BEGIN:VCALENDAR VERSION:2.0 PRODID:-//EDM Forum - ECPv6.15.12.2//NONSGML v1.0//EN CALSCALE:GREGORIAN METHOD:PUBLISH X-WR-CALNAME:EDM Forum X-ORIGINAL-URL:https://edmforum.eu X-WR-CALDESC:Events for EDM Forum REFRESH-INTERVAL;VALUE=DURATION:PT1H X-Robots-Tag:noindex X-PUBLISHED-TTL:PT1H BEGIN:VTIMEZONE TZID:Europe/Brussels BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20160327T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20161030T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20170326T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20171029T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20180325T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20181028T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20190331T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20191027T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20200329T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20201025T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20210328T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20211031T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20220327T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20221030T010000 END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20210125T130000 DTEND;TZID=Europe/Brussels:20210125T154500 DTSTAMP:20260709T154758 CREATED:20231212T224225Z LAST-MODIFIED:20240725T152413Z UID:1922-1611579600-1611589500@edmforum.eu SUMMARY:Webinar 2021-1-25: Accelerate and Strengthen Your Idea for a Smart Product DESCRIPTION:Agenda \n\n\n\n13h00Introduction13h10How do companies approach their smart product innovation?Witnesses: Gilbos and Shayp14h20Smart Product ExplorationThomas De Meester – imec14h40Tools for orientation and decision making Smart Product Scenarios – Ludwig De Locht – Sirris Fit with market – Nick Boucart – Sirris Smart product maturity – Thomas De Meester – imec Follow-up tools – Geert Willems – imec Proof-of-Concepts – Thomas De Meester – imec15h25What’s next for your company?Pieter Beyl – Sirris\n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n Accelerate and Strengthen Your Idea for a Smart Product\n \n \n \n \n 1 file(s) 3.35 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Smart Product Development at Gilbos\n \n \n \n \n 1 file(s) 770.09 KB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Smart Product Development at Shayp\n \n \n \n \n 1 file(s) 6.09 MB\n \n \n Login to download. URL:https://edmforum.eu/event/mastering-smart-product-2/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20201029T093000 DTEND;TZID=Europe/Brussels:20201029T170000 DTSTAMP:20260709T154758 CREATED:20231212T224143Z LAST-MODIFIED:20240731T150710Z UID:1890-1603963800-1603990800@edmforum.eu SUMMARY:Electronic Product Development DESCRIPTION:Due to the on-going Corona pandemic no live participation by non-imec employees to training sessions and seminars at imec is allowed. Online participation is possible through live streaming and MS Teams interaction session. \n\n\n\nAbout the course:The course discusses the New Product Exploration (NPE)\, Planning (NPP) and Introduction (NPI) development stages that bring an electronic product from idea to the end user. The relationship with the product life cycle stages and life cycle processes defined per ISO/IEC/IEEE System and Software Engineering standards is explained.  The specific characteristics of the electronic supply chain and the associated smart product development challenges are presented. A development methodology capable to cope with these challenges is explained as well as the important role of Design-for-eXcellence.A short introduction to Printed Circuit Board technology\, manufacturing and assembly closes the session. \n\n\n\nCourse objectives:– Insight in product development stages and processes of electronics.– Get to know the challenges of electronics development and the electronics supply chain.– Introduction to ISO/IEC/IEEE System and Software Engineering standards.– Elements of a Smart Product Development methodology.– What is Design-for-eXcellence and why is it important. \n\n\n\nOf interest to:All stakeholders in electronic product development. \n\n\n\nLecturer: Geert Willems\, Ph.D.\, imecPresentation: video streamingInteraction: MS Teams parallel sessionimec employees can participate on-site (max. 20) \n\n\n\nAgenda: 9h30  Electronic System Structure          Product Life Cycle          New Product Exploration11h00 Break11h15 New Product Planning           New Product Introduction12h45  Lunch13h30  The Electronics Supply Chain            Quality and Non-Quality Cost            Design-for-eXcellence of Electronics15h00 Break15h15  Printed Board Assembly (PBA) basics            Printed Circuit Board (PCB) basics16h45  Q&A – wrap-up17h00  End URL:https://edmforum.eu/event/electronic-product-development-2/ CATEGORIES:Masterclass END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20200110T140000 DTEND;TZID=Europe/Brussels:20200110T173000 DTSTAMP:20260709T154758 CREATED:20231212T224139Z LAST-MODIFIED:20240726T075229Z UID:1886-1578664800-1578677400@edmforum.eu SUMMARY:EDM Workshop 32: Towards an Improved Lifetime Prediction of Electronics DESCRIPTION:In a growing market of complex intelligent products requiring a lifetime longer than consumer electronics (> 2 years)\, realising products “with predictable life time”under known loading conditions gives a competitive advantage to companies. \n\n\n\nEvaluating potential reliability risks and predicting the lifetime at the “design stage”gives a benefit in time-to-market and both engineering and product cost by mitigating quality and reliability risks in the design phase before prototype testing\, production and especially product deployment. \n\n\n\nThis workshop is the final event for the INPROVOL project\, a Vlaio funded collective research project with focus on developing tools\, guidelines and methodologies to support the industry in designing and manufacturing products with a better knowledge of its life time. Bart Vandevelde (imec) will present as project leader a summary of the main results of this project. \n\n\n\nRainer Dudek (Fraunhofer ENAS) will present unique results of a real-life thermal cycling test lasting already for more than eight years. His results allow to benchmark the different acceleration models (such as Norris-Landzberg) to the real test failure data. \n\n\n\nPiet Watté(Signify) will present how Signify\, previously known as Philips Lighting\, deals with engineering models to predict the lifetime for products such as LED drivers. \n\n\n\nWhere reliability is related to the lifetime under normal operating conditions\, the robustness of a product expresses the product’s capability of withstanding product life cycle conditions that go beyond normal\, as-designed conditions. Geert Willems (imec)\, will discuss how to augment the robustness of electronics and will introduce InProVoL’s Design-for-Robustness and Robustness Testing and Qualification guidelines. \n\n\n\nAgenda \n\n\n\n14h00Welcome14h10Reliability by design approach for life time prediction of electronic systems (INPROVOL project summary) Bart Vandevelde – imec14h40Challenging the acceleration factor models by a Long-Term life Testing on a soldered board assemblyRainer Dudek\, Fraunhofer ENAS15h10  Engineering model for the life prediction of LED drivers Piet Watté – Signify15h40Design-for-Robustness for electronicsGeert Willems – imec16h10Q&A\, networking and booth\n\n\n\n\n\n\n\n \n \n \n \n \n \n Intro EDM Workshop 32\n \n \n \n \n 1 file(s) 398.86 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n Reliability by Design Approach for Life Time Prediction of Electronic Systems\n \n \n \n \n 1 file(s) 3.72 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Challenging the Acceleration Factor Models by a Long-Term Life Testing on a Soldered Board Assembly\n \n \n \n \n 1 file(s) 2.97 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Engineering Model for the Life Prediction of LED Drivers\n \n \n \n \n 1 file(s) 1.82 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Design-for-Robustness for Electronics\n \n \n \n \n 1 file(s) 2.61 MB\n \n \n Login to download. URL:https://edmforum.eu/event/cedm-workshop-32/ LOCATION:Imec Leuven\, Kapeldreef 75\, Leuven\, 3001\, Belgium CATEGORIES:Workshop END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20191114T100000 DTEND;TZID=Europe/Brussels:20191114T110000 DTSTAMP:20260709T154758 CREATED:20231212T224244Z LAST-MODIFIED:20240725T140038Z UID:1942-1573725600-1573729200@edmforum.eu SUMMARY:Webinar 2019-11-4: Safety Assurance of Autonomous Systems DESCRIPTION:Presented by: Davy Pissoort – KU Leuven \n\n\n\nAutonomous systems offer humankind tremendous opportunities\, like freeing us from mundane tasks\, carrying out risky procedures and generally