BEGIN:VCALENDAR VERSION:2.0 PRODID:-//EDM Forum - ECPv6.15.12.2//NONSGML v1.0//EN CALSCALE:GREGORIAN METHOD:PUBLISH X-WR-CALNAME:EDM Forum X-ORIGINAL-URL:https://edmforum.eu X-WR-CALDESC:Events for EDM Forum REFRESH-INTERVAL;VALUE=DURATION:PT1H X-Robots-Tag:noindex X-PUBLISHED-TTL:PT1H BEGIN:VTIMEZONE TZID:Europe/Brussels BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20150329T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20151025T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20160327T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20161030T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20170326T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20171029T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20180325T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20181028T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20190331T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20191027T010000 END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20180329T140000 DTEND;TZID=Europe/Brussels:20180329T170000 DTSTAMP:20260709T122455 CREATED:20231212T224258Z LAST-MODIFIED:20241008T154908Z UID:1953-1522332000-1522342800@edmforum.eu SUMMARY:Expert Discussion Forum: Can electronics sense its own health? DESCRIPTION:In the frame of the preparation of an SBO (‘strategisch basisonderzoek’) project proposal\, we would like to invite industrial research and technical experts in the field of electronics design to support us in defining the research objectives and end goal(s) of the project.The project lies in the field of Prognostic Health Monitoring (PHM) for electronic systems. PHM is a key enabling technology where the extent of degradation is monitored in a self-learning electronic system providing early warning of failure and a Remaining Useful Life time estimation. The solution we aim for is based on a hybrid approach. On one side\, we add sensors to the systems that are measuring direct or indirect physical degradation of the system. On the other side\, all relevant electrical and mission profile data is collected over time and leads to self-learning systems able to predict their own health\, or the health of similar systems elsewhere in the field.It is obvious that this is an extremely challenging objective and that the project needs focus to be realistic within the budget and time restrictions. We also aim for project results that are relevant and useful for the local industry at the end of the project\, allowing for implementation in your technologies. Logical next steps for industrial valorisation after the SBO project are O&O (Onderzoek en Ontwikkeling) projects. \n\n\n\nAgenda \n\n\n\nPresentations introducing the topic:“How the world moves\, step by step\, from Fides/Mil (constant failure rate) towards Physics of Failure based life time predictions for electronic systems” (Geert Willems\, imec) \n\n\n\n\n\n \n \n \n \n \n \n Physics-of-Failure Based Reliability Assessment of Electronics\n \n \n \n \n 1 file(s) 1 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n“Data-driven system health monitoring” (Elena Tsiporkova\, Sirris) \n\n\n\n\n\n \n \n \n \n \n \n Data-driven system health monitoring\n \n \n \n \n 1 file(s) 2 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n“State of the art on Prognostic Health Monitoring for Electronic Systems” (Bart Vandevelde\, imec) \n\n\n\n\n\n \n \n \n \n \n \n State of the art on Prognostic Health Monitoring for Electronic Systems\n \n \n \n \n 1 file(s) 709 KB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n“Towards PHM self-awareness – share some experience from the mechanical world” (Jeroen Firlefijn\, Atlas Copco) \n\n\n\n\nOpen discussion on\n\nCommon electronics reliability challenges\n\n\n\nSense and need for upcoming failure sensing\n\n\n\nExpectation from the industry for a strategic basic research (SBO) project focusing on near-failure sensing of electronics\n\n\n\nValorisation of SBO project results through industrial O&O projects\n\n\n\n\n\nConclusion / Next steps\n\n\n\n\nLocatie: Sirris Gent\, Technologiepark 935\, Zwijnaarde URL:https://edmforum.eu/event/expert-discussion-forumcan-electronics-sense-its-own-health/ CATEGORIES:Events,Events with EDM contribution END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20180323T130000 DTEND;TZID=Europe/Brussels:20180323T170000 DTSTAMP:20260709T122455 CREATED:20240726T115537Z LAST-MODIFIED:20240726T120952Z UID:5861-1521810000-1521824400@edmforum.eu SUMMARY:PCB Technology Seminar and Factory Visit DESCRIPTION:PCB Technology Seminar 2018 Program\n \n \n \n \n 1 file(s) 143.89 KB\n \n \n Download