BEGIN:VCALENDAR VERSION:2.0 PRODID:-//EDM Forum - ECPv6.15.12.2//NONSGML v1.0//EN CALSCALE:GREGORIAN METHOD:PUBLISH X-WR-CALNAME:EDM Forum X-ORIGINAL-URL:https://edmforum.eu X-WR-CALDESC:Events for EDM Forum REFRESH-INTERVAL;VALUE=DURATION:PT1H X-Robots-Tag:noindex X-PUBLISHED-TTL:PT1H BEGIN:VTIMEZONE TZID:Europe/Brussels BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20160327T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20161030T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20170326T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20171029T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20180325T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20181028T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20190331T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20191027T010000 END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20181107T140000 DTEND;TZID=Europe/Brussels:20181107T161500 DTSTAMP:20260709T085821 CREATED:20231212T224212Z LAST-MODIFIED:20240726T075137Z UID:1911-1541599200-1541607300@edmforum.eu SUMMARY:EDM Workshop 30: Smart NPI DESCRIPTION:Smart products that build-up the Internet of Things are often highly innovative and mandate a short time-to-market. A traditional product development approach applying experience based (conservative) design rules and extensive qualification tests is obsolete. A high level of predictive power regarding manufacturability\, supply chain readiness\, quality and reliability\, cost\, etc. is demanded from an agile New Product Introduction methodology for Smart Products. Geert Willems\, imec\, will present the basic elements of a Predictive NPI approach as well as its practical implementation. \n\n\n\nShort time-to-market for new products and rapid scale-up of production\, keeping product cost low and quality high\, are especially challenging for a startup company. To accomplish this allóra Factory works intensively together with imec’s\, Center of Electronics Design & Manufacturing (cEDM) from imec. Tom De Ryck will present allóra Factory’s NPI process and how they leverage the cEDM offering. \n\n\n\nTo transform a Smart Product idea into a prototype and industrial product rapidly one needs to know the manufacturing capabilities. Involving manufacturing knowledge and experience is imperative. Eurocircuits\, a local prototype Printed Circuit Board supplier\, introduced the philosophy of “The Optimum Design Flow” and offers its online “Smart Menus”\, “DRC-“ and “DFM functionality” for this purpose. Dirk Stans will explain how these tools facilitate the rapid\, low cost production of prototypes “Right First Time” within budget and on time. \n\n\n\nFrom the perspective of an internationally operating OEM company\, Lena Eeckhout\, Barco\, will elaborate further on the challenges of matching electronic product design to the capabilities of multiple manufacturing suppliers. She will explain on how the concept of the “Printed Board Assembly (PBA) passport” opens the doors to an international supply chain. \n\n\n\nAgenda \n\n\n\n14h00Introduction14h05Predictive New Product Introduction for Smart ProductsGeert Willems\, imec14h35New Product Introduction Process in a Startup CompanyTom De Ryck\, allóra Factory15h05 Think before you act\, leads to “right first time”Dirk Stans\, Eurocircuits15h35World Wide NPI: the PBA Passport opens the manufacturing doorsLena Eeckhout\, Barco16h05The Smart Product InitiativeBas Rottier\, Sirris\n\n\n\n\n\n\n\n \n \n \n \n \n \n EDM Workshop 30 program\n \n \n \n \n 1 file(s) 223.94 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Intro EDM Workshop 30\n \n \n \n \n 1 file(s) 315.78 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n Predictive New Product Introduction for Smart Products\n \n \n \n \n 1 file(s) 1.58 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n New Product Introduction Process in a Startup Company\n \n \n \n \n 1 file(s) 3.17 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Think Before You Act\, Leads to “Right First Time”\n \n \n \n \n 1 file(s) 5.02 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n World Wide NPI: the PBA Passport Opens the Manufacturing Doors\n \n \n \n \n 1 file(s) 1.44 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n The Smart Product Initiative\n \n \n \n \n 1 file(s) 643.56 KB\n \n \n Login to download. URL:https://edmforum.eu/event/cedm-workshop-30smart-npi/ LOCATION:Kortrijk Expo\, Doorniksesteenweg 216\, Kortrijk\, 8500\, Belgium CATEGORIES:Workshop END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20181107T000000 DTEND;TZID=Europe/Brussels:20181108T235900 DTSTAMP:20260709T085821 CREATED:20241011T092051Z LAST-MODIFIED:20241011T094223Z UID:9064-1541548800-1541721540@edmforum.eu SUMMARY:D&E Event 2018 DESCRIPTION:Op 7 november 2018 vindt het D&E Event plaats in Technopolis te Mechelen. Ontmoet hier ontwikkelaars en toepassers van embedded systems\, ontdek de laatste technologieën en wissel visies en ervaringen uit met vakgenoten.Specifieke thema’s tijdens dit event zijn FPGA\, Security\, Internet of Things\, Electronic Design & Production en Embedded. \n\n\n\n\n\nEDM contribution:\n\n\n\n\n\n \n \n \n \n \n \n Predictive New Product Introduction for Smart Products – D&E Event 2018\n \n \n \n \n 1 file(s) 2 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\nAbstract: Smart products that build-up the Internet of Things are often highly innovative and mandate a short time-to-market. A traditional product development approach applying experience based (conservative) design rules and extensive qualfication tests is obsolete. A smart New Product Introduction methodology is required “to go where no-one has gone before”. A high level of predictive power regarding manufacturability\, supply chain readiness\, quality and reliability\, cost\, etc. is demanded from an agile New Product Introduction methodology for Smart Products. Science allows us to predict that what we have never experienced before. The basic elements of such a science-based Predictive NPI approach – technology qualification\, quality and reliability physics and virtual prototyping – will be presented as well as its practical implementation \n\n\n\nLocations:7 November: Technopolis\, Mechelen8 November: Van der Valk Hotel\, Eindhoven\, Nederland URL:https://edmforum.eu/event/de-event-2018/ CATEGORIES:Events with EDM contribution END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20181016T130000 DTEND;TZID=Europe/Brussels:20181016T163000 DTSTAMP:20260709T085821 CREATED:20240726T122141Z LAST-MODIFIED:20240726T122646Z UID:5871-1539694800-1539707400@edmforum.eu SUMMARY:PBA Technology Seminar and Factory Visit DESCRIPTION:PBA Technology Seminar 2018 Newtec\n \n \n \n \n 1 file(s) 217.46 KB\n \n \n Download URL:https://edmforum.eu/event/pba-technology-seminar-and-factory-visit-2/ LOCATION:Newtec Manufacturing Competence Centre\, Joseph Cardijnstraat 10\, Erpe-Mere\, 9420\, Belgium CATEGORIES:Technology seminar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20180913T100000 DTEND;TZID=Europe/Brussels:20180913T110000 DTSTAMP:20260709T085821 CREATED:20231212T224241Z LAST-MODIFIED:20240725T101238Z UID:1938-1536832800-1536836400@edmforum.eu SUMMARY:Webinar 2018-9-13: Bending Cycling as Fast Alternative for Thermal Cycling  DESCRIPTION:Presented by: Bart Vandevelde (imec) \n\n\n\nIn particular for testing of the board level interconnect reliability of components\, bending cycling can be an interesting alternative for regular thermal cycling. The main gain lies in the testing time. The four point bending stresses the interconnections in a similar way as in thermal cycling\, but as the test can be performed at constant temperature\, the cycle rate can be easily increased without the issue of heating and cooling the total thermal mass.In this webinar\, we will explain the concept for four-point bending cycling of soldered components and how it can be related to thermal cycling. Also test results for CSP and QFN components will be shown\, which proofs the usefulness of this alternative testing approach.  \n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n Bending Cycling as Fast Alternative for Thermal Cycling \n \n \n \n \n 1 file(s) 1.80 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Bending Cycling as Fast Alternative for Thermal Cycling – video\n \n \n \n \n 1 file(s) 23.82 MB\n \n \n Download URL:https://edmforum.eu/event/webinar-10four-point-bending/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20180621T103000 DTEND;TZID=Europe/Brussels:20180621T110000 DTSTAMP:20260709T085821 CREATED:20231212T224241Z LAST-MODIFIED:20240725T101208Z UID:1937-1529577000-1529578800@edmforum.eu SUMMARY:Webinar 2018-6-21: Mission Profiles of Electronics DESCRIPTION:Presented by: Tania Drissen – Sirris \n\n\n\nProduct reliability is gaining importance because of today’s increasing overall complexity of products. In a product’s design for reliability knowing the actual loads that will act on the product during its lifetime is key. The life cycle profile describes these different loads and their variation over time throughout the entire product life. This lifecycle profile guideline provides a step-by-step approach to identify all relevant life cycle phases\, situations and loads for a physical system. It aims to be a methodology for product designers who want to pursue a design for reliability approach for their current and future products. \n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n Mission Profiles of Electronic Products\n \n \n \n \n 1 file(s) 3.78 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Mission profiles of Electronic Products – video\n \n \n \n \n 1 file(s) 24.47 MB\n \n \n Login to download. URL:https://edmforum.eu/event/webinar-9mission-profiles/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20180620T084500 DTEND;TZID=Europe/Brussels:20180620T180000 DTSTAMP:20260709T085821 CREATED:20241009T102250Z LAST-MODIFIED:20241009T102306Z UID:8869-1529484300-1529517600@edmforum.eu SUMMARY:Flanders Make: Mechatronics 4.0 - Masterclass V DESCRIPTION:Best practices toward robust sensing & control of your system\n\n\n\nThe Mechatronica 4.0 project aims to help Flemish companies to put the Industry 4.0 philosophy into practice. Sensing and control technology will be a key feature of the next generation of autonomous\, safety and inspection systems\, and it is the focus of our next Mechatronics 4.0 Masterclass. The aim of this masterclass is to inform you about the possibilities of sensing and control systems\, to provide you insights into how to integrate these systems into products or production systems and how to develop them in an effective way. \n\n\n\n\n\nTypical questions that will be addressed during the masterclass: \n\n\n\n\nWhich control technique fits my application?\n\n\n\nWhat can learning control add to my product?\n\n\n\nWhich hardware and toolchain can I use to develop my system?\n\n\n\nHow do I put model-based control design into practise. In addition\, the Mechatronics 4.0 project members will present their views on sensing and control technology\, which enable the realisation of smart\, adaptive products. The different themes will be illustrated with industrial use cases.\n\n\n\n\nAgenda:  \n\n\n\n08:45 Registration09:25 Welcome & Introduction to ‘VIS-traject Mechatronics 4.0’ – Stijn Gielis\, Sirris10:00 Sensing and control technology\, what is in it for me? – Abdellatif Bey-Temsamani and Bruno Depraetere\, Flanders Make10:45 Open loop control\, Modern smart products – Maarten Witters\, Flanders Make11:15 Coffee break11:30 PID control: application Scanning laser hardening and vibration suppression applications – Mats Vande Cavey and Bruno Depraetere\, Flanders Make12:00 How and why going from PID to learning / adaptive control? Uncertainty and variability in machines with repetitive tasks – Erik Hostens\, Flanders Make12:30 Company Testimonial I13:00 – Lunch & Demos \n\n\n\n\nLight Catcher – adaptive (learning) control\n\n\n\nModular drive train setup – control of magnetic bearing\n\n\n\nSmall Jacquard set-up – model based control\n\n\n\nDevelopment platforms Tractor\n\n\n\nMDAVD Evoque II – comparison of a lateral control algorithm with a human driver\n\n\n\nSit control/Locator demo – navigate an AGV through a factory environment\n\n\n\nAdditive manufacturing trajectories optimisation\n\n\n\n\n15:00 Path planning navigation. Automated guided vehicle and Additive Manufacturing applications Kurt Geebelen\, Nathan Dwek and Anke Van Campen\, Flanders Make15:30 Model-based control design in practise – Toolchain. Practical implementation\, testing and validation of controllers Bruno Depraetere\, Flanders Make16:00 – Company Testimonial II16:30 – Round table discussion (questions tuned to interest from welcome session)17:00 – Network drink  \n\n\n\nParticipation fee:  \n\n\n\n\nMembers Mechatronica 4.0: free\n\n\n\nMembers Sirris / Flanders Make: 150 € (ex VAT)\n\n\n\nNon-members: 300 € (ex VAT)\n\n\n\n\nLocation: Sirris/Flanders Make – Celestijnenlaan 300\, 3001 Leuven URL:https://edmforum.eu/event/flanders-make-mechatronics-4-0-masterclass-v/ CATEGORIES:Partner Events END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20180605T130000 DTEND;TZID=Europe/Brussels:20180605T170000 DTSTAMP:20260709T085821 CREATED:20231212T224208Z LAST-MODIFIED:20240729T081447Z UID:1907-1528203600-1528218000@edmforum.eu SUMMARY:PBA Reliability Seminar and Factory Visit DESCRIPTION:PBA Reliability Seminar 2018\n \n \n \n \n 1 file(s) 195.88 KB\n \n \n Download URL:https://edmforum.eu/event/pba-reliability-seminar-2/ LOCATION:Jabil Hasselt\, Corda campus 5\, Hasselt\, B3500 CATEGORIES:Technology seminar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20180531T130000 DTEND;TZID=Europe/Brussels:20180531T163000 DTSTAMP:20260709T085821 CREATED:20240726T120545Z LAST-MODIFIED:20240726T120941Z UID:5867-1527771600-1527784200@edmforum.eu SUMMARY:PBA Technology Seminar and Factory Visit DESCRIPTION:PBA Technology Seminar 2018 TBP\n \n \n \n \n 1 file(s) 174.14 KB\n \n \n Download URL:https://edmforum.eu/event/pba-technology-seminar-and-factory-visit/ LOCATION:TBP Dirksland\, Vlakbodem 10\, Dirksland\, 3247 CP\, Netherlands CATEGORIES:Technology seminar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20180523T143000 DTEND;TZID=Europe/Brussels:20180523T164500 DTSTAMP:20260709T085821 CREATED:20231212T224208Z LAST-MODIFIED:20240726T075108Z UID:1906-1527085800-1527093900@edmforum.eu SUMMARY:EDM Workshop 29: Flexibel Electronics DESCRIPTION:Flexible substrates have found their way into a wide range of applications\, even if we are not always aware of it. With the benefits of adaptability to 3D shapes\, multiple bendability\, compact design and weight reduction comes the complexity of the design and manufacturing of flexible electronics. \n\n\n\nThese benefits have led to an increased demand in flex and flex-rigid PCBs. Joachim Verhegge of PCB manufacturer ACB explains the specifics of flex and flex-rigid substrate design and manufacturing. \n\n\n\nFlex substrates provides the advantage of reducing the amount of cables and connectors combined with the integration of electronic components. The presentation of Daniel Thommen of Microdul gives an overview and examples of SMT and Chip-On-Board assembly processes on flexible substrates and its challenges. \n\n\n\nWim Christiaens of Quad will introduce us – among others – to membrane switch technology and innovative printed sensor solutions. He will show promising applications for printed electronics such as smart automotive surfaces and electronic medical patches. \n\n\n\nFrederick Bossuyt of CMST will give an overview of the developments on stretchable electronics. On one hand\, elastically deformable circuits suitable for wearable applications and on the other hand one-time deformable electronic circuits opening new possibilities for user interfaces\, lighting\, etc. \n\n\n\nAgenda \n\n\n\n14h30IntroductionAdvantages and challenges of flex-rigid PCB TechnologyJoachim Verhegge\, CPO – ACBAssembly Challenges using Flex Substrates.Daniel