giving us more time to enjoy the things we like doing. As long as these systems are operating in a human-less environment\, like enclosed surroundings in a factory\, they are readily accepted. However\, people lack trust in autonomous systems if their own safety is dependent on a machine’s correct operation. Whenever someone mentions self-driving cars\, the question of safety is raised immediately. Even though the widespread introduction of autonomous vehicles would almost eliminate the more-than 20.000 deaths on European roads each year\, it will not happen until we can provide the assurance that these systems will be safe and perform as intended\, no matter what.Unfortunately\, existing safety assurance approaches and standards are developed primarily for systems where a human can take over in case of emergency and\, hence\, do not extend to fully autonomous systems. What’s more\, current safety assurance approaches generally assume that once the system is deployed\, it will not learn or evolve by itself. This ignores many of the new safety challenges that come along with autonomous systems: unsafe software behavior\, open-context nature\, functional insufficiencies\, human-machine interaction\, just to name a few.This talk will introduce the latest evolutions in the area of safety assurance of autonomous systems\, including: Safety of the Intended Function\, dynamic safety assurance\, safety monitors\, run-time safety cases\, etc. \n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n Safety Assurance of Autonomous Systems \n \n \n \n \n 1 file(s) 4.69 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Safety Assurance of Autonomous Systems – video\n \n \n \n \n 1 file(s) 33.93 MB\n \n \n Login to download. URL:https://edmforum.eu/event/webinar-14safety-assurance-of-autonomous-systems/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20190621T130000 DTEND;TZID=Europe/Brussels:20190621T170000 DTSTAMP:20260709T154758 CREATED:20240729T082324Z LAST-MODIFIED:20240729T082346Z UID:5961-1561122000-1561136400@edmforum.eu SUMMARY:PCB Technology Seminar and Factory Visit DESCRIPTION:The “Smart” in “Smart Products” – whatever these products do – is based on electronics. Electronics is everywhere. This seminar provides basic insight in the technology and production processes of a key part of all electronics: the Printed Circuit Board that connects the electronic components in an electronic assembly. To understand the relationship between cost\, quality and reliability of electronics\, it is mandatory to have a basic understanding of the capabilities and the limitations of the PCB technology as well as the factors that drive cost and quality. This seminar provides a basic step towards this understanding. \n\n\n\nAgenda \n\n\n\n\nReception13h00 – Start 13h15\n\n\n\nWelcome at ACB by Joachim Verhegge (ACB)A short presentation of ACB.\n\n\n\nPCB technology basics by Joachim Verhegge (ACB)Introduction to PCB manufacturing technology discussing the basic materials and PCB manufacturing processes:lithography\, etching\, lamination\, drilling\, plating\, solder mask deposition\, finishing\, inspection. Theprocess sequence for multilayer PCB’s is explained.\n\n\n\nOverview of advanced PCB technology by Joachim Verhegge (ACB)Overview of advanced PCB technologies for high complexity\, high-density interconnect and flexible PCBs.\n\n\n\nFactory tourExtensive tour of ACB’s factory facilities.\n\n\n\nEnd: around 16h30 URL:https://edmforum.eu/event/pcb-technology-seminar-and-factory-visit-6/ LOCATION:ACB\, Vosmeer 3\, Dendermonde\, +3252202030\, 9200\, Belgium CATEGORIES:Technology seminar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20190613T140000 DTEND;TZID=Europe/Brussels:20190613T170000 DTSTAMP:20260709T154758 CREATED:20240712T161008Z LAST-MODIFIED:20240726T075203Z UID:3138-1560434400-1560445200@edmforum.eu SUMMARY:EDM Workshop 31: Space Electronics for the 21st Century DESCRIPTION:Quality and reliability are key elements of space electronics. Space agencies like ESA prefer flight-proven technologies in their spacecraft and require extensive equipment testing and qualification to guarantee reliability. Adhering to flight-proven technologies has drawbacks. A highly performing\, reliable solution without adaptation to the technological evolution does not remain performant nor reliable in the 21st century’s technological and operational context. This workshop will provide insight in the status of space electronics design and manufacturing for ESA spacecraft and on the steps to take to create better electronics for future ESA space missions. \n\n\n\nJussi Hokka of ESA will discuss the challenges and the impact that imposes the trend towards more complex and densely populated electronic assemblies\, the increasing operating temperature and the lead-ban on space electronics in the coming five to ten years. \n\n\n\nA highly integrated spacecraft control unit is crucial to succeed in the system design of small satellites with high autonomy as Proba-V. Steven De Cuyper of QinetiQ will explain the development and manufacturing of such electronics per ESA procedures and standards. \n\n\n\nCertain well-proven technologies required by these ESA standards put severe limits to the use of modern industrially well-proven technologies in space electronics. Geert Willems of imec will identify these limiting technologies\, their background and the alternatives that allow building lower weight\, better performing\, more reliable and more environmentally friendly space electronics at a lower cost. \n\n\n\nAssessing the environmental impact of space missions is taking a bigger role in mission development for ESA. Electronics is identified as one of the environmental hot spots in spacecrafts. An Vercalsteren of VITO will illustrate this as well as some eco-design alternatives based on the ESA GreenSat study using Proba-V as a reference case. \n\n\n\nMore complex and denser electronic assemblies require the use of PCB substrates that use microvia\, high aspect ratio core vias and small track widths and spacing.  Joachim Verhegge of ACB will discuss this High-Density Interconnect (HDI) demand and the balanced approach between capabilities and reliability required for space electronics \n\n\n\n\n\n\n14h00Welcome14h10ESA’s view on Space Electronics requirements and future needs.Jussi Hokka – ESA14h30 Electronics for earth orbit satellite missions: Proba-V Steven De Cuyper – QinetiQ15h00Improving Space Electronics: a review of opportunitiesGeert Willems – imec15h20Life Cycle Assessment and eco-design of the PROBA-V space mission focus on space electronicsAn Vercalsteren\, VITO15h40High-density Printed Circuit Boards for Space ElectronicsJoachim Verhegge\, ACB16h00Networking\n\n\n\n\n\n\n\n\n\n\n \n \n \n \n \n \n Intro EDM Workshop 31\n \n \n \n \n 1 file(s) 184.59 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n Electronics for Earth Orbit Satellite Missions: Proba-V\n \n \n \n \n 1 file(s) 929.80 KB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Improving Space Electronics: A Review of Opportunities\n \n \n \n \n 1 file(s) 2.07 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Life Cycle Assessment and Eco-design of the PROBA-V Space Mission\n \n \n \n \n 1 file(s) 1.94 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n High-Density Printed Circuit Boards for Space Electronics\n \n \n \n \n 1 file(s) 2.71 MB\n \n \n Login to download. URL:https://edmforum.eu/event/edm-workshop-31-space-electronics-for-the-21st-century/ LOCATION:Imec Leuven\, Kapeldreef 75\, Leuven\, 3001\, Belgium CATEGORIES:Workshop END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20190528T100000 DTEND;TZID=Europe/Brussels:20190528T110000 DTSTAMP:20260709T154758 CREATED:20231212T224244Z LAST-MODIFIED:20240725T125228Z UID:1941-1559037600-1559041200@edmforum.eu SUMMARY:Webinar 2019-5-28: Reliabilty of Alternative Solder Materials - part 2 DESCRIPTION:Autonomous systems offer humankind tremendous opportunities\, like freeing us from mundane tasks\, carrying out risky procedures and generally giving us more time to enjoy the things we like doing. As long as these systems are operating in a human-less environment\, like enclosed surroundings in a factory\, they are readily accepted. However\, people lack trust in autonomous systems if their own safety is dependent on a machine’s correct operation. Whenever someone mentions self-driving cars\, the question of safety is raised immediately. Even though the widespread introduction of autonomous vehicles would almost eliminate the more-than 20.000 deaths on European roads each year\, it will not happen until we can provide the assurance that these systems will be safe and perform as intended\, no matter what.Unfortunately\, existing safety assurance approaches and standards are