URL:https://edmforum.eu/event/pcb-technology-seminar-and-factory-visit-5/ LOCATION:ACB\, Vosmeer 3\, Dendermonde\, +3252202030\, 9200\, Belgium CATEGORIES:Technology seminar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20180301T000000 DTEND;TZID=Europe/Brussels:20180301T000000 DTSTAMP:20260709T122455 CREATED:20231212T224241Z LAST-MODIFIED:20240725T101124Z UID:1936-1519862400-1519862400@edmforum.eu SUMMARY:Webinar 2018-3-1: New Solder Joint Compositions: a Literature Review on Reliability DESCRIPTION:Presented by: Bart Vandevelde and Riet Labie – imec \n\n\n\nIn the first years after the introduction of the RoHS directive in 2006\, SnAgCu (SAC) with Ag percentage between 3 and 4.5% was the main solder composition used by the industry to replace SnPb solder. However\, in the recent years\, many new lead-free compositions were and are being introduced by the industry. This can be triggered by cost reasons (e.g. lower Ag content)\, a lower process temperature or to improve the reliability.In this webinar\, we will give an overview on the thermal cycling and mechanical shock reliability of these new compositions\, based on studies published in literature. \n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n New Solder Joint Compositions: a Literature Review on Reliability\n \n \n \n \n 1 file(s) 3.18 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n New Solder Joint Compositions: a Literature Review on Reliability – video\n \n \n \n \n 1 file(s) 15.44 MB\n \n \n Login to download. URL:https://edmforum.eu/event/webinar-8new-solder-joint-compositions/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20180118T150000 DTEND;TZID=Europe/Brussels:20180118T193000 DTSTAMP:20260709T122455 CREATED:20231212T224135Z LAST-MODIFIED:20240726T075042Z UID:1879-1516287600-1516303800@edmforum.eu SUMMARY:EDM Workshop 28: Reliable Electronics for Aerospace DESCRIPTION:Challenges of segmented supply chains in component qualification for space \n\n\n\nIn the past\, homogeneous Integrated Device Manufacturers (IDMs) were responsible for electrical\, electronic and electromechanical part development and manufacturing. Over the last 20 years things have changed\, many manufacturers only retain their core competence\, and heavily rely on outsourcing. The more this supply chain is segmented the more complex the qualification process becomes. This presentation focusses on the challenges of this segmented supply chain and how to deal with it in the qualification process. \n\n\n\nAutomatization for large solar panels assembly“Industry 4.0” technologies\, are developed to better control the processes to master product quality.Solar panels being a large subsystem they represent the opportunity to identify and address technology building blocks used elsewhere in every satellite while giving enough load to be automated in a facility.The “New Space” trend to cut down costs through a change of culture implies a new approach in our industry\, where both volumes are low and standards are tailored to address one-shot production. \n\n\n\nTechnological concepts for assembly of highly reliable electronic componentsSince 50 years\, FSL has contributed to aerospace programs with electronics where thick-film technology\, chip-and-wire processes and hermetic encapsulation are key technological drivers. Due to this experience\, FSL was certified from the DLR as assembly- and testhouse for power components. Today\, qualified power FET assemblies are available and the qualification for high-voltage diode assemblies is in progress. Currently\, motor-driver electronics for the EnMAP mission are in production. This presentation is highlighting some of the proven technological concepts as used for the assembly of electronics for aerospace applications. \n\n\n\nLight weight Hermetic PackagingLow weight is of crucial importance for anything that goes into space.The aerospace industry uses hermetic Au plated packages for housing ceramic based electronic devices and these packages are traditionally made of either heavy CuMo or CuW\, for matched thermal expansion.CPS Technologies offers a 40-60% lighter alternative in the form of hermetic packages made of AlSiC.Brazed ceramic or glass feedthrus can be used and these packages meet the requirements of Mil-PRF-38534. \n\n\n\nContribution of multiphysics simulation to reliable microsystem packagingFor a growing number of applications having to perform in demanding conditions such as high temperature pressure sensors\, automotive MEMS-micromirror\, vibration based energy harvester\, the need for high dimensional stability\, increased accuracy and predictable performances raises the standards for the design of