Thommen\, Head Module Development – Microdul AGChallenges and opportunities in printed electronics manufacturingWim Christiaens\, R&D Director – Quad IndustriesStretchable circuitsFrederick Bossuyt\, teamleader – imec/uGent16h45Visit Demo Exhibition\n\n\n\n\n\n\n\n \n \n \n \n \n \n EDM Workshop 29 program\n \n \n \n \n 1 file(s) 155.52 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n Advantages and Challenges of Flex-Rigid PCB Technology\n \n \n \n \n 1 file(s) 1.67 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Assembly Challenges Using Flex Substrates\n \n \n \n \n 1 file(s) 1.13 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Challenges and Opportunities in Printed Electronics Manufacturing\n \n \n \n \n 1 file(s) 2.82 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Stretchable Circuits\n \n \n \n \n 1 file(s) 4.47 MB\n \n \n Login to download. URL:https://edmforum.eu/event/cedm-workshop-29flexibel-electronics/ LOCATION:Flanders Meeting & Convention Center\, Koningin Astridplein 22\, Antwerpen\, 2000\, Belgium CATEGORIES:Workshop END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20180516T000000 DTEND;TZID=Europe/Brussels:20180519T235959 DTSTAMP:20260709T085821 CREATED:20241009T100342Z LAST-MODIFIED:20241009T102405Z UID:8864-1526428800-1526774399@edmforum.eu SUMMARY:Advanced Engineering 2018 DESCRIPTION:Locatie: Flanders Expo\, Gent \n\n\n\n\n\n\n\n\n\n\n\nAdvanced Engineering is een gloednieuw event voor de creatie en de vervaardiging van vernieuwende producten. Alle aspecten komen aan bod: ontwerp\, engineeringsproces en prototyping\, materialen en componenten\, alsook connectiviteit. Advanced Engineering\, dat zijn twee vliegen in één klap: een gratis beurs met meer dan 100 standhouders die u helpen om uw producten klaar te maken voor de toekomst in combinatie met een krachtig congres met meer dan 50 topsprekers. \n\n\n\n\n\nOntmoet meer dan 100 standhouders\, experten en pioniers die helpen om uw producten future-proof te maken. Want sparren met collega’s uit andere sectoren helpt echt! Update uw kennis tijdens het uitgebreide congres met meer dan 50 sprekers. Ontdek een groot aanbod aan hoogtechnologische staaltjes tijdens de Experience tour. Verbreed uw netwerk met experten uit de smart electronics industrie tijdens het DSP Valley Matchmaking Event. Ga mee op exclusief bezoek bij Volvo Car Gent.  \n\n\n\nAgenda: Thursday\, May 17\, 2018 \n\n\n\n10:00 – 14:00 Planery Inspiration sessions12:00 – 14:00 Beursbezoek14:00 – 14:15 Welkom (Kris Van de Voorde – imec)14:15 – 14:45: New Product Introduction methodology for reliable smart products (Geert Willems – imec) \n\n\n\n\n\n \n \n \n \n \n \n New Product Introduction Methodology for Reliable Smart Products\n \n \n \n \n 1 file(s) 3 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\nAbstract: Smart products are often deployed in significant numbers in an always connected and active network. Therefore\, the availability and operationability of the smart application depends critically on the reliability of the build-in electronics. The smart products are often highly innovative and mandate a short time-to-market. A traditional product development approach applying (conservative) design rules and extensive qualfication tests based on field experience is obsolete. An agile New Product Introduction methodology is required. The basic elements of such an NPI approach – Physics-of-Failure\, science based technology qualification and virtual prototyping – will be presented. \n\n\n\n14:45 – 15:15: Smart productivity: data analytics optimizing machine uptime and maintenance (Sofie Van Hoecke – Ugent & imec)15:15 – 16:00: Smart connectivity: Materials\, machinery and product flow monitoring (Eli De Poorter – Ugent & imec)16:00 Mogelijkheid om de beurs te bezoeken URL:https://edmforum.eu/event/advanced-engineering-2018/ CATEGORIES:Events with EDM contribution END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20180329T140000 DTEND;TZID=Europe/Brussels:20180329T170000 DTSTAMP:20260709T085821 CREATED:20231212T224258Z LAST-MODIFIED:20241008T154908Z UID:1953-1522332000-1522342800@edmforum.eu SUMMARY:Expert Discussion Forum: Can electronics sense its own health? DESCRIPTION:In the frame of the preparation of an SBO (‘strategisch basisonderzoek’) project proposal\, we would like to invite industrial research and technical experts in the field of electronics design to support us in defining the research objectives and end goal(s) of the project.The project lies in the field of Prognostic Health Monitoring (PHM) for electronic systems. PHM is a key enabling technology where the extent of degradation is monitored in a self-learning electronic system providing early warning of failure and a Remaining Useful Life time estimation. The solution we aim for is based on a hybrid approach. On one side\, we add sensors to the systems that are measuring direct or indirect physical degradation of the system. On the other side\, all relevant electrical and mission profile data is collected over time and leads to self-learning systems able to predict their own health\, or the health of similar systems elsewhere in the field.It is obvious that this is an extremely challenging objective and that the project needs focus to be realistic within the budget and time restrictions. We also aim for project results that are relevant and useful for the local industry at the end of the project\, allowing for implementation in your technologies. Logical next steps for industrial valorisation after the SBO project are O&O (Onderzoek en Ontwikkeling) projects. \n\n\n\nAgenda \n\n\n\nPresentations introducing the topic:“How the world moves\, step by step\, from Fides/Mil (constant failure rate) towards Physics of Failure based life time predictions for electronic systems” (Geert Willems\, imec) \n\n\n\n\n\n \n \n \n \n \n \n Physics-of-Failure Based Reliability Assessment of Electronics\n \n \n \n \n 1 file(s) 1 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n“Data-driven system health monitoring” (Elena Tsiporkova\, Sirris) \n\n\n\n\n\n \n \n \n \n \n \n Data-driven system health monitoring\n \n \n \n \n 1 file(s) 2 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n“State of the art on Prognostic Health Monitoring for Electronic Systems” (Bart Vandevelde\, imec) \n\n\n\n\n\n \n \n \n \n \n \n State of the art on Prognostic Health Monitoring for Electronic Systems\n \n \n \n \n 1 file(s) 709 KB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n“Towards PHM self-awareness – share some experience from the mechanical world” (Jeroen Firlefijn\, Atlas Copco) \n\n\n\n\nOpen discussion on\n\nCommon electronics reliability challenges\n\n\n\nSense and need for upcoming failure sensing\n\n\n\nExpectation from the industry for a strategic basic research (SBO) project focusing on near-failure sensing of electronics\n\n\n\nValorisation of SBO project results through industrial O&O projects\n\n\n\n\n\nConclusion / Next steps\n\n\n\n\nLocatie: Sirris Gent\, Technologiepark 935\, Zwijnaarde URL:https://edmforum.eu/event/expert-discussion-forumcan-electronics-sense-its-own-health/ CATEGORIES:Events,Events with EDM contribution END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20180323T130000 DTEND;TZID=Europe/Brussels:20180323T170000 DTSTAMP:20260709T085821 CREATED:20240726T115537Z LAST-MODIFIED:20240726T120952Z UID:5861-1521810000-1521824400@edmforum.eu SUMMARY:PCB Technology Seminar and Factory Visit DESCRIPTION:PCB Technology Seminar 2018 Program\n \n \n \n \n 1 file(s) 143.89 KB\n \n \n Download URL:https://edmforum.eu/event/pcb-technology-seminar-and-factory-visit-5/ LOCATION:ACB\, Vosmeer 3\, Dendermonde\, +3252202030\, 9200\, Belgium CATEGORIES:Technology seminar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20180301T000000 DTEND;TZID=Europe/Brussels:20180301T000000 DTSTAMP:20260709T085821 CREATED:20231212T224241Z LAST-MODIFIED:20240725T101124Z UID:1936-1519862400-1519862400@edmforum.eu SUMMARY:Webinar 2018-3-1: New Solder Joint Compositions: a Literature Review