developed primarily for systems where a human can take over in case of emergency and\, hence\, do not extend to fully autonomous systems. What’s more\, current safety assurance approaches generally assume that once the system is deployed\, it will not learn or evolve by itself. This ignores many of the new safety challenges that come along with autonomous systems: unsafe software behavior\, open-context nature\, functional insufficiencies\, human-machine interaction\, just to name a few.This talk will introduce the latest evolutions in the area of safety assurance of autonomous systems\, including: Safety of the Intended Function\, dynamic safety assurance\, safety monitors\, run-time safety cases\, etc. \n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n Reliability of Alternative Solder Materials – part 2\n \n \n \n \n 1 file(s) 1.91 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Reliability of Alternative Solder Materials – part 2 – video\n \n \n \n \n 1 file(s) 32.75 MB\n \n \n Login to download. URL:https://edmforum.eu/event/webinar-13reliabilty-of-alternative-solder-materials-part-2/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20190321T140000 DTEND;TZID=Europe/Brussels:20190321T190000 DTSTAMP:20260709T154758 CREATED:20241011T101118Z LAST-MODIFIED:20241011T101147Z UID:9078-1553176800-1553194800@edmforum.eu SUMMARY:IMAPS Benelux Spring Event 2019: Electronic packaging for Green Applications DESCRIPTION:Through regular events and programs\, IMAPS chapters serve as local networks that allow microelectronics professionals to build business relationships\, share industry information\, and find technical solutions. IMAPS chapters organize and sponsor symposia/conferences\, vendor’s days\, technical presentations\, and social events. \n\n\n\nAgenda: 14:00 Registration\, coffee\, exhibition14:30 Green encapsulants … a continuous trend in electronics (Jochen Schuermans\, Roartis)15:00 Low temperature solder interconnect for solar cells (Dr. N. van Veen\, Mat-Tech BV)15:30 Silicones for a Greener World (Herman Meynen\, DowDuPont Specialty Products)16:00 Coffee\, exhibition + opportunity to visit the imec / Energyville labs17:00 Latest materials and technologies in cSi (crystalline Silicon) and TFPV (thin film photo-voltaic) module packaging (Aranzazu Aguirre\, Energyville-imec)17:30 Current sensors for an electrified present and future (Tim Vangerven\, Melexis Technologies)18:00 Sandwiches19:00 Closing \n\n\n\n\n\nLocation : Energyville 1\, Thor Park 8310\, 3600 Genk \n\n\n\nParticipation fee: IMAPS member (Benelux or international): 50 €Non member: 120 €Student: 20 €Student with poster: 0 € URL:https://edmforum.eu/event/imaps-benelux-spring-event-2019-electronic-packaging-for-green-applications/ CATEGORIES:Partner Events END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20190318T000000 DTEND;TZID=Europe/Brussels:20190322T235959 DTSTAMP:20260709T154758 CREATED:20241011T100351Z LAST-MODIFIED:20241011T100411Z UID:9075-1552867200-1553299199@edmforum.eu SUMMARY:KULeuven course: Introduction to System Safety DESCRIPTION:A five-day primer in system safety engineeringThe Introduction to System Safety course is a five-day primer in system safety engineering. The course contains a mix of lectures\, discussions and small group exercises\, supported by international examples. Whilst the course touches on broader issues in theorizing risk and managing safety within organisations\, its main focus is to equip safety practitioners with the practical understanding necessary to engage with safety activities. The course is organized in collaboration with the University of York and is based on material of their MSc of Science in Safety Critical Systems Engineering program. \n\n\n\n\n\nThe course is structured according to the engineering lifecycle of a service or physical system\, and covers: \n\n\n\n\nConcepts and terminology for safety;\n\n\n\nOverview of the engineering lifecycle from a safety perspective\, including the role and intent of key safety activities;\n\n\n\nHazard identification and setting of safety requirements;\n\n\n\nTechniques for safety analysis to support design\, including:\n\nFailure Modes and Effects Analysis (FMEA);\n\n\n\nFunctional Failure Analysis (FFA);\n\n\n\nHazard and Operability Studies (HAZOP);\n\n\n\nFault Tree Analysis (FTA).\n\n\n\n\n\nSafety cases\, including notations for recording arguments and evidence;\n\n\n\nSpecific issues in safety analysis\, including\, Human Factors\, Software and Data Safety.\n\n\n\n\nPRESENTERSThe course is a University of York course and will be presented by dr. Oleg Lisagor and dr. Christian FairburnIn addition\, expertise from Prof. Jeroen Boydens and Prof. Davy Pissoort from KU Leuven will be added to the course. \n\n\n\nDr. Oleg LisagorDr. Lisagor is a lecturer at the High Integrity Systems Engineering group at the Dept. of Computer Science of the University of York and a Head of one of University’s Colleges. His research interest is Model-based Safety Assessment of complex\, large-scale and software-intensive systems. He has collaborated in and lead work packages of several collaborative research projects such as MISSA\, ISAAC\, Aribus DepNet and OPENCOSS. Dr. Lisagor’s past research collaborators include Airbus\, Alenia Aeronautica\, Dassault Aviation\, Thales\, ONERA and FBK. More information can be found here: Curriculum Vitae \n\n\n\nDr. Christian FairburnDr. Fairburn is the Director of Reliable Interaction Ltd\, a specialist in Human Factors and Ergonomics\, and a part time lecturer at the High Intergrity Systems Engineering group at the Dept. of Computer Science of the University of York. He has worked in the areas of Air Traffic Control \, cockpit controls and displays\, mixed reality (Live/Virtual/Constructive) training systems\, autonomous vehicles\, civil security\, and many more. Dr. Fairburn has qualifications in both Psychology and Computer Science and maintains active connections with leading academics in these areas. More information can be found at his LinkedIn profile. \n\n\n\nProf. Jeroen BoydensProf. Boydens is the head of the Software Coding division of the Mechatronics Group at the Dept. of Computer Science of the University of KU Leuven. His current research focuses on Software-implemented Reliability in a context of Functional Safety. He coordinates and collaborates in several national and international research projects\, such as MSCA ETN SAS\, MSCA ETN PETER\, MSCA ETN PETER\, and IWT TeTra RELIM. Prof. Boydens’ research collaborations include CNHIndustrial\, Barco\, Melexis\, DANA and Televic. \n\n\n\nProf. Davy PissoortProf. Pissoort is the head of the FMEC division (focusing on Electrical and Electronic Systems) of the Mechatronics Group at the Dept. of Electrical Engineering of KU Leuven. His current research focuses on electromagnetic compatibility\, hardware dependability and functional safety. He coordinates and collaborates in several national and international research projects\, such as MSCA ETN SAS\, MSCA ETN PETER\, CORNET EEWISE\, CORNET RESSIAR\, VIS-INPROVOL. Prof. Pissoort’s reach collaborations comprise companies as\, amongst others\, Valeo\, Bosch\, Horiba-Mira\, Barco\, Melexis\, ONSemiconductor\, Schlegel Electronic Materials\, etc. \n\n\n\nLocation: Crown Plazza Brugge\, Burg 10\, 8000 Brugge \n\n\n\nParticipation fee: € 4000 (excl. VAT)This price also includes:– 4 overnight stays in a standard room at the crown plaza on monday\, tuesday\, wednesday and thursday evening. Including breakfast on the next day.– Coffee breaks and lunch for each day of the courseNon-cummulative discounts are granted to:– User group members of the projects RESSIAR/TransSIMS and EEWISE/EWISE [10% discount]– Two or more members from the same company [15% discount] URL:https://edmforum.eu/event/kuleuven-course-introduction-to-system-safety/ CATEGORIES:Partner Events END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20190312T130000 DTEND;TZID=Europe/Brussels:20190312T180000 DTSTAMP:20260709T154758 CREATED:20231212T223655Z LAST-MODIFIED:20240729T083220Z UID:1798-1552395600-1552413600@edmforum.eu SUMMARY:PBA Reliability Seminar DESCRIPTION:Internet-of-Things\, Electronics Everywhere\, self-driving cars\, body-area-networks monitoring your health\, etc. : ever increasing electronics complexity means more opportunities to fail and\, therefore\, intrinsically a reduced reliability.During this seminar\, Geert Willems of imec-cEDM will explain the “bathtub curve”\, take you through failure mechanisms in electronics and show you why and how Physics-of-Failure is becoming the cornerstone of modern reliability engineering.Content: \n\n\n\n\nFailure Probability/Reliability functions: “the bathtub curve”– Early failure – constant failure rate – wear-out – meaning of MTTF – Weibull– Constant failure rate modeling and why it is not suited for modern electronics.