microsystem devices. Whether in the vibration environment of a machine or the thermo-mechanical solicitations found in Microsystems\, this interdependency translates into a more frequent need of elaborate\, coupled\, Multiphysics analysis capabilities to study the devices’ interactions with their support\, package and environment during their design in order to increase their robustness. \n\n\n\nAgenda \n\n\n\n15h00Challenges of segmented supply chains in component qualification for spacePaavo Heiskanen – ESA15h30Automatization for large solar panels assemblyElie Dawidowicz – Thales Alenia Space16h00Technological concepts for assembly of highly reliable electronic componentsBenjamin Riedmueller – First Sensor17h00Light weight Hermetic PackagingGio Schouten – Semi Dice17h30Contribution of multiphysics simulation to reliable microsystem packagingPascal De Vincenzo\, Open Engineering18h00Networkiing – Clean Room visit\n\n\n\n\n\n\n\n \n \n \n \n \n \n iMAPS-Benelux Winter Event 2018 program\n \n \n \n \n 1 file(s) 114.23 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n Challenges of Segmented Supply Chains in Component Qualification for Space\n \n \n \n \n 1 file(s) 3.51 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Automation of Space Solar Panels Assembly\n \n \n \n \n 1 file(s) 984.13 KB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Reliable Electronics for Aerospace\n \n \n \n \n 1 file(s) 3.32 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Aluminum Silicon Carbide – Description and Applications\n \n \n \n \n 1 file(s) 19.81 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Contribution of Multiphysics Simulation to Reliable Microsystem Packaging\n \n \n \n \n 1 file(s) 5.38 MB\n \n \n Login to download. URL:https://edmforum.eu/event/cedm-workshop-28reliable-electronics-for-aerospace/ LOCATION:Imec Leuven\, Kapeldreef 75\, Leuven\, 3001\, Belgium CATEGORIES:Workshop END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20180111T000000 DTEND;TZID=Europe/Brussels:20180111T000000 DTSTAMP:20260709T122455 CREATED:20231212T224231Z LAST-MODIFIED:20240725T101047Z UID:1935-1515628800-1515628800@edmforum.eu SUMMARY:Webinar 2018-1-11: EMI Risk management DESCRIPTION:Davy Pissoort – KU Leuven \n\n\n\nEveryone has already been confronted with Electro-Magnetic Interference (EMI)\, ranging from an annoying buzz in a stereo when receiving a phone call to a computer crashing during a lightning storm. Frustrating\, but not life threatening. However\, two trends warrant appropriate concern: (i) high-tech electronics is being used more and more for safety-related functions\, (ii) electronic devices are increasingly vulnerable to EMI because of a lower intrinsic immunity and an increasingly severe electromagnetic environment. Combined expertise in Electro-Magnetic Compatibility (EMC) and Functional Safety (FS) will gain huge importance in many sectors like automotive\, robotics medical\, railways\, avionics\,… Unfortunately\, EMC and FS have evolved separately and share no concepts nor terminology.EMI Risk Management must go well beyond the current state-of-the-art in classical EMC engineering.This webinar will guide you on how you should deal with EMI risks in your functional safety process for your electronic products. \n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n EMI Risk Management\n \n \n \n \n 1 file(s) 2.27 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n EMI Risk Management – video\n \n \n \n \n 1 file(s) 37.25 MB\n \n \n Login to download. URL:https://edmforum.eu/event/webinar-7emi-risk-management/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20171208T140000 DTEND;TZID=Europe/Brussels:20171208T190000 DTSTAMP:20260709T122455 CREATED:20231212T224119Z LAST-MODIFIED:20240726T074903Z UID:1867-1512741600-1512759600@edmforum.eu SUMMARY:EDM Event 2017: Security and Reliability of Electronics DESCRIPTION:Electronics Everywhere\, Everything Connected\, Internet of Things (IoT)\, City of Things\, Industry 4.0 all imply a distributed network of a large number of electronic devices that must be able to handle confidential\, safety critical or other secured data in a reliable way. With 50 billion active devices by 2020 it is likely that security incidents will increase as well as the failure probability of the network. A high level of network availability throughout the envisaged operational lifetime is essential. Security and reliability of electronics is key for IoT. The relationship between both will be explored in this event. \n\n\n\nWe selected four speakers for you to highlight different security and reliability aspects.Ulrich Seldeslachts\, LSEC\, will