “right first time”Dirk Stans\, Eurocircuits15h35World Wide NPI: the PBA Passport opens the manufacturing doorsLena Eeckhout\, Barco16h05The Smart Product InitiativeBas Rottier\, Sirris\n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        EDM Workshop 30 program\n                    \n                \n                \n                    \n                         1 file(s)  223.94 KB\n                    \n                    \n                        Download\n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Intro EDM Workshop 30\n                    \n                \n                \n                    \n                         1 file(s)  315.78 KB\n                    \n                    \n                        Download\n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n\n\nFor members only \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Predictive New Product Introduction for Smart Products\n                    \n                \n                \n                    \n                         1 file(s)  1.58 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        New Product Introduction Process in a Startup Company\n                    \n                \n                \n                    \n                         1 file(s)  3.17 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Think Before You Act\, Leads to “Right First Time”\n                    \n                \n                \n                    \n                         1 file(s)  5.02 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        World Wide NPI: the PBA Passport Opens the Manufacturing Doors\n                    \n                \n                \n                    \n                         1 file(s)  1.44 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        The Smart Product Initiative\n                    \n                \n                \n                    \n                         1 file(s)  643.56 KB\n                    \n                    \n                        Login to download.
URL:https://edmforum.eu/event/cedm-workshop-30smart-npi/
LOCATION:Kortrijk Expo\, Doorniksesteenweg 216\, Kortrijk\, 8500\, Belgium
CATEGORIES:Workshop
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20181107T000000
DTEND;TZID=Europe/Brussels:20181108T235900
DTSTAMP:20260709T052120
CREATED:20241011T092051Z
LAST-MODIFIED:20241011T094223Z
UID:9064-1541548800-1541721540@edmforum.eu
SUMMARY:D&E Event 2018
DESCRIPTION:Op 7 november 2018 vindt het D&E Event plaats in Technopolis te Mechelen. Ontmoet hier ontwikkelaars en toepassers van embedded systems\, ontdek de laatste technologieën en wissel visies en ervaringen uit met vakgenoten.Specifieke thema’s tijdens dit event zijn FPGA\, Security\, Internet of Things\, Electronic Design & Production en Embedded. \n\n\n\n\n\nEDM contribution:\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Predictive New Product Introduction for Smart Products – D&E Event 2018\n                    \n                \n                \n                    \n                         1 file(s)  2 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\nAbstract: Smart products that build-up the Internet of Things are often highly innovative and mandate a short time-to-market. A traditional product development approach applying experience based (conservative) design rules and extensive qualfication tests is obsolete. A smart New Product Introduction methodology is required “to go where no-one has gone before”. A high level of predictive power regarding manufacturability\, supply chain readiness\, quality and reliability\, cost\, etc. is demanded from an agile New Product Introduction methodology for Smart Products. Science allows us to predict that what we have never experienced before. The basic elements of such a science-based Predictive NPI approach – technology qualification\, quality and reliability physics and virtual prototyping – will be presented as well as its practical implementation \n\n\n\nLocations:7 November: Technopolis\, Mechelen8 November: Van der Valk Hotel\, Eindhoven\, Nederland
URL:https://edmforum.eu/event/de-event-2018/
CATEGORIES:Events with EDM contribution
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20181016T130000
DTEND;TZID=Europe/Brussels:20181016T163000
DTSTAMP:20260709T052120
CREATED:20240726T122141Z
LAST-MODIFIED:20240726T122646Z
UID:5871-1539694800-1539707400@edmforum.eu
SUMMARY:PBA Technology Seminar and Factory Visit
DESCRIPTION:PBA Technology Seminar 2018 Newtec\n                    \n                \n                \n                    \n                         1 file(s)  217.46 KB\n                    \n                    \n                        Download
URL:https://edmforum.eu/event/pba-technology-seminar-and-factory-visit-2/
LOCATION:Newtec Manufacturing Competence Centre\, Joseph Cardijnstraat 10\, Erpe-Mere\, 9420\, Belgium
CATEGORIES:Technology seminar
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20180913T100000
DTEND;TZID=Europe/Brussels:20180913T110000
DTSTAMP:20260709T052120
CREATED:20231212T224241Z
LAST-MODIFIED:20240725T101238Z
UID:1938-1536832800-1536836400@edmforum.eu
SUMMARY:Webinar 2018-9-13: Bending Cycling as Fast Alternative for Thermal Cycling 
DESCRIPTION:Presented by: Bart Vandevelde (imec) \n\n\n\nIn particular for testing of the board level interconnect reliability of components\, bending cycling can be an interesting alternative for regular thermal cycling. The main gain lies in the testing time. The four point bending stresses the interconnections in a similar way as in thermal cycling\, but as the test can be performed at constant temperature\, the cycle rate can be easily increased without the issue of heating and cooling the total thermal mass.In this webinar\, we will explain the concept for four-point bending cycling of soldered components and how it can be related to thermal cycling. Also test results for CSP and QFN components will be shown\, which proofs the usefulness of this alternative testing approach.  \n\n\n\n\n\nFor members only \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Bending Cycling as Fast Alternative for Thermal Cycling \n                    \n                \n                \n                    \n                         1 file(s)  1.80 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Bending Cycling as Fast Alternative for Thermal Cycling – video\n                    \n                \n                \n                    \n                         1 file(s)  23.82 MB\n                    \n                    \n                        Download
URL:https://edmforum.eu/event/webinar-10four-point-bending/
CATEGORIES:Webinar
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20180621T103000
DTEND;TZID=Europe/Brussels:20180621T110000
DTSTAMP:20260709T052120
CREATED:20231212T224241Z
LAST-MODIFIED:20240725T101208Z
UID:1937-1529577000-1529578800@edmforum.eu
SUMMARY:Webinar 2018-6-21: Mission Profiles of Electronics
DESCRIPTION:Presented by: Tania Drissen – Sirris \n\n\n\nProduct reliability is gaining importance because of today’s increasing overall complexity of products. In a product’s design for reliability knowing the actual loads that will act on the product during its lifetime is key. The life cycle profile describes these different loads and their variation over time throughout the entire product life. This lifecycle profile guideline provides a step-by-step approach to identify all relevant life cycle phases\, situations and loads for a physical system. It aims to be a methodology for product designers who want to pursue a design for reliability approach for their current and future products. \n\n\n\n\n\nFor members only \n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Mission Profiles of Electronic Products\n                    \n                \n                \n                    \n                         1 file(s)  3.78 MB\n                    \n                    \n                        Login to download. \n                    \n                \n            \n        \n    \n\n\n\n\n\n\n\n    \n        \n            \n            \n                \n                    \n                        Mission profiles of Electronic Products – video\n                    \n                \n                \n                    \n                         1 file(s)  24.47 MB\n                    \n                    \n                        Login to download.