– EDM-D-100: Failure opportunities and the reliability function R(T) of a PBA\n\n\n\nBasics of Physics-of-Failure– The failure mechanism – the stress level – from stress to lifetime– Accelerated testing: Norris-Landzberg et al. and why this is not Physics-of-Failure.– Physics-of-Failure based testing\n\n\n\nDominant interconnection failure mechanisms in electronics– Solder joint failure– PCB via failure– Insulation failure: SIR – creep corrosion – (CAF – Sn-whiskers)\n\n\n\n\nAgenda:  \n\n\n\n12:45 Registration13:15 Welcome by Barco (Dora Deboeure)13:30 Basics in Electronics Reliability (Geert Willems\, imec & cEDM)15:00 Coffee break15:30 Tour in Reliability lab of Barco\, Kortrijk16:00 Experience tour Barco17:00 Networking drink at the Revo Bar URL:https://edmforum.eu/event/pba-reliability-seminar/ LOCATION:Barco NV Beneluxpark 21\, Beneluxpark 21\, Kortrijk\, 8500\, Belgium CATEGORIES:Technology seminar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20190221T090000 DTEND;TZID=Europe/Brussels:20190222T170000 DTSTAMP:20260709T154758 CREATED:20241011T095247Z LAST-MODIFIED:20241011T133424Z UID:9072-1550739600-1550854800@edmforum.eu SUMMARY:KULeuven course: Good EMC Engineering Practices for Large Machines\, Systems and Installations DESCRIPTION:Learn how to avoid electromagnetic interactions that cause delays and increase costOn Thursday Feb 21 and Friday Feb 22 2019\, the M-Group and lab FMEC organizes a two day seminar on good EMC engineering practices for large machines\, systems and installations. \n\n\n\n\n\nMI is rapidly increasing in modern industry due to the increasing use of\, amongst others\, high-efficiency switching power conversion in DC power supplies\, motor drives\, HVAC and lighting. Despites this increasing EMI\, the reliability of machines\, systems and installations should be continuously ensured over their full operation life. Trends towards smart machines\, Industry 4.0 and Internet-of-Things comprise more wireless sensor networks\, continuously increasing clock frequencies\, higher complexity and integration\, lower voltage levels and noise margins\, etc. As a result\, achieving EMC for machines\, systems and installations is getting more challenging every day. This training course provides all the necessary information and many practical techniques for achieving in the most cost-effective way EMC for today’s and tomorrow’s smart machines\, systems and installations.This course is organized within the framework of the following Technology Transfer projects:– CORNET RESSIAR / TETRA TRANSSIMS “Requirements for Smart Sensor Systems for IoT-Applications in Retrofit Equipment “– CORNET EEWISE / TETRA EWISE “EMC for Emergent Wireless Systems” \n\n\n\nKey-Note speaker:Key-note speaker of this seminar is Keith Armstrong (UK). Keith has written many practical papers and books on design for EMC and EMC debugging. Much of his working life involves solving real-life EMC problems in high-technology products\, systems\, and installations\, for a variety of companies and organisations in a wide range of industries. Keith has always aimed to make products easy to design and manufacture\, work properly\, please their users\, and make money for their manufacturers. \n\n\n\nContents:A. CE + CE does not = CE! What to do instead\, for EMC.B. Complying with Ed.3 of the EMC Directive: 2014/30/EU: Requirements for Fixed Installations\, and the items (equipment\, subsystems\, systems\, etc.) they are made from. \n\n\n\nIntroductionEMC Directive; IEE wiring regulations; overall EMC control procedure \n\n\n\nGood EMC Practices for general useBuying electronic equipment; power distribution systems and power quality for EMC; galvanic isolation for EMC; reducing the accidental-RF-antenna efficiency of cables; segregation (zoning) of sites\, equipment\, and cables; cable routing and correct shield termination; galvanic isolators and PECs; creating an RF Reference; RF-bonding techniques for metalwork and cable shields \n\n\n\nEM Mitigation TechniquesEM zoning; safety earthing/grounding for safety and EMC; Mesh-bonding of Common Bonding Networks (MESH-CBNs) and of Insulated Bonding Networks (MESH-IBNs); damping the CM loop; what to do if you can’t use mesh-bonding; filtering power and signals for cabinets and EM Zones; shielding for cabinets and EM Zones; surge and lightning protection \n\n\n\nPreventing corrosionMaintaining good EMC over the operational lifecycleHigh Power Electromagnetics\, HPEM\, inc. IEMI\,EMP\,EMP\,NEMP\,HEMPSpecial EMC issues for rail and light rail systemsSome useful referencesBonus material: Close-field probing  \n\n\n\nParticipation fee: €600 (excl. VAT)A 15% discount applies for members of Agoria or the (E)EWISE and RESSIAR/TRANSSIMS project. The participation fee includes lunch and coffee breaks. URL:https://edmforum.eu/event/good-emc-engineering-practices-for-large-machines-systems-and-installations/ CATEGORIES:Partner Events END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20190221T000000 DTEND;TZID=Europe/Brussels:20190221T000000 DTSTAMP:20260709T154758 CREATED:20231212T224241Z LAST-MODIFIED:20240725T100828Z UID:1940-1550707200-1550707200@edmforum.eu SUMMARY:Webinar 2019-2-21: Thermal Management of Electronic Systems DESCRIPTION:Presented by: Bart Vandevelde – imec \n\n\n\nIn this webinar\, we will present the basics on thermal management for electronic systems. We will give an introduction on how to make first order basic calculations for the maximum temperatures in a system\, give an overview on possible cooling techniques and when you need forces air flow or liquid cooling. We will also give some guidance on how to perform a detailed thermal design of your system based on advanced simulation software and validating experiments. \n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n Thermal Management of Electronic Systems\n \n \n \n \n 1 file(s) 3.28 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Thermal Management of Electronic Systems – video\n \n \n \n \n 1 file(s) 32.06 MB\n \n \n Login to download. URL:https://edmforum.eu/event/webinar-12thermal-management-of-electronic-systems/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20181122T100000 DTEND;TZID=Europe/Brussels:20181122T110000 DTSTAMP:20260709T154758 CREATED:20231212T224241Z LAST-MODIFIED:20240725T101309Z UID:1939-1542880800-1542884400@edmforum.eu SUMMARY:Webinar 2018-11-22: Highly Accelerated Life Testing DESCRIPTION:Presented by: Davy Pissoort – KU Leuven \n\n\n\nOver the last decade\, a new efficient way of improving the robustness of an electronic product has been developed: Highly Accelerated Lifetime Testing (HALT). With HALT\, one will stress the product far beyond its operational specifications in order to quickly find and fix the weakest points in the design. As such\, HALT stimulates failures in contrast to conventional\, accelerated environmental tests which are pass/fail tests that try to simulate the normal\, expected environment that the product will encounter (design verification tests). As such\, HALT allows to drastically increase the operational margins of the product and\, hence\, the over-all reliability of the product. In this presentation we will give an overview of how a typical HALT tests is done as well as the main do’s and don’ts. \n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n Highly Accelerated Life Testing\n \n \n \n \n 1 file(s) 1.98 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Highly Accelerated Life Testing – video\n \n \n \n \n 1 file(s) 26.54 MB\n \n \n Login to download. URL:https://edmforum.eu/event/webinar-11halt/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20181107T140000 DTEND;TZID=Europe/Brussels:20181107T161500 DTSTAMP:20260709T154758 CREATED:20231212T224212Z LAST-MODIFIED:20240726T075137Z UID:1911-1541599200-1541607300@edmforum.eu SUMMARY:EDM Workshop 30: Smart NPI DESCRIPTION:Smart products that build-up the Internet of Things are often highly innovative and mandate a short time-to-market. A traditional product development approach applying experience based (conservative) design rules and extensive qualification tests is obsolete. A high level of predictive power regarding manufacturability\, supply chain readiness\, quality and reliability\, cost\, etc. is demanded from an agile New Product Introduction methodology for Smart Products. Geert Willems\, imec\, will present the basic elements of a Predictive NPI approach as well as its practical implementation. \n\n\n\nShort time-to-market for new products and rapid scale-up of production\, keeping product cost low and quality high\, are especially challenging for a startup company. To accomplish this allóra Factory works intensively together with imec’s\, Center of Electronics Design & Manufacturing (cEDM) from imec. Tom De Ryck will present allóra Factory’s NPI process and how they leverage the cEDM offering. \n\n\n\nTo transform a Smart Product idea into a prototype and industrial product rapidly one needs to know the manufacturing capabilities. Involving manufacturing knowledge and experience is imperative. Eurocircuits\, a local prototype Printed Circuit Board supplier\, introduced the philosophy of “The Optimum Design Flow” and offers its online “Smart Menus”\, “DRC-“ and “DFM functionality” for this purpose. Dirk Stans will explain how these tools facilitate the rapid\, low cost production of prototypes “Right First Time” within budget and on time. \n\n\n\nFrom the perspective of an internationally operating OEM company\, Lena Eeckhout\, Barco\, will elaborate further on the challenges of matching electronic product design to the capabilities of multiple manufacturing suppliers. She will explain on how the concept of the “Printed Board Assembly (PBA) passport” opens the doors to an international supply chain. \n\n\n\nAgenda \n\n\n\n14h00Introduction14h05Predictive New Product Introduction for Smart ProductsGeert Willems\, imec14h35New Product Introduction Process in a Startup CompanyTom De Ryck\, allóra Factory15h05 Think before you act\, leads to “right first time”Dirk Stans\, Eurocircuits15h35World Wide NPI: the PBA Passport opens the manufacturing doorsLena Eeckhout\, Barco16h05The Smart Product InitiativeBas Rottier\, Sirris\n\n\n\n\n\n\n\n \n \n \n \n \n \n EDM Workshop 30 program\n \n \n \n \n 1 file(s) 223.94 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Intro EDM Workshop 30\n \n \n \n \n 1 file(s) 315.78 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n Predictive New Product Introduction for Smart Products\n \n \n \n \n 1 file(s) 1.58 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n New Product Introduction Process in a Startup Company\n \n \n \n \n 1 file(s) 3.17 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Think Before You Act\, Leads to “Right First Time”\n \n \n \n \n 1 file(s) 5.02 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n World Wide NPI: the PBA Passport Opens the Manufacturing Doors\n \n \n \n \n 1 file(s) 1.44 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n The Smart Product Initiative\n \n \n \n \n 1 file(s) 643.56 KB\n \n \n Login to download. URL:https://edmforum.eu/event/cedm-workshop-30smart-npi/ LOCATION:Kortrijk Expo\, Doorniksesteenweg 216\, Kortrijk\, 8500\, Belgium CATEGORIES:Workshop END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20181107T000000 DTEND;TZID=Europe/Brussels:20181108T235900 DTSTAMP:20260709T154758 CREATED:20241011T092051Z LAST-MODIFIED:20241011T094223Z UID:9064-1541548800-1541721540@edmforum.eu SUMMARY:D&E Event 2018 DESCRIPTION:Op 7 november 2018 vindt het D&E Event plaats in Technopolis te Mechelen. Ontmoet hier ontwikkelaars en toepassers van embedded systems\, ontdek de laatste technologieën en wissel visies en ervaringen uit met vakgenoten.Specifieke thema’s tijdens dit event zijn FPGA\, Security\, Internet of Things\, Electronic Design & Production en Embedded. \n\n\n\n\n\nEDM contribution:\n\n\n\n\n\n \n \n \n \n \n \n Predictive New Product Introduction for Smart Products – D&E Event 2018\n \n \n \n \n 1 file(s) 2 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\nAbstract: Smart products that build-up the Internet of Things are often highly innovative and mandate a short time-to-market. A traditional product development approach applying experience based (conservative) design rules and extensive qualfication tests is obsolete. A smart New Product Introduction methodology is required “to go where no-one has gone before”. A high level of predictive power regarding manufacturability\, supply chain readiness\, quality and reliability\, cost\, etc. is demanded from an agile New Product Introduction methodology for Smart Products. Science allows us to predict that what we have never experienced before. The basic elements of such a science-based Predictive NPI approach – technology qualification\, quality and reliability physics and virtual prototyping – will be presented as well as its practical implementation \n\n\n\nLocations:7 November: Technopolis\, Mechelen8 November: Van der Valk Hotel\, Eindhoven\, Nederland URL:https://edmforum.eu/event/de-event-2018/ CATEGORIES:Events with EDM contribution END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20181016T130000 DTEND;TZID=Europe/Brussels:20181016T163000 DTSTAMP:20260709T154758 CREATED:20240726T122141Z LAST-MODIFIED:20240726T122646Z UID:5871-1539694800-1539707400@edmforum.eu SUMMARY:PBA Technology Seminar and Factory Visit DESCRIPTION:PBA Technology Seminar 2018 Newtec\n \n \n \n \n 1 file(s) 217.46 KB\n \n \n Download URL:https://edmforum.eu/event/pba-technology-seminar-and-factory-visit-2/ LOCATION:Newtec Manufacturing Competence Centre\, Joseph Cardijnstraat 10\, Erpe-Mere\, 9420\, Belgium CATEGORIES:Technology seminar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20180913T100000 DTEND;TZID=Europe/Brussels:20180913T110000 DTSTAMP:20260709T154758 CREATED:20231212T224241Z LAST-MODIFIED:20240725T101238Z UID:1938-1536832800-1536836400@edmforum.eu SUMMARY:Webinar 2018-9-13: Bending Cycling as Fast Alternative for Thermal Cycling  DESCRIPTION:Presented by: Bart Vandevelde (imec) \n\n\n\nIn particular for testing of the board level interconnect reliability of components\, bending cycling can be an interesting alternative for regular thermal cycling. The main gain lies in the testing time. The four point bending stresses the interconnections in a similar way as in thermal cycling\, but as the test can be performed at constant temperature\, the cycle rate can be easily increased without the issue of heating and cooling the total thermal mass.In this webinar\, we will explain the concept for four-point bending cycling of soldered components and how it can be related to thermal cycling. Also test results for CSP and QFN components will be shown\, which proofs the usefulness of this alternative testing approach.  \n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n Bending Cycling as Fast Alternative for Thermal Cycling \n \n \n \n \n 1 file(s) 1.80 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Bending Cycling as Fast Alternative for Thermal Cycling – video\n \n \n \n \n 1 file(s) 23.82 MB\n \n \n Download URL:https://edmforum.eu/event/webinar-10four-point-bending/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20180621T103000 DTEND;TZID=Europe/Brussels:20180621T110000 DTSTAMP:20260709T154758 CREATED:20231212T224241Z LAST-MODIFIED:20240725T101208Z UID:1937-1529577000-1529578800@edmforum.eu SUMMARY:Webinar 2018-6-21: Mission Profiles of Electronics DESCRIPTION:Presented by: Tania Drissen – Sirris \n\n\n\nProduct reliability is gaining importance because of today’s increasing overall complexity of products. In a product’s design for reliability knowing the actual loads that will act on the product during its lifetime is key. The life cycle profile describes these different loads and their variation over time throughout the entire product life. This lifecycle profile guideline provides a step-by-step approach to identify all relevant life cycle phases\, situations and loads for a physical system. It aims to be a methodology for product designers who want to pursue a design for reliability approach for their current and future products. \n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n Mission Profiles of Electronic Products\n \n \n \n \n 1 file(s) 3.78 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Mission profiles of Electronic Products – video\n \n \n \n \n 1 file(s) 24.47 MB\n \n \n Login to download. URL:https://edmforum.eu/event/webinar-9mission-profiles/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20180620T084500 DTEND;TZID=Europe/Brussels:20180620T180000 DTSTAMP:20260709T154758 CREATED:20241009T102250Z LAST-MODIFIED:20241009T102306Z UID:8869-1529484300-1529517600@edmforum.eu SUMMARY:Flanders Make: Mechatronics 4.0 - Masterclass V DESCRIPTION:Best practices toward robust sensing & control of your system\n\n\n\nThe Mechatronica 4.0 project aims to help Flemish companies to put the Industry 4.0 philosophy into practice. Sensing and control technology will be a key feature of the next generation of autonomous\, safety and inspection systems\, and it is the focus of our next Mechatronics 4.0 Masterclass. The aim of this masterclass is to inform you about the possibilities of sensing and control systems\, to provide you insights into how to integrate these systems into products or production systems and how to develop them in an effective way. \n\n\n\n\n\nTypical questions that will be addressed during the masterclass: \n\n\n\n\nWhich control technique fits my application?