explain you how to implement security-thinking into electronics design as well as the importance of the supply of qualified components and reliable electronics.The payment industry is characterized by a high level of security. With the rise of “always connected” devices\, the need for the same type of protection is emerging in a lot of other industries. Peter Timmermans\, ATOS Worldline\, will present the attacks against which we have to protect a payment terminal\, how this can be realized and what are the consequences of this type of precautions.Obviously\, electronic device failures are unwanted. Surprisingly\, the unique features of certain IC transistor failure mechanisms can be exploited to create low cost\, high security solutions. Thomas Kallstenius\, imec\, introduces you into the world of security embedding in Integrated Circuits.Electronics reliability is the main theme in today’s cEDM activities. Geert Willems\, imec\, will explain why Physics-of-Failure based Design-for-Reliability is essential for the development of reliably operating secured electronics networks. \n\n\n\nAgenda \n\n\n\n14h00Welcome14h10Security Design Thinking for Industrializing IoT and Industry 4.0.Ulrich Seldeslachts – LSEC – Leaders in Security14h40Hardware Security in the payment industryPeter Timmermans – ATOS Worldline15h10Failure mechanisms turned into an asset: new ways of embedding key security elements in IC’sThomas Kallstenius – imec15h40Towards Physics-of-Failure based “Reliable-by-Design” electronicsGeert Willems – imec16h10Q&A and networking\n\n\n\n\n\n\n\n \n \n \n \n \n \n EDM Event 2017 program\n \n \n \n \n 1 file(s) 188.20 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Intro EDM Event 2017\n \n \n \n \n 1 file(s) 915.15 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Security Design Thinking for Industrializing IoT and Industry 4.0\n \n \n \n \n 1 file(s) 5.16 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Hardware Security in the Payment Industry\n \n \n \n \n 1 file(s) 2.00 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Failure Mechanisms Turned into an Asset: New Ways of Embedding Key Security Elements in IC’s\n \n \n \n \n 1 file(s) 1.96 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Towards Physics-of-Failure Based “Reliable-by-Design” Electronics\n \n \n \n \n 1 file(s) 2.53 MB\n \n \n Login to download. URL:https://edmforum.eu/event/cedm-event-5/ LOCATION:Imec Leuven\, Kapeldreef 75\, Leuven\, 3001\, Belgium CATEGORIES:EDM event END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20171108T110000 DTEND;TZID=Europe/Brussels:20171108T120000 DTSTAMP:20260709T122455 CREATED:20231212T224231Z LAST-MODIFIED:20240725T101014Z UID:1934-1510138800-1510142400@edmforum.eu SUMMARY:Webinar 2017-11-8: Plated Through Hole Via Failure DESCRIPTION:Presented by: Bart Vandevelde – imec \n\n\n\nIn cEDM’s ‘reliability FMEA’ tool\, we listed about 15 different failure mechanisms which over time can lead to electrical malfunctioning of the Printed Circuit Board (PCB) itself. One of the most dominant failures which are purely related to the PCB\, is fracturing of the copper plated through hole via’s. These are induced by the thermal expansion mismatch between the plated copper via and the surrounding epoxy/glass material. Due to this CTE mismatch\, the copper is stressed during solder reflow cycles and during operational temperature cycling. Both multiple solder reflows and numerous temperature cycles can lead to cracked via’s.In this webinar\, we will explain the basics of this PTH via failure mechanism\, what are the design and material parameters accelerating this failure and how the life time of your particular PCB with 100-1000 via’s can be calculated. This latter one is needed to finally guarantee that PTH via failures will not occur during the required life time of the PCB. \n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n Plated Through Hole Via Failures: Is This a Risk for My Design?