on Reliability DESCRIPTION:Presented by: Bart Vandevelde and Riet Labie – imec \n\n\n\nIn the first years after the introduction of the RoHS directive in 2006\, SnAgCu (SAC) with Ag percentage between 3 and 4.5% was the main solder composition used by the industry to replace SnPb solder. However\, in the recent years\, many new lead-free compositions were and are being introduced by the industry. This can be triggered by cost reasons (e.g. lower Ag content)\, a lower process temperature or to improve the reliability.In this webinar\, we will give an overview on the thermal cycling and mechanical shock reliability of these new compositions\, based on studies published in literature. \n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n New Solder Joint Compositions: a Literature Review on Reliability\n \n \n \n \n 1 file(s) 3.18 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n New Solder Joint Compositions: a Literature Review on Reliability – video\n \n \n \n \n 1 file(s) 15.44 MB\n \n \n Login to download. URL:https://edmforum.eu/event/webinar-8new-solder-joint-compositions/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20180118T150000 DTEND;TZID=Europe/Brussels:20180118T193000 DTSTAMP:20260709T085821 CREATED:20231212T224135Z LAST-MODIFIED:20240726T075042Z UID:1879-1516287600-1516303800@edmforum.eu SUMMARY:EDM Workshop 28: Reliable Electronics for Aerospace DESCRIPTION:Challenges of segmented supply chains in component qualification for space \n\n\n\nIn the past\, homogeneous Integrated Device Manufacturers (IDMs) were responsible for electrical\, electronic and electromechanical part development and manufacturing. Over the last 20 years things have changed\, many manufacturers only retain their core competence\, and heavily rely on outsourcing. The more this supply chain is segmented the more complex the qualification process becomes. This presentation focusses on the challenges of this segmented supply chain and how to deal with it in the qualification process. \n\n\n\nAutomatization for large solar panels assembly“Industry 4.0” technologies\, are developed to better control the processes to master product quality.Solar panels being a large subsystem they represent the opportunity to identify and address technology building blocks used elsewhere in every satellite while giving enough load to be automated in a facility.The “New Space” trend to cut down costs through a change of culture implies a new approach in our industry\, where both volumes are low and standards are tailored to address one-shot production. \n\n\n\nTechnological concepts for assembly of highly reliable electronic componentsSince 50 years\, FSL has contributed to aerospace programs with electronics where thick-film technology\, chip-and-wire processes and hermetic encapsulation are key technological drivers. Due to this experience\, FSL was certified from the DLR as assembly- and testhouse for power components. Today\, qualified power FET assemblies are available and the qualification for high-voltage diode assemblies is in progress. Currently\, motor-driver electronics for the EnMAP mission are in production. This presentation is highlighting some of the proven technological concepts as used for the assembly of electronics for aerospace applications. \n\n\n\nLight weight Hermetic PackagingLow weight is of crucial importance for anything that goes into space.The aerospace industry uses hermetic Au plated packages for housing ceramic based electronic devices and these packages are traditionally made of either heavy CuMo or CuW\, for matched thermal expansion.CPS Technologies offers a 40-60% lighter alternative in the form of hermetic packages made of AlSiC.Brazed ceramic or glass feedthrus can be used and these packages meet the requirements of Mil-PRF-38534. \n\n\n\nContribution of multiphysics simulation to reliable microsystem packagingFor a growing number of applications having to perform in demanding conditions such as high temperature pressure sensors\, automotive MEMS-micromirror\, vibration based energy harvester\, the need for high dimensional stability\, increased accuracy and predictable performances raises the standards for the design of microsystem devices. Whether in the vibration environment of a machine or the thermo-mechanical solicitations found in Microsystems\, this interdependency translates into a more frequent need of elaborate\, coupled\, Multiphysics analysis capabilities to study the devices’ interactions with their support\, package and environment during their design in order to increase their robustness. \n\n\n\nAgenda \n\n\n\n15h00Challenges of segmented supply chains in component qualification for spacePaavo Heiskanen – ESA15h30Automatization for large solar panels assemblyElie Dawidowicz – Thales Alenia Space16h00Technological concepts for assembly of highly reliable electronic componentsBenjamin Riedmueller – First Sensor17h00Light weight Hermetic PackagingGio Schouten – Semi Dice17h30Contribution of multiphysics simulation to reliable microsystem packagingPascal De Vincenzo\, Open Engineering18h00Networkiing – Clean Room visit\n\n\n\n\n\n\n\n \n \n \n \n \n \n iMAPS-Benelux Winter Event 2018 program\n \n \n \n \n 1 file(s) 114.23 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n Challenges of Segmented Supply Chains in Component Qualification for Space\n \n \n \n \n 1 file(s) 3.51 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Automation of Space Solar Panels Assembly\n \n \n \n \n 1 file(s) 984.13 KB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Reliable Electronics for Aerospace\n \n \n \n \n 1 file(s) 3.32 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Aluminum Silicon Carbide – Description and Applications\n \n \n \n \n 1 file(s) 19.81 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Contribution of Multiphysics Simulation to Reliable Microsystem Packaging\n \n \n \n \n 1 file(s) 5.38 MB\n \n \n Login to download. URL:https://edmforum.eu/event/cedm-workshop-28reliable-electronics-for-aerospace/ LOCATION:Imec Leuven\, Kapeldreef 75\, Leuven\, 3001\, Belgium CATEGORIES:Workshop END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20180111T000000 DTEND;TZID=Europe/Brussels:20180111T000000 DTSTAMP:20260709T085821 CREATED:20231212T224231Z LAST-MODIFIED:20240725T101047Z UID:1935-1515628800-1515628800@edmforum.eu SUMMARY:Webinar 2018-1-11: EMI Risk management DESCRIPTION:Davy Pissoort – KU Leuven \n\n\n\nEveryone has already been confronted with Electro-Magnetic Interference (EMI)\, ranging from an annoying buzz in a stereo when receiving a phone call to a computer crashing during a lightning storm. Frustrating\, but not life threatening. However\, two trends warrant appropriate concern: (i) high-tech electronics is being used more and more for safety-related functions\, (ii) electronic devices are increasingly vulnerable to EMI because of a lower intrinsic immunity and an increasingly severe electromagnetic environment. Combined expertise in Electro-Magnetic Compatibility (EMC) and Functional Safety (FS) will gain huge importance in many sectors like automotive\, robotics medical\, railways\, avionics\,… Unfortunately\, EMC and FS have evolved separately and share no concepts nor terminology.EMI Risk Management must go well beyond the current state-of-the-art in classical EMC engineering.This webinar will guide you on how you should deal with EMI risks in your functional safety process for your electronic products. \n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n EMI Risk Management\n \n \n \n \n 1 file(s) 2.27 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n EMI Risk Management – video\n \n \n \n \n 1 file(s) 37.25 MB\n \n \n Login to download. URL:https://edmforum.eu/event/webinar-7emi-risk-management/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20171208T140000 DTEND;TZID=Europe/Brussels:20171208T190000 DTSTAMP:20260709T085821 CREATED:20231212T224119Z LAST-MODIFIED:20240726T074903Z UID:1867-1512741600-1512759600@edmforum.eu SUMMARY:EDM Event 2017: Security and Reliability of Electronics DESCRIPTION:Electronics Everywhere\, Everything Connected\, Internet of Things (IoT)\, City of Things\, Industry 4.0 all imply a distributed network of a large number of electronic devices that must be able to handle confidential\, safety critical or other secured data in a reliable way. With 50 billion active devices by 2020 it is likely that security incidents will increase as well as the failure probability of the network. A high level of network availability throughout the envisaged operational lifetime is essential. Security and reliability of electronics is key for IoT. The relationship between both will be explored in this event. \n\n\n\nWe selected four speakers for you to highlight different security and reliability aspects.Ulrich Seldeslachts\, LSEC\, will explain you how to implement security-thinking into electronics design as well as the importance of the supply of qualified components and reliable electronics.The payment industry is characterized by a high level of security. With the rise of “always connected” devices\, the need for the same type of protection is emerging in a lot of other industries. Peter Timmermans\, ATOS Worldline\, will present the attacks against which we have to protect a payment terminal\, how this can be realized and what are the consequences of this type of precautions.Obviously\, electronic device failures are unwanted. Surprisingly\, the unique features of certain IC transistor failure mechanisms can be exploited to create low cost\, high security solutions. Thomas Kallstenius\, imec\, introduces you into the world of security embedding in Integrated Circuits.Electronics reliability is the main theme in today’s cEDM activities. Geert Willems\, imec\, will explain why Physics-of-Failure based Design-for-Reliability is essential for the development of reliably operating secured electronics networks. \n\n\n\nAgenda \n\n\n\n14h00Welcome14h10Security Design Thinking for Industrializing IoT and Industry 4.0.Ulrich Seldeslachts – LSEC – Leaders in Security14h40Hardware Security in the payment industryPeter Timmermans – ATOS Worldline15h10Failure mechanisms turned into an asset: new ways of embedding key security elements in IC’sThomas Kallstenius – imec15h40Towards Physics-of-Failure based “Reliable-by-Design” electronicsGeert Willems – imec16h10Q&A and networking\n\n\n\n\n\n\n\n \n \n \n \n \n \n EDM Event 2017 program\n \n \n \n \n 1 file(s) 188.20 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Intro EDM Event 2017\n \n \n \n \n 1 file(s) 915.15 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Security Design Thinking for Industrializing IoT and Industry 4.0\n \n \n \n \n 1 file(s) 5.16 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Hardware Security in the Payment Industry\n \n \n \n \n 1 file(s) 2.00 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Failure Mechanisms Turned into an Asset: New Ways of Embedding Key Security Elements in IC’s\n \n \n \n \n 1 file(s) 1.96 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Towards Physics-of-Failure Based “Reliable-by-Design” Electronics\n \n \n \n \n 1 file(s) 2.53 MB\n \n \n Login to download. URL:https://edmforum.eu/event/cedm-event-5/ LOCATION:Imec Leuven\, Kapeldreef 75\, Leuven\, 3001\, Belgium CATEGORIES:EDM event END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20171108T110000 DTEND;TZID=Europe/Brussels:20171108T120000 DTSTAMP:20260709T085821 CREATED:20231212T224231Z LAST-MODIFIED:20240725T101014Z UID:1934-1510138800-1510142400@edmforum.eu SUMMARY:Webinar 2017-11-8: Plated Through Hole Via Failure DESCRIPTION:Presented by: Bart Vandevelde – imec \n\n\n\nIn cEDM’s ‘reliability FMEA’ tool\, we listed about 15 different failure mechanisms which over time can lead to electrical malfunctioning of the Printed Circuit Board (PCB) itself. One of the most dominant failures which are purely related to the PCB\, is fracturing of the copper plated through hole via’s. These are induced by the thermal expansion mismatch between the plated copper via and the surrounding epoxy/glass material. Due to this CTE mismatch\, the copper is stressed during solder reflow cycles and during operational temperature cycling. Both multiple solder reflows and numerous temperature cycles can lead to cracked via’s.In this webinar\, we will explain the basics of this PTH via failure mechanism\, what are the design and material parameters accelerating this failure and how the life time of your particular PCB with 100-1000 via’s can be calculated. This latter one is needed to finally guarantee that PTH via failures will not occur during the required life time of the PCB. \n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n Plated Through Hole Via Failures: Is This a Risk for My Design?\n \n \n \n \n 1 file(s) 2.40 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Plated Through Hole Via Failures: Is This a Risk for My Design? – video\n \n \n \n \n 1 file(s) 26.70 MB\n \n \n Download URL:https://edmforum.eu/event/webinar-6plated-through-hole-via-failure/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170928T093000 DTEND;TZID=Europe/Brussels:20170928T190000 DTSTAMP:20260709T085821 CREATED:20241008T101307Z LAST-MODIFIED:20241008T101308Z UID:8783-1506591000-1506625200@edmforum.eu SUMMARY:Flanders Make Second Seminar Day 2017: How do companies tackle technological hurdles? DESCRIPTION:During this Seminar Day\, engineers\, researchers and R&D managers from the manufacturing industry will come together to learn more about the results of some of our recent projects. In 3 parallel sessions\, project managers and industrial partners will elaborate on their newly acquired knowledge and on concrete cases that help companies to innovate. Each track has its own focus. \n\n\n\n\n\nTrack 1 digs deeper into the re-conception of product development processes and joining technologies for new (multi-)materials.Track 2 develops Model Based System Engineering (MBSE)\, for intelligent development methods allowing interim virtual design validation.Track 3 combines 3 very diverse projects\, providing insights in new production technologies\, learning control and sensor monitoring. At the start of every session\, you can chose which track to follow and you can join as many sessions as you want.  \n\n\n\nEDM contribution \n\n\n\nTitle: PoF qualification: physical & virtual testing of electronic components and systemsAbstract: Before electronic systems can be launched on the market\, they must pass qualification tests according to international standards and customer-specified test programmes. Thermal and mechanical environmental loads are major causes for electronic system failures that also appear during these qualification tests. It is obvious that any failure detected in such tests is very expensive in terms of time and cost. Performing physical & virtual testing allows to find possible weak spots in the system in an early development phase when adaptations are still easy to make. In this seminar\, we will show several examples on how reliability testing and simulation are used to test the electronic components and systems from a thermal and mechanical point of view. \n\n\n\nAgenda:  \n\n\n\n09h30 – 10h30 Welcome10h30 – 12h00– Multi-material joining techniques– Multi-physical monitoring for optimal mechatronic system design– Integrating a multi-axial machining centre and laser hardening for prototypes and small complex series12h – 13h Sandwich lunch13h – 15h– Metamaterials to provide lightweight NVH solutions: realization through thermoforming– Model-based conceptual design and synthesis– Learning control15h – 15h30 Coffee brea15h30 – 17h30– Utilising the full lightweight potential of sheet material products– How to design reliable & robust electronic products?