\n\n\n\nWhat can learning control add to my product?\n\n\n\nWhich hardware and toolchain can I use to develop my system?\n\n\n\nHow do I put model-based control design into practise. In addition\, the Mechatronics 4.0 project members will present their views on sensing and control technology\, which enable the realisation of smart\, adaptive products. The different themes will be illustrated with industrial use cases.\n\n\n\n\nAgenda:  \n\n\n\n08:45 Registration09:25 Welcome & Introduction to ‘VIS-traject Mechatronics 4.0’ – Stijn Gielis\, Sirris10:00 Sensing and control technology\, what is in it for me? – Abdellatif Bey-Temsamani and Bruno Depraetere\, Flanders Make10:45 Open loop control\, Modern smart products – Maarten Witters\, Flanders Make11:15 Coffee break11:30 PID control: application Scanning laser hardening and vibration suppression applications – Mats Vande Cavey and Bruno Depraetere\, Flanders Make12:00 How and why going from PID to learning / adaptive control? Uncertainty and variability in machines with repetitive tasks – Erik Hostens\, Flanders Make12:30 Company Testimonial I13:00 – Lunch & Demos \n\n\n\n\nLight Catcher – adaptive (learning) control\n\n\n\nModular drive train setup – control of magnetic bearing\n\n\n\nSmall Jacquard set-up – model based control\n\n\n\nDevelopment platforms Tractor\n\n\n\nMDAVD Evoque II – comparison of a lateral control algorithm with a human driver\n\n\n\nSit control/Locator demo – navigate an AGV through a factory environment\n\n\n\nAdditive manufacturing trajectories optimisation\n\n\n\n\n15:00 Path planning navigation. Automated guided vehicle and Additive Manufacturing applications Kurt Geebelen\, Nathan Dwek and Anke Van Campen\, Flanders Make15:30 Model-based control design in practise – Toolchain. Practical implementation\, testing and validation of controllers Bruno Depraetere\, Flanders Make16:00 – Company Testimonial II16:30 – Round table discussion (questions tuned to interest from welcome session)17:00 – Network drink  \n\n\n\nParticipation fee:  \n\n\n\n\nMembers Mechatronica 4.0: free\n\n\n\nMembers Sirris / Flanders Make: 150 € (ex VAT)\n\n\n\nNon-members: 300 € (ex VAT)\n\n\n\n\nLocation: Sirris/Flanders Make – Celestijnenlaan 300\, 3001 Leuven URL:https://edmforum.eu/event/flanders-make-mechatronics-4-0-masterclass-v/ CATEGORIES:Partner Events END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20180605T130000 DTEND;TZID=Europe/Brussels:20180605T170000 DTSTAMP:20260709T154758 CREATED:20231212T224208Z LAST-MODIFIED:20240729T081447Z UID:1907-1528203600-1528218000@edmforum.eu SUMMARY:PBA Reliability Seminar and Factory Visit DESCRIPTION:PBA Reliability Seminar 2018\n \n \n \n \n 1 file(s) 195.88 KB\n \n \n Download URL:https://edmforum.eu/event/pba-reliability-seminar-2/ LOCATION:Jabil Hasselt\, Corda campus 5\, Hasselt\, B3500 CATEGORIES:Technology seminar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20180531T130000 DTEND;TZID=Europe/Brussels:20180531T163000 DTSTAMP:20260709T154758 CREATED:20240726T120545Z LAST-MODIFIED:20240726T120941Z UID:5867-1527771600-1527784200@edmforum.eu SUMMARY:PBA Technology Seminar and Factory Visit DESCRIPTION:PBA Technology Seminar 2018 TBP\n \n \n \n \n 1 file(s) 174.14 KB\n \n \n Download URL:https://edmforum.eu/event/pba-technology-seminar-and-factory-visit/ LOCATION:TBP Dirksland\, Vlakbodem 10\, Dirksland\, 3247 CP\, Netherlands CATEGORIES:Technology seminar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20180523T143000 DTEND;TZID=Europe/Brussels:20180523T164500 DTSTAMP:20260709T154758 CREATED:20231212T224208Z LAST-MODIFIED:20240726T075108Z UID:1906-1527085800-1527093900@edmforum.eu SUMMARY:EDM Workshop 29: Flexibel Electronics DESCRIPTION:Flexible substrates have found their way into a wide range of applications\, even if we are not always aware of it. With the benefits of adaptability to 3D shapes\, multiple bendability\, compact design and weight reduction comes the complexity of the design and manufacturing of flexible electronics. \n\n\n\nThese benefits have led to an increased demand in flex and flex-rigid PCBs. Joachim Verhegge of PCB manufacturer ACB explains the specifics of flex and flex-rigid substrate design and manufacturing. \n\n\n\nFlex substrates provides the advantage of reducing the amount of cables and connectors combined with the integration of electronic components. The presentation of Daniel Thommen of Microdul gives an overview and examples of SMT and Chip-On-Board assembly processes on flexible substrates and its challenges. \n\n\n\nWim Christiaens of Quad will introduce us – among others – to membrane switch technology and innovative printed sensor solutions. He will show promising applications for printed electronics such as smart automotive surfaces and electronic medical patches. \n\n\n\nFrederick Bossuyt of CMST will give an overview of the developments on stretchable electronics. On one hand\, elastically deformable circuits suitable for wearable applications and on the other hand one-time deformable electronic circuits opening new possibilities for user interfaces\, lighting\, etc. \n\n\n\nAgenda \n\n\n\n14h30IntroductionAdvantages and challenges of flex-rigid PCB TechnologyJoachim Verhegge\, CPO – ACBAssembly Challenges using Flex Substrates.Daniel Thommen\, Head Module Development – Microdul AGChallenges and opportunities in printed electronics manufacturingWim Christiaens\, R&D Director – Quad IndustriesStretchable circuitsFrederick Bossuyt\, teamleader – imec/uGent16h45Visit Demo Exhibition\n\n\n\n\n\n\n\n \n \n \n \n \n \n EDM Workshop 29 program\n \n \n \n \n 1 file(s) 155.52 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n Advantages and Challenges of Flex-Rigid PCB Technology\n \n \n \n \n 1 file(s) 1.67 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Assembly Challenges Using Flex Substrates\n \n \n \n \n 1 file(s) 1.13 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Challenges and Opportunities in Printed Electronics Manufacturing\n \n \n \n \n 1 file(s) 2.82 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Stretchable Circuits\n \n \n \n \n 1 file(s) 4.47 MB\n \n \n Login to download. URL:https://edmforum.eu/event/cedm-workshop-29flexibel-electronics/ LOCATION:Flanders Meeting & Convention Center\, Koningin Astridplein 22\, Antwerpen\, 2000\, Belgium CATEGORIES:Workshop END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20180516T000000 DTEND;TZID=Europe/Brussels:20180519T235959 DTSTAMP:20260709T154758 CREATED:20241009T100342Z LAST-MODIFIED:20241009T102405Z UID:8864-1526428800-1526774399@edmforum.eu SUMMARY:Advanced Engineering 2018 DESCRIPTION:Locatie: Flanders Expo\, Gent \n\n\n\n\n\n\n\n\n\n\n\nAdvanced Engineering is een gloednieuw event voor de creatie en de vervaardiging van vernieuwende producten. Alle aspecten komen aan bod: ontwerp\, engineeringsproces en prototyping\, materialen en componenten\, alsook connectiviteit. Advanced Engineering\, dat zijn twee vliegen in één klap: een gratis beurs met meer dan 100 standhouders die u helpen om uw producten klaar te maken voor de toekomst in combinatie met een krachtig congres met meer dan 50 topsprekers. \n\n\n\n\n\nOntmoet meer dan 100 standhouders\, experten en pioniers die helpen om uw producten future-proof te maken. Want sparren met collega’s uit andere sectoren helpt echt! Update uw kennis tijdens het uitgebreide congres met meer dan 50 sprekers. Ontdek een groot aanbod aan hoogtechnologische staaltjes tijdens de Experience tour. Verbreed uw netwerk met experten uit de smart electronics industrie tijdens het DSP Valley Matchmaking Event. Ga mee op exclusief bezoek bij Volvo Car Gent.  \n\n\n\nAgenda: Thursday\, May 17\, 2018 \n\n\n\n10:00 – 14:00 Planery Inspiration sessions12:00 – 14:00 Beursbezoek14:00 – 14:15 Welkom (Kris Van de Voorde – imec)14:15 – 14:45: New Product Introduction methodology for reliable smart products (Geert Willems – imec) \n\n\n\n\n\n \n \n \n \n \n \n New Product Introduction Methodology for Reliable Smart Products\n \n \n \n \n 1 file(s) 3 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\nAbstract: Smart products are often deployed in significant numbers in an always connected and active network. Therefore\, the availability and operationability of the smart application depends critically on the reliability of the build-in electronics. The smart products are often highly innovative and mandate a short time-to-market. A traditional product development approach applying (conservative) design rules and extensive qualfication tests based on field experience is obsolete. An agile New Product Introduction methodology is required. The basic elements of such an NPI approach – Physics-of-Failure\, science based technology qualification and virtual prototyping – will be presented. \n\n\n\n14:45 – 15:15: Smart productivity: data analytics optimizing machine uptime and maintenance (Sofie Van Hoecke – Ugent & imec)15:15 – 16:00: Smart connectivity: Materials\, machinery and product flow monitoring (Eli De Poorter – Ugent & imec)16:00 Mogelijkheid om de beurs te bezoeken URL:https://edmforum.eu/event/advanced-engineering-2018/ CATEGORIES:Events with EDM contribution END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20180329T140000 DTEND;TZID=Europe/Brussels:20180329T170000 DTSTAMP:20260709T154758 CREATED:20231212T224258Z LAST-MODIFIED:20241008T154908Z UID:1953-1522332000-1522342800@edmforum.eu SUMMARY:Expert Discussion Forum: Can electronics sense its own health? DESCRIPTION:In the frame of the preparation of an SBO (‘strategisch basisonderzoek’) project proposal\, we would like to invite industrial research and technical experts in the field of electronics design to support us in defining the research objectives and end goal(s) of the project.The project lies in the field of Prognostic Health Monitoring (PHM) for electronic systems. PHM is a key enabling technology where the extent of degradation is monitored in a self-learning electronic system providing early warning of failure and a Remaining Useful Life time estimation. The solution we aim for is based on a hybrid approach. On one side\, we add sensors to the systems that are measuring direct or indirect physical degradation of the system. On the other side\, all relevant electrical and mission profile data is collected over time and leads to self-learning systems able to predict their own health\, or the health of similar systems elsewhere in the field.It is obvious that this is an extremely challenging objective and that the project needs focus to be realistic within the budget and time restrictions. We also aim for project results that are relevant and useful for the local industry at the end of the project\, allowing for implementation in your technologies. Logical next steps for industrial valorisation after the SBO project are O&O (Onderzoek en Ontwikkeling) projects. \n\n\n\nAgenda \n\n\n\nPresentations introducing the topic:“How the world moves\, step by step\, from Fides/Mil (constant failure rate) towards Physics of Failure based life time predictions for electronic systems” (Geert Willems\, imec) \n\n\n\n\n\n \n \n \n \n \n \n Physics-of-Failure Based Reliability Assessment of Electronics\n \n \n \n \n 1 file(s) 1 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n“Data-driven system health monitoring” (Elena Tsiporkova\, Sirris) \n\n\n\n\n\n \n \n \n \n \n \n Data-driven system health monitoring\n \n \n \n \n 1 file(s) 2 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n“State of the art on Prognostic Health Monitoring for Electronic Systems” (Bart Vandevelde\, imec) \n\n\n\n\n\n \n \n \n \n \n \n State of the art on Prognostic Health Monitoring for Electronic Systems\n \n \n \n \n 1 file(s) 709 KB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n“Towards PHM self-awareness – share some experience from the mechanical world” (Jeroen Firlefijn\, Atlas Copco) \n\n\n\n\nOpen discussion on\n\nCommon electronics reliability challenges\n\n\n\nSense and need for upcoming failure sensing\n\n\n\nExpectation from the industry for a strategic basic research (SBO) project focusing on near-failure sensing of electronics\n\n\n\nValorisation of SBO project results through industrial O&O projects\n\n\n\n\n\nConclusion / Next steps\n\n\n\n\nLocatie: Sirris Gent\, Technologiepark 935\, Zwijnaarde URL:https://edmforum.eu/event/expert-discussion-forumcan-electronics-sense-its-own-health/ CATEGORIES:Events,Events with EDM contribution END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20180323T130000 DTEND;TZID=Europe/Brussels:20180323T170000 DTSTAMP:20260709T154758 CREATED:20240726T115537Z LAST-MODIFIED:20240726T120952Z UID:5861-1521810000-1521824400@edmforum.eu SUMMARY:PCB Technology Seminar and Factory Visit DESCRIPTION:PCB Technology Seminar 2018 Program\n \n \n \n \n 1 file(s) 143.89 KB\n \n \n Download URL:https://edmforum.eu/event/pcb-technology-seminar-and-factory-visit-5/ LOCATION:ACB\, Vosmeer 3\, Dendermonde\, +3252202030\, 9200\, Belgium CATEGORIES:Technology seminar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20180301T000000 DTEND;TZID=Europe/Brussels:20180301T000000 DTSTAMP:20260709T154758 CREATED:20231212T224241Z LAST-MODIFIED:20240725T101124Z UID:1936-1519862400-1519862400@edmforum.eu SUMMARY:Webinar 2018-3-1: New Solder Joint Compositions: a Literature Review on Reliability DESCRIPTION:Presented by: Bart Vandevelde and Riet Labie – imec \n\n\n\nIn the first years after the introduction of the RoHS directive in 2006\, SnAgCu (SAC) with Ag percentage between 3 and 4.5% was the main solder composition used by the industry to replace SnPb solder. However\, in the recent years\, many new lead-free compositions were and are being introduced by the industry. This can be triggered by cost reasons (e.g. lower Ag content)\, a lower process temperature or to improve the reliability.In this webinar\, we will give an overview on the thermal cycling and mechanical shock reliability of these new compositions\, based on studies published in literature. \n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n New Solder Joint Compositions: a Literature Review on Reliability\n \n \n \n \n 1 file(s) 3.18 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n New Solder Joint Compositions: a Literature Review on Reliability – video\n \n \n \n \n 1 file(s) 15.44 MB\n \n \n Login to download. URL:https://edmforum.eu/event/webinar-8new-solder-joint-compositions/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20180118T150000 DTEND;TZID=Europe/Brussels:20180118T193000 DTSTAMP:20260709T154758 CREATED:20231212T224135Z LAST-MODIFIED:20240726T075042Z UID:1879-1516287600-1516303800@edmforum.eu SUMMARY:EDM Workshop 28: Reliable Electronics for Aerospace DESCRIPTION:Challenges of segmented supply chains in component qualification for space \n\n\n\nIn the past\, homogeneous Integrated Device Manufacturers (IDMs) were responsible for electrical\, electronic and electromechanical part development and manufacturing. Over the last 20 years things have changed\, many manufacturers only retain their core competence\, and heavily rely on outsourcing. The more this supply chain is segmented the more complex the qualification process becomes. This presentation focusses on the challenges of this segmented supply chain and how to deal with it in the qualification process. \n\n\n\nAutomatization for large solar panels assembly“Industry 4.0” technologies\, are developed to better control the processes to master product quality.Solar panels being a large subsystem they represent the opportunity to identify and address technology building blocks used elsewhere in every satellite while giving enough load to be automated in a facility.The “New Space” trend to cut down costs through a change of culture implies a new approach in our industry\, where both volumes are low and standards are tailored to address one-shot production. \n\n\n\nTechnological concepts for assembly of highly reliable electronic componentsSince 50 years\, FSL has contributed to aerospace programs with electronics where thick-film technology\, chip-and-wire processes and hermetic encapsulation are key technological drivers. Due to this experience\, FSL was certified from the DLR as assembly- and testhouse for power components. Today\, qualified power FET assemblies are available and the qualification for high-voltage diode assemblies is in progress. Currently\, motor-driver electronics for the EnMAP mission are in production. This presentation is highlighting some of the proven technological concepts as used for the assembly of electronics for aerospace applications. \n\n\n\nLight weight Hermetic PackagingLow weight is of crucial importance for anything that goes into space.The aerospace industry uses hermetic Au plated packages for housing ceramic based electronic devices and these packages are traditionally made of either heavy CuMo or CuW\, for matched thermal expansion.CPS Technologies offers a 40-60% lighter alternative in the form of hermetic packages made of AlSiC.Brazed ceramic or glass feedthrus can be used and these packages meet the requirements of Mil-PRF-38534. \n\n\n\nContribution of multiphysics simulation to reliable microsystem packagingFor a growing number of applications having to perform in demanding conditions such as high temperature pressure sensors\, automotive MEMS-micromirror\, vibration based energy harvester\, the need for high dimensional stability\, increased accuracy and predictable performances raises the standards for the design of microsystem devices. Whether in the vibration environment of a machine or the thermo-mechanical solicitations found in Microsystems\, this