\n \n \n \n \n 1 file(s) 2.40 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Plated Through Hole Via Failures: Is This a Risk for My Design? – video\n \n \n \n \n 1 file(s) 26.70 MB\n \n \n Download URL:https://edmforum.eu/event/webinar-6plated-through-hole-via-failure/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170928T093000 DTEND;TZID=Europe/Brussels:20170928T190000 DTSTAMP:20260709T122455 CREATED:20241008T101307Z LAST-MODIFIED:20241008T101308Z UID:8783-1506591000-1506625200@edmforum.eu SUMMARY:Flanders Make Second Seminar Day 2017: How do companies tackle technological hurdles? DESCRIPTION:During this Seminar Day\, engineers\, researchers and R&D managers from the manufacturing industry will come together to learn more about the results of some of our recent projects. In 3 parallel sessions\, project managers and industrial partners will elaborate on their newly acquired knowledge and on concrete cases that help companies to innovate. Each track has its own focus. \n\n\n\n\n\nTrack 1 digs deeper into the re-conception of product development processes and joining technologies for new (multi-)materials.Track 2 develops Model Based System Engineering (MBSE)\, for intelligent development methods allowing interim virtual design validation.Track 3 combines 3 very diverse projects\, providing insights in new production technologies\, learning control and sensor monitoring. At the start of every session\, you can chose which track to follow and you can join as many sessions as you want.  \n\n\n\nEDM contribution \n\n\n\nTitle: PoF qualification: physical & virtual testing of electronic components and systemsAbstract: Before electronic systems can be launched on the market\, they must pass qualification tests according to international standards and customer-specified test programmes. Thermal and mechanical environmental loads are major causes for electronic system failures that also appear during these qualification tests. It is obvious that any failure detected in such tests is very expensive in terms of time and cost. Performing physical & virtual testing allows to find possible weak spots in the system in an early development phase when adaptations are still easy to make. In this seminar\, we will show several examples on how reliability testing and simulation are used to test the electronic components and systems from a thermal and mechanical point of view. \n\n\n\nAgenda:  \n\n\n\n09h30 – 10h30 Welcome10h30 – 12h00– Multi-material joining techniques– Multi-physical monitoring for optimal mechatronic system design– Integrating a multi-axial machining centre and laser hardening for prototypes and small complex series12h – 13h Sandwich lunch13h – 15h– Metamaterials to provide lightweight NVH solutions: realization through thermoforming– Model-based conceptual design and synthesis– Learning control15h – 15h30 Coffee brea15h30 – 17h30– Utilising the full lightweight potential of sheet material products– How to design reliable & robust electronic products?– Cost-effective vibro-acoustic monitoring17h30 Networking drink \n\n\n\nParticipation fee:  \n\n\n\n\nFlanders Make member company: 50 € (95 € for the 2 sessions)\n\n\n\nNon-member company: 95 € (195 € for the 2 sessions)\n\n\n\n\nLocation: The Business Faculty\, Sint-Lendriksborre 6\, 1120 Neder-Over-Heembeek URL:https://edmforum.eu/event/flanders-make-second-seminar-day-2017-how-do-companies-tackle-technological-hurdles/ CATEGORIES:Events with EDM contribution,Partner Events END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170927T110000 DTEND;TZID=Europe/Brussels:20170927T203000 DTSTAMP:20260709T122455 CREATED:20241008T150144Z LAST-MODIFIED:20241008T150255Z UID:8845-1506510000-1506544200@edmforum.eu SUMMARY:GSA Entrepreneurship Conference DESCRIPTION:European start-ups have traditionally been a tremendous source of innovation in the semiconductor industry. However\, two major difficulties limit their technological and business impact on the global market: raising capital and obtaining specific start-up support. \n\n\n\n\n\nThe Conference is the meeting place for start-ups\, strategic investors\, financial investors and everyone else who cares about the future of semiconductor and technology innovation in Europe. Our speakers will share their personal experiences in financing\, IPO and acquisition exits for startups\, as well as discussing the most promising areas of innovation in the European and global semiconductor ecosystem. \n\n\n\nAgenda: 11:00   Registration11:50   Hors d’Oeuvres and Networking12:40   Introduction – Sandro Grigolli\, EMEA Executive Director\, GSA12:50   Welcome Remarks – Maria Marced\, Chairwoman\, GSA EMEA Leadership Council13:00   Opening Keynote: The State of European Innovation – Luc Van den hove\, President & CEO\, imec13:30   Session #1: The Entrepreneurs’ Perspective – Lessons Learned            Movidius: a European Success Story – Remi El Ouazzane\, VP and GM\, Intel\, former CEO Movidius            A Serial Entrepreneur: Lessons Learned – Nigel Toon\, Co-Founder and CEO\, Graphcore            A Young Entrepreneur: Lessons Learned – Luca Verre\, CEO & Co-Founder\, Chronocam14:30   Networking Break15:05   Session #1 (continued) Panel Discussion with Q&A moderated by Jean Michel Deligny\, Co-Founder and Managing Director\, Silverpeak            Remi