– Cost-effective vibro-acoustic monitoring17h30 Networking drink \n\n\n\nParticipation fee:  \n\n\n\n\nFlanders Make member company: 50 € (95 € for the 2 sessions)\n\n\n\nNon-member company: 95 € (195 € for the 2 sessions)\n\n\n\n\nLocation: The Business Faculty\, Sint-Lendriksborre 6\, 1120 Neder-Over-Heembeek URL:https://edmforum.eu/event/flanders-make-second-seminar-day-2017-how-do-companies-tackle-technological-hurdles/ CATEGORIES:Events with EDM contribution,Partner Events END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170927T110000 DTEND;TZID=Europe/Brussels:20170927T203000 DTSTAMP:20260709T085821 CREATED:20241008T150144Z LAST-MODIFIED:20241008T150255Z UID:8845-1506510000-1506544200@edmforum.eu SUMMARY:GSA Entrepreneurship Conference DESCRIPTION:European start-ups have traditionally been a tremendous source of innovation in the semiconductor industry. However\, two major difficulties limit their technological and business impact on the global market: raising capital and obtaining specific start-up support. \n\n\n\n\n\nThe Conference is the meeting place for start-ups\, strategic investors\, financial investors and everyone else who cares about the future of semiconductor and technology innovation in Europe. Our speakers will share their personal experiences in financing\, IPO and acquisition exits for startups\, as well as discussing the most promising areas of innovation in the European and global semiconductor ecosystem. \n\n\n\nAgenda: 11:00   Registration11:50   Hors d’Oeuvres and Networking12:40   Introduction – Sandro Grigolli\, EMEA Executive Director\, GSA12:50   Welcome Remarks – Maria Marced\, Chairwoman\, GSA EMEA Leadership Council13:00   Opening Keynote: The State of European Innovation – Luc Van den hove\, President & CEO\, imec13:30   Session #1: The Entrepreneurs’ Perspective – Lessons Learned            Movidius: a European Success Story – Remi El Ouazzane\, VP and GM\, Intel\, former CEO Movidius            A Serial Entrepreneur: Lessons Learned – Nigel Toon\, Co-Founder and CEO\, Graphcore            A Young Entrepreneur: Lessons Learned – Luca Verre\, CEO & Co-Founder\, Chronocam14:30   Networking Break15:05   Session #1 (continued) Panel Discussion with Q&A moderated by Jean Michel Deligny\, Co-Founder and Managing Director\, Silverpeak            Remi El Ouazzane\, VP and GM\, Intel\, former CEO Movidius            Nigel Toon\, Co-Founder and CEO\, Graphcore            Luca Verre\, CEO & Co-Founder\, Chronocam15:35   Session #2: The Strategic Investors’ Perspective – Access to Innovation            A New Framework for Startups-Corporates Collaboration – Harald Hamster\, VP Strategy Development\, Infineon            5G and Industry 4.0 driving European innovation – Volker Ziegler\, Head of 5G Leadership\, Chief Architect\, Nokia Mobile Networks16:15   Start Up Elevator Pitches16:45   Networking Break17:20   Session #3: The Venture Capitalists’ Perspective – Financing Startups            Financing Startups to Accelerate Growth – Hongquan Jiang\, Managing Partner\, Robert Bosch Venture Capital            Backing Europe’s Most Ambitious Entrepreneurs – Brian Caulfield\, Managing Partner\, Draper Esprit            Technology Investments to Exploit Major Growth Opportunities – Helen McBreen\, Investment Director\, Atlantic Bridge            A Focus on Micro/nano-electronics and Advanced Materials – Lou Hermans\, Partner\, Capital-E Panel Discussion and Moderated Q & A by Peter Vanbekbergen\, Partner\, imec.xpand19:15   Closing Remarks19:25   Belgian Beer Tasting and Hors d’Oeuvres20:25   Adjournment  \n\n\n\nParticipation fee: Free for GSA Members100 € – VAT for non-members URL:https://edmforum.eu/event/gsa-entrepreneurship-conference/ LOCATION:Imec Leuven\, Kapeldreef 75\, Leuven\, 3001\, Belgium CATEGORIES:Partner Events END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170922T133000 DTEND;TZID=Europe/Brussels:20170922T180000 DTSTAMP:20260709T085821 CREATED:20231212T224315Z LAST-MODIFIED:20240726T074719Z UID:1965-1506087000-1506103200@edmforum.eu SUMMARY:EDM Workshop 27: How Autonomous and Electric Cars Push the Need for More Reliable Electronics DESCRIPTION:The automotive industry is facing two major evolutions in the coming years: the move towards autonomous driving and the transformation from combustion to 100% electric cars. It is obvious that these trends push the demand for more electronic components and systems\, but also increase the requirements towards reliability of these components/systems. In this workshop\, several stakeholders of the automotive electronics industry will show their view on how to deal with design for reliability (DfR)\, production\, standardisation and system integration of electronics in automotive products for which reliability is an essential property. \n\n\n\nAgenda \n\n\n\n13h00Welcome13h30Next Generation Approaches for Reliability of Automotive Smart SystemsPrzemyslaw Jakub Gromala – Robert BoschAutomotive electronic components qualification standards and guidelines: update of the current status. Daniel Vanderstraeten – ON Semiconductor Belgium14h45Coffee Break15h15Challenges for future connected and automated carsPatrick Pype – NXP Semiconductors BelgiumImproving the reliability of electronic systems using pottingHarold Haspeslagh – Ninix TechnologiescEDM’s DfR for automotive electronics: experiences and strategyBart Vandevelde – Imec16h45Networking\n\n\n\n\n\n\n\n \n \n \n \n \n \n EDM Workshop 27 program\n \n \n \n \n 1 file(s) 176.56 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Intro EDM Workshop 27\n \n \n \n \n 1 file(s) 517.73 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n Automotive Electronic Components Qualification Standards and Guidelines\n \n \n \n \n 1 file(s) 504.48 KB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Challenges for Future Connected and Automated Cars\n \n \n \n \n 1 file(s) 3.32 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Improving the Reliability of Electronic Systems Using Potting \n \n \n \n \n 1 file(s) 1.83 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n cEDM’s DfR for Automotive Electronics: Experiences and Strategy\n \n \n \n \n 1 file(s) 1.29 MB\n \n \n Login to download. URL:https://edmforum.eu/event/cedm-workshop-27reliable-electronics/ LOCATION:ON Semiconductor Belgium\, Westerring 15\, Oudenaarde\, 9700\, Belgium CATEGORIES:Workshop END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170907T100000 DTEND;TZID=Europe/Brussels:20170907T110000 DTSTAMP:20260709T085821 CREATED:20231212T224231Z LAST-MODIFIED:20240725T100941Z UID:1933-1504778400-1504782000@edmforum.eu SUMMARY:Webinar 2017-9-7: BOM-based Yield & Test Coverage Prediction of PBA DESCRIPTION:Presented by: Wesley Van Meensel – imec \n\n\n\nYour EMS supplier is delivering your requested Printed Board Assembly. But how certain are you about the quality of the PBA? What is the risk that your electronic module will not work after integrating it into your product or at the customer? What can we do during the design phase and how will testing help to reduce these risks?During this seminar we will give you a brief look on how you can quantify your quality or yield\, what the impact is of your production tests on that quality and how Pred-X can help you in improving your quality during the design stage.  \n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n BOM-based Yield and Test Coverage Prediction of PBAs\n \n \n \n \n 1 file(s) 1.46 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n BOM-based Yield and Test Coverage Prediction of PBAs – video\n \n \n \n \n 1 file(s) 20.04 MB\n \n \n Login to download. URL:https://edmforum.eu/event/webinar-5yield-test-coverage/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170627T000000 DTEND;TZID=Europe/Brussels:20170628T235959 DTSTAMP:20260709T085821 CREATED:20241008T144736Z LAST-MODIFIED:20241008T145157Z UID:8840-1498521600-1498694399@edmforum.eu SUMMARY:IPC Reliability Forum 2017 DESCRIPTION:Meet and Learn from the Best Experts and Stakeholders in Your IndustryThis forum will bring together industry key decision-makers\, insightful experts and thought-leaders for a unique gathering to share experience and enjoy the ultimate networking opportunities. Come and network with engineers\, business leaders\, and visionaries — as well as the leading industry experts and European electronics designers\, suppliers and users — who are shaping the future of electronics manufacturing. \n\n\n\n\n\nSome of your industry’s leading players are waiting for you: Airbus\, Robert Bosch GmbH\, Plexus\, NPL\, Safran\, IMEC \n\n\n\nFascinating Programme and SpeakersThe IPC Reliability Forum programme features interesting and relevant speakers with sessions that will offer powerful insights on inspiring others\, maximising a team’s talent. The format will allow attendees to learn and share their experiences. The programme follows the process of product realisation\, from design through final testing. We will focus on best practices for working with innovative processes and new materials and equipment. \n\n\n\nDüsseldorf\, a key location for the IPC Reliability ForumTake advantage of this opportunity to be at the heart of Europe exploring one of the fastest growing segments within the electronics industry. Experience the benefits of joining this important European electronics environment. \n\n\n\ncEDM contribution: \n\n\n\nPresentation: Bart Vandevelde\, imec \n\n\n\n\n\n \n \n \n \n \n \n Physics of Failure Based Quantification of Life Time for Electronics Board Assemblies\n \n \n \n \n 1 file(s) 5 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\nAbstract: To avoid electronics hardware failures during qualification or even worse\, in the field\, it is of high interest to perform a life time prediction of electronic assemblies in a virtual testing environment through modelling and simulations. Crucial elements in the simulation environment are the Physics of Failure (PoF) models which are translating actual loading into a wear-out life time prediction. In this presentation\, we will show the PoF model approaches for the major failure mechanisms (solder fractures\, Al capacitor failure\, plated through hole copper via fatigue) applied to practical applications. \n\n\n\nLocation: Maritim Hotel Düsseldorf\, Maritim-Platz 1\, 40474 Düsseldorf\, Germany URL:https://edmforum.eu/event/ipc-reliability-forum-2017/ CATEGORIES:Events with EDM contribution END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170613T160000 DTEND;TZID=Europe/Brussels:20170613T220000 DTSTAMP:20260709T085821 CREATED:20241008T143117Z LAST-MODIFIED:20241008T143704Z UID:8836-1497369600-1497391200@edmforum.eu SUMMARY:The Flexible Factory: Industrial Assembly in the 21st Century DESCRIPTION:The classical assembly line is coming to a stop. Enter flexible production! The assembly line was introduced in the early 1900s. It skyrocketed the productivity of workers\, for the first time allowing efficient mass production of standard products. The line timed and coordinated the actual production\, dividing the work into standard repetitive actions that required little explanation. But lately\, products have become smarter\, with customized and client-specific features. They no longer fit traditional mass production on a classical assembly line. \n\n\n\n\n\nWhat we need today are flexible factories\, factories where unique products can be assembled at a cost comparable to mass production. We are seeing the introduction of flexible\, digital factories\, where the status of each product is known at any time\, together with its next production steps. In such a factory\, the production configuration can be modified at any time and depending on product specifications. This flexibility is enabled through e.g. mobile robots and autonomous transport lines. For each product\, the optimal mix is determined between accurate and efficient automation and human intelligence and flexibility.In this seminar we will explore this flexible factory of the 21st century. \n\n\n\nAgenda:  \n\n\n\n16h00: Welcome coffee16h30: Welcome (Marc Engels\, Chairman of the programme – COO Flanders Make)16h45: F3A -Free Float Flawless Assembly\, assembly of large components under flow conditions (Christoph Storm\, Research Assistant\, WZL RWTH – Aachen)17h15: Driving the Digital Enterprise (Bart Demaegdt\, Technology Manager Digitalization Siemens)17h45: Smart operators in a smart factory (Peter Verstraeten\, CEO Proceedix)18h15: Coffee break18h45: Combining strengths of humans and robots for better manufacturing (Bram Vanderborght\, Prof. Robotics & Multibody Mechanics research group VUB and member BruBotics)19h15: The Flexible Factory at Atlas Copco (Filip Vandenberghe\, Former President of the Airtec Division and Managing Director of Atlas Copco India)19h35: Q&A20h00: Networking with drinks and snacks \n\n\n\nParticipation fee:  \n\n\n\n\n135 euro (excl. VAT): members of Leuven.Inc / Leuven MindGate\n\n\n\n175 euro (excl. VAT): all others\n\n\n\nSpecial fee available for Master and PhD students affiliated and billable to KU Leuven or other universities.  URL:https://edmforum.eu/event/the-flexible-factory-industrial-assembly-in-the-21st-century/ LOCATION:Imec Leuven\, Kapeldreef 75\, Leuven\, 3001\, Belgium CATEGORIES:Events with EDM contribution END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170609T140000 DTEND;TZID=Europe/Brussels:20170609T173000 DTSTAMP:20260709T085821 CREATED:20231212T224316Z LAST-MODIFIED:20240726T074650Z UID:1971-1497016800-1497029400@edmforum.eu SUMMARY:EDM Workshop 26: Smart Textile DESCRIPTION:The ubiquity of electronics has started and is imagined to increase even more. Future electronics are also expected to have a higher level of product integration with the boundaries between electronics and the remaining of the product less clearly defined. Electronics in textiles are a typical example of such integrated electronic devices. An intense collaboration between textile and electronic manufacturers is needed to develop new products with additional functionality and which remain manufacturable and reliable. During this workshop\, Televic and Sioen\, being an electronics oriented and a textile company and covering the two involved industrial areas\, will share their insights and steps into this market of “smart textiles”. Furthermore\, some practical examples and requirements for successful integration of electronics in textiles will be given by Centexbel and Imec\, which are both active in the research field of this new technology. \n\n\n\nAgenda \n\n\n\n14h00The CareWare project: different industries working together on smart textilesPieter Crombez – TelevicSmart WearablesVera De Glas – SioenIntegration of electronincs on textiles by means of coating\, lamination\, adhesives or embeddingBrecht Demedts – CentexbelElectrical interconnections for electronics and textilesRiet Labie – imec16h30Networking\n\n\n\n\n\n\n\n \n \n \n \n \n \n Intro EDM Workshop 26\n \n \n \n \n 1 file(s) 333.12 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n The CareWare Project: Different Industries Working Together on Smart Textiles\n \n \n \n \n 1 file(s) 2.06 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Smart Wearables\n \n \n \n \n 1 file(s) 1.64 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Integration of Electronincs on Textiles by Means of Coating\, Lamination\, Adhesives or Embedding\n \n \n \n \n 1 file(s) 3.10 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Electrical Interconnections for Electronics and Textiles\n \n \n \n \n 1 file(s) 2.19 MB\n \n \n Login to download. URL:https://edmforum.eu/event/cedm-workshop-26smart-textile/ LOCATION:Televic\, Leo Bekaertlaan 1\, Izegem\, 8870\, Belgium CATEGORIES:Workshop END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170601T100000 DTEND;TZID=Europe/Brussels:20170601T110000 DTSTAMP:20260709T085822 CREATED:20231212T224231Z LAST-MODIFIED:20240725T100859Z UID:1932-1496311200-1496314800@edmforum.eu SUMMARY:Webinar 2017-6-1: System engineering DESCRIPTION:Presented by: Tania Drissen- Sirris \n\n\n\nSystems engineering (SE) is a complete process with 24 sub-processes to turn an early stage business idea or need of a client into a working product or process that satisfies all expectations throughout its life cycle. In this approach mainly the “technical management” processes are well known and common practice (project planning\, risk management\, configuration management\, …). However\, some other\, often neglected aspects (thorough requirements definition\, verification\, information management\, …) are also indispensable to control budget\, timing and quality.This webinar outlines what systems engineering is and which specific aspects deserve attention.  \n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n Systems Engineering\n \n \n \n \n 1 file(s) 5.97 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Systems Engineering – video\n \n \n \n \n 1 file(s) 28.90 MB\n \n \n Login to download. URL:https://edmforum.eu/event/webinar-4system-engineering/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170530T000000 DTEND;TZID=Europe/Brussels:20170601T235959 DTSTAMP:20260709T085822 CREATED:20241008T102410Z LAST-MODIFIED:20241008T122129Z UID:8785-1496102400-1496361599@edmforum.eu SUMMARY:Electronics & Applications Beurs 2017: Toekomst van elektronicaproductie in de Benelux DESCRIPTION:Hoe ziet de Benelux markt voor elektronica productie er over 10 jaar uit? Veel productie is vetrokken naar Azië en later naar Oost-Europa. Maar dit was zeker niet altijd succesvol. Reshoring is een nieuwe trend. Maar de vraag van OEM’ers is wel veranderd. Om te kunnen voldoen aan kleine series en snelle levertijden moeten EMS’ers veranderen in een ‘smart factory’. De sprekers geven hun kijk op de toekomst en laten door middel van praktische presentaties zien hoe zij zich voorbereiden op de toekomst. \n\n\n\n\n\n\n\n\n\n\n\n\n\nEDM bijdrage: Donderdag 1 juni \n\n\n\n\n\n \n \n \n \n \n \n Competitief Elektronica Ontwerp en Assemblage dicht bij de klant\n \n \n \n \n 1 file(s) 2 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\nNa een periode van outsourcing van de elektronica assemblage naar het verre Oosten\, zien we meer en meer bedrijven de strategische beslissing nemen om productie dichter bij de (Westerse) klant te brengen. Geert Willems geeft zijn kijk op de redenen voor deze “re- of near-shoring”\, en hoe de kennis van alle processen en methodologieën\, vanaf het ontwerp tot bij de klant\, een belangrijke bijdrage levert tot het succes van deze bedrijven. De rol van Design-for-eXcellence\, modelering\, simulatie en virtuele prototyping wordt toegelicht aan de hand van enkele praktische voorbeelden. \n\n\n\n\n\nLocatie: Jaarbeurs Utrecht\, Jaarbeursplein\, 3521 AL Utrecht URL:https://edmforum.eu/event/electronics-applications-beurs-2017-toekomst-van-elektronicaproductie-in-de-benelux/ CATEGORIES:Events with EDM contribution END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170407T130000 DTEND;TZID=Europe/Brussels:20170407T170000 DTSTAMP:20260709T085822 CREATED:20231212T223741Z LAST-MODIFIED:20240726T114033Z UID:1806-1491570000-1491584400@edmforum.eu SUMMARY:PBA Technology Seminar and Factory Visit DESCRIPTION: URL:https://edmforum.eu/event/pba-tecnhology-session/ LOCATION:Connect Group Ieper\, Bargiestraat 2\, Ieper\, 8900\, Belgium CATEGORIES:Technology seminar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170406T100000 DTEND;TZID=Europe/Brussels:20170406T110000 DTSTAMP:20260709T085822 CREATED:20231212T224231Z LAST-MODIFIED:20240725T090724Z UID:1931-1491472800-1491476400@edmforum.eu SUMMARY:Webinar 2017-4-6: Virtual Testing of Thermal-Mechanical Reliability of Electronic Systems DESCRIPTION:Presented by: Bart Vandevelde – imec \n\n\n\nBefore electronic systems can be brought on the market\, they must fulfill qualification tests according to international standards and customer specified test programs. Thermal and mechanical environmental loadings are major causes for electronic system failures that also appear during these qualification testing. It is obvious that any failure after such a test is very expensive in terms of time and cost. Performing virtual testing in a simulation environment allows to find possible weak spots in the system already in early phase of the development when adaptations can be made easily. In this webinar\, we will show several examples how simulations are used to virtually test the electronic systems from the thermal and mechanical point of view. \n\n\n\n\n\n\n\n \n \n \n \n \n \n Virtual Testing of Thermal-Mechanical Reliability of Electronic Systems\n \n \n \n \n 1 file(s) 2.20 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Virtual Testing of Thermal-Mechanical Reliability of Electronic Systems – video\n \n \n \n \n 1 file(s) 37.00 MB\n \n \n Login to download. URL:https://edmforum.eu/event/webinar-3virtual-testing/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170310T130000 DTEND;TZID=Europe/Brussels:20170310T170000 DTSTAMP:20260709T085822 CREATED:20240726T113942Z LAST-MODIFIED:20240729T081201Z UID:5854-1489150800-1489165200@edmforum.eu SUMMARY:PCB Technology Seminar and Factory Visit DESCRIPTION: URL:https://edmforum.eu/event/pcb-technology-seminar-and-factory-visit-4/ LOCATION:ACB\, Vosmeer 3\, Dendermonde\, +3252202030\, 9200\, Belgium CATEGORIES:Technology seminar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170223T000000 DTEND;TZID=Europe/Brussels:20170226T235959 DTSTAMP:20260709T085822 CREATED:20241008T095503Z LAST-MODIFIED:20241008T095504Z UID:8778-1487808000-1488153599@edmforum.eu SUMMARY:KULeuven Course: Increasing your products immunity against electromagnetic disturbances: an approachable way. DESCRIPTION:The research group ReMI (Reliability in Mechatronics and ICT) organizes a course on basic and advanced techniques to increase the immunity of products against electromagnetic disturbances. \n\n\n\n\n\nue to the ever increasing use of electronic systems in almost every possible application\, the generation of possible disturbances has been continuously growing over the last decade with no signs that this trend will be broken. Besides\, one sees that electronic systems are being applied more and more in and for mission or even safety critical functions which require an extremely high resilience against all environmental stresses\, including electromagnetic disturbances\, over the whole foreseen lifetime. As a product developer it is often very difficult to assess the products environment\, let alone foresee the effect of various electromagnetic disturbances on the product itself.In this training course several topics about the immunity of electronic products and their electromagnetic environment are discussed. Low-cost pre-compliance debugging and protection techniques against ESD\, surge transients\, etc. are presented.Key-note speaker of this course is Keith Armstrong (UK). Keith has written many practical papers and books on design for EMC and EMC debugging. Much of his working life involves solving real-life EMC problems in high-technology products\, systems\, and installations\, for a variety of companies and organisations in a wide range of industries. Keith has always aimed to make products easy to design and manufacture\, work properly\, please their users\, and make money for their manufacturers. \n\n\n\nAgenda:  \n\n\n\nDay 1: \n\n\n\n\nIntro on EMC & immunity\n\n\n\nResilience to EM disturbances for mission- or safety-critical systems\n\n\n\nAssessing an EM environment\n\n\n\nOverview of basic EMC immunity test methods\n\n\n\nBasic low-cost precompliance immunity testing \n\n\n\n\nDay 2: \n\n\n\n\nAdvanced low-cost precompliance immunity testing\n\n\n\nProtection against ESD\n\n\n\nProtecting against surge\, transients\, etc\n\n\n\nProtecting from AC/DC power quality\n\n\n\n\nParticipation fee:  \n\n\n\n\n€650 (excl. VAT) for both days\n\n\n\n€350 (excl. VAT) for only day 1A 10% discount applies for members of Agoria\, the RELIM project or the INPROVOL project. The participation fee includes course notes\, lunches and coffee breaks. URL:https://edmforum.eu/event/kuleuven-course-increasing-your-products-immunity-against-electromagnetic-disturbances-an-approachable-way/ LOCATION:KHBO\, Zeedijk 101\, Oostende\, 8400 CATEGORIES:Partner Events END:VEVENT END:VCALENDAR