interdependency translates into a more frequent need of elaborate\, coupled\, Multiphysics analysis capabilities to study the devices’ interactions with their support\, package and environment during their design in order to increase their robustness. \n\n\n\nAgenda \n\n\n\n15h00Challenges of segmented supply chains in component qualification for spacePaavo Heiskanen – ESA15h30Automatization for large solar panels assemblyElie Dawidowicz – Thales Alenia Space16h00Technological concepts for assembly of highly reliable electronic componentsBenjamin Riedmueller – First Sensor17h00Light weight Hermetic PackagingGio Schouten – Semi Dice17h30Contribution of multiphysics simulation to reliable microsystem packagingPascal De Vincenzo\, Open Engineering18h00Networkiing – Clean Room visit\n\n\n\n\n\n\n\n \n \n \n \n \n \n iMAPS-Benelux Winter Event 2018 program\n \n \n \n \n 1 file(s) 114.23 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n Challenges of Segmented Supply Chains in Component Qualification for Space\n \n \n \n \n 1 file(s) 3.51 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Automation of Space Solar Panels Assembly\n \n \n \n \n 1 file(s) 984.13 KB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Reliable Electronics for Aerospace\n \n \n \n \n 1 file(s) 3.32 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Aluminum Silicon Carbide – Description and Applications\n \n \n \n \n 1 file(s) 19.81 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Contribution of Multiphysics Simulation to Reliable Microsystem Packaging\n \n \n \n \n 1 file(s) 5.38 MB\n \n \n Login to download. URL:https://edmforum.eu/event/cedm-workshop-28reliable-electronics-for-aerospace/ LOCATION:Imec Leuven\, Kapeldreef 75\, Leuven\, 3001\, Belgium CATEGORIES:Workshop END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20180111T000000 DTEND;TZID=Europe/Brussels:20180111T000000 DTSTAMP:20260709T154758 CREATED:20231212T224231Z LAST-MODIFIED:20240725T101047Z UID:1935-1515628800-1515628800@edmforum.eu SUMMARY:Webinar 2018-1-11: EMI Risk management DESCRIPTION:Davy Pissoort – KU Leuven \n\n\n\nEveryone has already been confronted with Electro-Magnetic Interference (EMI)\, ranging from an annoying buzz in a stereo when receiving a phone call to a computer crashing during a lightning storm. Frustrating\, but not life threatening. However\, two trends warrant appropriate concern: (i) high-tech electronics is being used more and more for safety-related functions\, (ii) electronic devices are increasingly vulnerable to EMI because of a lower intrinsic immunity and an increasingly severe electromagnetic environment. Combined expertise in Electro-Magnetic Compatibility (EMC) and Functional Safety (FS) will gain huge importance in many sectors like automotive\, robotics medical\, railways\, avionics\,… Unfortunately\, EMC and FS have evolved separately and share no concepts nor terminology.EMI Risk Management must go well beyond the current state-of-the-art in classical EMC engineering.This webinar will guide you on how you should deal with EMI risks in your functional safety process for your electronic products. \n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n EMI Risk Management\n \n \n \n \n 1 file(s) 2.27 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n EMI Risk Management – video\n \n \n \n \n 1 file(s) 37.25 MB\n \n \n Login to download. URL:https://edmforum.eu/event/webinar-7emi-risk-management/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20171208T140000 DTEND;TZID=Europe/Brussels:20171208T190000 DTSTAMP:20260709T154758 CREATED:20231212T224119Z LAST-MODIFIED:20240726T074903Z UID:1867-1512741600-1512759600@edmforum.eu SUMMARY:EDM Event 2017: Security and Reliability of Electronics DESCRIPTION:Electronics Everywhere\, Everything Connected\, Internet of Things (IoT)\, City of Things\, Industry 4.0 all imply a distributed network of a large number of electronic devices that must be able to handle confidential\, safety critical or other secured data in a reliable way. With 50 billion active devices by 2020 it is likely that security incidents will increase as well as the failure probability of the network. A high level of network availability throughout the envisaged operational lifetime is essential. Security and reliability of electronics is key for IoT. The relationship between both will be explored in this event. \n\n\n\nWe selected four speakers for you to highlight different security and reliability aspects.Ulrich Seldeslachts\, LSEC\, will explain you how to implement security-thinking into electronics design as well as the importance of the supply of qualified components and reliable electronics.The payment industry is characterized by a high level of security. With the rise of “always connected” devices\, the need for the same type of protection is emerging in a lot of other industries. Peter Timmermans\, ATOS Worldline\, will present the attacks against which we have to protect a payment terminal\, how this can be realized and what are the consequences of this type of precautions.Obviously\, electronic device failures are unwanted. Surprisingly\, the unique features of certain IC transistor failure mechanisms can be exploited to create low cost\, high security solutions. Thomas Kallstenius\, imec\, introduces you into the world of security embedding in Integrated Circuits.Electronics reliability is the main theme in today’s cEDM activities. Geert Willems\, imec\, will explain why Physics-of-Failure based Design-for-Reliability is essential for the development of reliably operating secured electronics networks. \n\n\n\nAgenda \n\n\n\n14h00Welcome14h10Security Design Thinking for Industrializing IoT and Industry 4.0.Ulrich Seldeslachts – LSEC – Leaders in Security14h40Hardware Security in the payment industryPeter Timmermans – ATOS Worldline15h10Failure mechanisms turned into an asset: new ways of embedding key security elements in IC’sThomas Kallstenius – imec15h40Towards Physics-of-Failure based “Reliable-by-Design” electronicsGeert Willems – imec16h10Q&A and networking\n\n\n\n\n\n\n\n \n \n \n \n \n \n EDM Event 2017 program\n \n \n \n \n 1 file(s) 188.20 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Intro EDM Event 2017\n \n \n \n \n 1 file(s) 915.15 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Security Design Thinking for Industrializing IoT and Industry 4.0\n \n \n \n \n 1 file(s) 5.16 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Hardware Security in the Payment Industry\n \n \n \n \n 1 file(s) 2.00 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Failure Mechanisms Turned into an Asset: New Ways of Embedding Key Security Elements in IC’s\n \n \n \n \n 1 file(s) 1.96 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Towards Physics-of-Failure Based “Reliable-by-Design” Electronics\n \n \n \n \n 1 file(s) 2.53 MB\n \n \n Login to download. URL:https://edmforum.eu/event/cedm-event-5/ LOCATION:Imec Leuven\, Kapeldreef 75\, Leuven\, 3001\, Belgium CATEGORIES:EDM event END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20171108T110000 DTEND;TZID=Europe/Brussels:20171108T120000 DTSTAMP:20260709T154758 CREATED:20231212T224231Z LAST-MODIFIED:20240725T101014Z UID:1934-1510138800-1510142400@edmforum.eu SUMMARY:Webinar 2017-11-8: Plated Through Hole Via Failure DESCRIPTION:Presented by: Bart Vandevelde – imec \n\n\n\nIn cEDM’s ‘reliability FMEA’ tool\, we listed about 15 different failure mechanisms which over time can lead to electrical malfunctioning of the Printed Circuit Board (PCB) itself. One of the most dominant failures which are purely related to the PCB\, is fracturing of the copper plated through hole via’s. These are induced by the thermal expansion mismatch between the plated copper via and the surrounding epoxy/glass material. Due to this CTE mismatch\, the copper is stressed during solder reflow cycles and during operational temperature cycling. Both multiple solder reflows and numerous temperature cycles can lead to cracked via’s.In this webinar\, we will explain the basics of this PTH via failure mechanism\, what are the design and material parameters accelerating this failure and how the life time of your particular PCB with 100-1000 via’s can be calculated. This latter one is needed to finally guarantee that PTH via failures will not occur during the required life time of the PCB. \n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n Plated Through Hole Via Failures: Is This a Risk for My Design?\n \n \n \n \n 1 file(s) 2.40 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Plated Through Hole Via Failures: Is This a Risk for My Design? – video\n \n \n \n \n 1 file(s) 26.70 MB\n \n \n Download URL:https://edmforum.eu/event/webinar-6plated-through-hole-via-failure/ CATEGORIES:Webinar END:VEVENT END:VCALENDAR