El Ouazzane\, VP and GM\, Intel\, former CEO Movidius            Nigel Toon\, Co-Founder and CEO\, Graphcore            Luca Verre\, CEO & Co-Founder\, Chronocam15:35   Session #2: The Strategic Investors’ Perspective – Access to Innovation            A New Framework for Startups-Corporates Collaboration – Harald Hamster\, VP Strategy Development\, Infineon            5G and Industry 4.0 driving European innovation – Volker Ziegler\, Head of 5G Leadership\, Chief Architect\, Nokia Mobile Networks16:15   Start Up Elevator Pitches16:45   Networking Break17:20   Session #3: The Venture Capitalists’ Perspective – Financing Startups            Financing Startups to Accelerate Growth – Hongquan Jiang\, Managing Partner\, Robert Bosch Venture Capital            Backing Europe’s Most Ambitious Entrepreneurs – Brian Caulfield\, Managing Partner\, Draper Esprit            Technology Investments to Exploit Major Growth Opportunities – Helen McBreen\, Investment Director\, Atlantic Bridge            A Focus on Micro/nano-electronics and Advanced Materials – Lou Hermans\, Partner\, Capital-E Panel Discussion and Moderated Q & A by Peter Vanbekbergen\, Partner\, imec.xpand19:15   Closing Remarks19:25   Belgian Beer Tasting and Hors d’Oeuvres20:25   Adjournment  \n\n\n\nParticipation fee: Free for GSA Members100 € – VAT for non-members URL:https://edmforum.eu/event/gsa-entrepreneurship-conference/ LOCATION:Imec Leuven\, Kapeldreef 75\, Leuven\, 3001\, Belgium CATEGORIES:Partner Events END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170922T133000 DTEND;TZID=Europe/Brussels:20170922T180000 DTSTAMP:20260709T122455 CREATED:20231212T224315Z LAST-MODIFIED:20240726T074719Z UID:1965-1506087000-1506103200@edmforum.eu SUMMARY:EDM Workshop 27: How Autonomous and Electric Cars Push the Need for More Reliable Electronics DESCRIPTION:The automotive industry is facing two major evolutions in the coming years: the move towards autonomous driving and the transformation from combustion to 100% electric cars. It is obvious that these trends push the demand for more electronic components and systems\, but also increase the requirements towards reliability of these components/systems. In this workshop\, several stakeholders of the automotive electronics industry will show their view on how to deal with design for reliability (DfR)\, production\, standardisation and system integration of electronics in automotive products for which reliability is an essential property. \n\n\n\nAgenda \n\n\n\n13h00Welcome13h30Next Generation Approaches for Reliability of Automotive Smart SystemsPrzemyslaw Jakub Gromala – Robert BoschAutomotive electronic components qualification standards and guidelines: update of the current status. Daniel Vanderstraeten – ON Semiconductor Belgium14h45Coffee Break15h15Challenges for future connected and automated carsPatrick Pype – NXP Semiconductors BelgiumImproving the reliability of electronic systems using pottingHarold Haspeslagh – Ninix TechnologiescEDM’s DfR for automotive electronics: experiences and strategyBart Vandevelde – Imec16h45Networking\n\n\n\n\n\n\n\n \n \n \n \n \n \n EDM Workshop 27 program\n \n \n \n \n 1 file(s) 176.56 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Intro EDM Workshop 27\n \n \n \n \n 1 file(s) 517.73 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n Automotive Electronic Components Qualification Standards and Guidelines\n \n \n \n \n 1 file(s) 504.48 KB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Challenges for Future Connected and Automated Cars\n \n \n \n \n 1 file(s) 3.32 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Improving the Reliability of Electronic Systems Using Potting \n \n \n \n \n 1 file(s) 1.83 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n cEDM’s DfR for Automotive Electronics: Experiences and Strategy\n \n \n \n \n 1 file(s) 1.29 MB\n \n \n Login to download. URL:https://edmforum.eu/event/cedm-workshop-27reliable-electronics/ LOCATION:ON Semiconductor Belgium\, Westerring 15\, Oudenaarde\, 9700\, Belgium CATEGORIES:Workshop END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170907T100000 DTEND;TZID=Europe/Brussels:20170907T110000 DTSTAMP:20260709T122455 CREATED:20231212T224231Z LAST-MODIFIED:20240725T100941Z UID:1933-1504778400-1504782000@edmforum.eu SUMMARY:Webinar 2017-9-7: BOM-based Yield & Test Coverage Prediction of PBA DESCRIPTION:Presented by: Wesley Van Meensel – imec \n\n\n\nYour EMS supplier is delivering your requested Printed Board Assembly. But how certain are you about the quality of the PBA? What is the risk that your electronic module will not work after integrating it into your product or at the customer? What can we do during the design phase and how will testing help to reduce these risks?During this seminar we will give you a brief look on how you can quantify your quality or yield\, what the impact is of your production tests on that quality and how Pred-X can help you in improving your quality during the design stage.  \n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n BOM-based Yield and Test Coverage Prediction of PBAs\n \n \n \n \n 1 file(s) 1.46 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n BOM-based Yield and Test Coverage Prediction of PBAs – video\n \n \n \n \n 1 file(s) 20.04 MB\n \n \n Login to download. URL:https://edmforum.eu/event/webinar-5yield-test-coverage/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170627T000000 DTEND;TZID=Europe/Brussels:20170628T235959 DTSTAMP:20260709T122455 CREATED:20241008T144736Z LAST-MODIFIED:20241008T145157Z UID:8840-1498521600-1498694399@edmforum.eu SUMMARY:IPC Reliability Forum 2017 DESCRIPTION:Meet and Learn from the Best Experts and Stakeholders in Your IndustryThis forum will bring together industry key decision-makers\, insightful experts and thought-leaders for a unique gathering to share experience and enjoy the ultimate networking opportunities. Come and network with engineers\, business leaders\, and visionaries — as well as the leading industry experts and European electronics designers\, suppliers and users — who are shaping the future of electronics manufacturing. \n\n\n\n\n\nSome of your industry’s leading players are waiting for you: Airbus\, Robert Bosch GmbH\, Plexus\, NPL\, Safran\, IMEC \n\n\n\nFascinating Programme and SpeakersThe IPC Reliability Forum programme features interesting and relevant speakers with sessions that will offer powerful insights on inspiring others\, maximising a team’s talent. The format will allow attendees to learn and share their experiences. The programme follows the process of product realisation\, from design through final testing. We will focus on best practices for working with innovative processes and new materials and equipment. \n\n\n\nDüsseldorf\, a key location for the IPC Reliability ForumTake advantage of this opportunity to be at the heart of Europe exploring one of the fastest growing segments within the electronics industry. Experience the benefits of joining this important European electronics environment. \n\n\n\ncEDM contribution: \n\n\n\nPresentation: Bart Vandevelde\, imec \n\n\n\n\n\n \n \n \n \n \n \n Physics of Failure Based Quantification of Life Time for Electronics Board Assemblies\n \n \n \n \n 1 file(s) 5 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\nAbstract: To avoid electronics hardware failures during qualification or even worse\, in the field\, it is of high interest to perform a life time prediction of electronic assemblies in a virtual testing environment through modelling and simulations. Crucial elements in the simulation environment are the Physics of Failure (PoF) models which are translating actual loading into a wear-out life time prediction. In this presentation\, we will show the PoF model approaches for the major failure mechanisms (solder fractures\, Al capacitor failure\, plated through hole copper via fatigue) applied to practical applications. \n\n\n\nLocation: Maritim Hotel Düsseldorf\, Maritim-Platz 1\, 40474 Düsseldorf\, Germany URL:https://edmforum.eu/event/ipc-reliability-forum-2017/ CATEGORIES:Events with EDM contribution END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170613T160000 DTEND;TZID=Europe/Brussels:20170613T220000 DTSTAMP:20260709T122455 CREATED:20241008T143117Z LAST-MODIFIED:20241008T143704Z UID:8836-1497369600-1497391200@edmforum.eu SUMMARY:The Flexible Factory: Industrial Assembly in the 21st Century DESCRIPTION:The classical assembly line is coming to a stop. Enter flexible production! The assembly line was introduced in the early 1900s. It skyrocketed the productivity of workers\, for the first time allowing efficient mass production of standard products. The line timed and coordinated the actual production\, dividing the work into standard repetitive actions that required little explanation. But lately\, products have become smarter\, with customized and client-specific features. They no longer fit traditional mass production on a classical assembly line. \n\n\n\n\n\nWhat we need today are flexible factories\, factories where unique products can be assembled at a cost comparable to mass production. We are seeing the introduction of flexible\, digital factories\, where the status of each product is known at any time\, together with its next production