URL:https://edmforum.eu/event/webinar-9mission-profiles/
CATEGORIES:Webinar
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20180620T084500
DTEND;TZID=Europe/Brussels:20180620T180000
DTSTAMP:20260709T052120
CREATED:20241009T102250Z
LAST-MODIFIED:20241009T102306Z
UID:8869-1529484300-1529517600@edmforum.eu
SUMMARY:Flanders Make: Mechatronics 4.0 - Masterclass V
DESCRIPTION:Best practices toward robust sensing & control of your system\n\n\n\nThe Mechatronica 4.0 project aims to help Flemish companies to put the Industry 4.0 philosophy into practice. Sensing and control technology will be a key feature of the next generation of autonomous\, safety and inspection systems\, and it is the focus of our next Mechatronics 4.0 Masterclass. The aim of this masterclass is to inform you about the possibilities of sensing and control systems\, to provide you insights into how to integrate these systems into products or production systems and how to develop them in an effective way. \n\n\n\n\n\nTypical questions that will be addressed during the masterclass: \n\n\n\n\nWhich control technique fits my application?\n\n\n\nWhat can learning control add to my product?\n\n\n\nWhich hardware and toolchain can I use to develop my system?\n\n\n\nHow do I put model-based control design into practise. In addition\, the Mechatronics 4.0 project members will present their views on sensing and control technology\, which enable the realisation of smart\, adaptive products. The different themes will be illustrated with industrial use cases.\n\n\n\n\nAgenda:  \n\n\n\n08:45  Registration09:25  Welcome & Introduction to ‘VIS-traject Mechatronics 4.0’ – Stijn Gielis\, Sirris10:00  Sensing and control technology\, what is in it for me? – Abdellatif Bey-Temsamani and Bruno Depraetere\, Flanders Make10:45  Open loop control\, Modern smart products – Maarten Witters\, Flanders Make11:15  Coffee break11:30  PID control: application Scanning laser hardening and vibration suppression applications – Mats Vande Cavey and Bruno Depraetere\, Flanders Make12:00  How and why going from PID to learning / adaptive control? Uncertainty and variability in machines with repetitive tasks – Erik Hostens\, Flanders Make12:30  Company Testimonial I13:00 – Lunch & Demos \n\n\n\n\nLight Catcher – adaptive (learning) control\n\n\n\nModular drive train setup – control of magnetic bearing\n\n\n\nSmall Jacquard set-up – model based control\n\n\n\nDevelopment platforms Tractor\n\n\n\nMDAVD Evoque II – comparison of a lateral control algorithm with a human driver\n\n\n\nSit control/Locator demo – navigate an AGV through a factory environment\n\n\n\nAdditive manufacturing trajectories optimisation\n\n\n\n\n15:00  Path planning navigation. Automated guided vehicle and Additive Manufacturing applications           Kurt Geebelen\, Nathan Dwek and Anke Van Campen\, Flanders Make15:30  Model-based control design in practise – Toolchain. Practical implementation\, testing and validation of controllers           Bruno Depraetere\, Flanders Make16:00 – Company Testimonial II16:30 – Round table discussion (questions tuned to interest from welcome session)17:00 – Network drink  \n\n\n\nParticipation fee:  \n\n\n\n\nMembers Mechatronica 4.0: free\n\n\n\nMembers Sirris / Flanders Make: 150 € (ex VAT)\n\n\n\nNon-members: 300 € (ex VAT)\n\n\n\n\nLocation: Sirris/Flanders Make – Celestijnenlaan 300\, 3001 Leuven
URL:https://edmforum.eu/event/flanders-make-mechatronics-4-0-masterclass-v/
CATEGORIES:Partner Events
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END:VCALENDAR