steps. In such a factory\, the production configuration can be modified at any time and depending on product specifications. This flexibility is enabled through e.g. mobile robots and autonomous transport lines. For each product\, the optimal mix is determined between accurate and efficient automation and human intelligence and flexibility.In this seminar we will explore this flexible factory of the 21st century. \n\n\n\nAgenda:  \n\n\n\n16h00: Welcome coffee16h30: Welcome (Marc Engels\, Chairman of the programme – COO Flanders Make)16h45: F3A -Free Float Flawless Assembly\, assembly of large components under flow conditions (Christoph Storm\, Research Assistant\, WZL RWTH – Aachen)17h15: Driving the Digital Enterprise (Bart Demaegdt\, Technology Manager Digitalization Siemens)17h45: Smart operators in a smart factory (Peter Verstraeten\, CEO Proceedix)18h15: Coffee break18h45: Combining strengths of humans and robots for better manufacturing (Bram Vanderborght\, Prof. Robotics & Multibody Mechanics research group VUB and member BruBotics)19h15: The Flexible Factory at Atlas Copco (Filip Vandenberghe\, Former President of the Airtec Division and Managing Director of Atlas Copco India)19h35: Q&A20h00: Networking with drinks and snacks \n\n\n\nParticipation fee:  \n\n\n\n\n135 euro (excl. VAT): members of Leuven.Inc / Leuven MindGate\n\n\n\n175 euro (excl. VAT): all others\n\n\n\nSpecial fee available for Master and PhD students affiliated and billable to KU Leuven or other universities.  URL:https://edmforum.eu/event/the-flexible-factory-industrial-assembly-in-the-21st-century/ LOCATION:Imec Leuven\, Kapeldreef 75\, Leuven\, 3001\, Belgium CATEGORIES:Events with EDM contribution END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170609T140000 DTEND;TZID=Europe/Brussels:20170609T173000 DTSTAMP:20260709T122455 CREATED:20231212T224316Z LAST-MODIFIED:20240726T074650Z UID:1971-1497016800-1497029400@edmforum.eu SUMMARY:EDM Workshop 26: Smart Textile DESCRIPTION:The ubiquity of electronics has started and is imagined to increase even more. Future electronics are also expected to have a higher level of product integration with the boundaries between electronics and the remaining of the product less clearly defined. Electronics in textiles are a typical example of such integrated electronic devices. An intense collaboration between textile and electronic manufacturers is needed to develop new products with additional functionality and which remain manufacturable and reliable. During this workshop\, Televic and Sioen\, being an electronics oriented and a textile company and covering the two involved industrial areas\, will share their insights and steps into this market of “smart textiles”. Furthermore\, some practical examples and requirements for successful integration of electronics in textiles will be given by Centexbel and Imec\, which are both active in the research field of this new technology. \n\n\n\nAgenda \n\n\n\n14h00The CareWare project: different industries working together on smart textilesPieter Crombez – TelevicSmart WearablesVera De Glas – SioenIntegration of electronincs on textiles by means of coating\, lamination\, adhesives or embeddingBrecht Demedts – CentexbelElectrical interconnections for electronics and textilesRiet Labie – imec16h30Networking\n\n\n\n\n\n\n\n \n \n \n \n \n \n Intro EDM Workshop 26\n \n \n \n \n 1 file(s) 333.12 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n The CareWare Project: Different Industries Working Together on Smart Textiles\n \n \n \n \n 1 file(s) 2.06 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Smart Wearables\n \n \n \n \n 1 file(s) 1.64 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Integration of Electronincs on Textiles by Means of Coating\, Lamination\, Adhesives or Embedding\n \n \n \n \n 1 file(s) 3.10 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Electrical Interconnections for Electronics and Textiles\n \n \n \n \n 1 file(s) 2.19 MB\n \n \n Login to download. URL:https://edmforum.eu/event/cedm-workshop-26smart-textile/ LOCATION:Televic\, Leo Bekaertlaan 1\, Izegem\, 8870\, Belgium CATEGORIES:Workshop END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170601T100000 DTEND;TZID=Europe/Brussels:20170601T110000 DTSTAMP:20260709T122455 CREATED:20231212T224231Z LAST-MODIFIED:20240725T100859Z UID:1932-1496311200-1496314800@edmforum.eu SUMMARY:Webinar 2017-6-1: System engineering DESCRIPTION:Presented by: Tania Drissen- Sirris \n\n\n\nSystems engineering (SE) is a complete process with 24 sub-processes to turn an early stage business idea or need of a client into a working product or process that satisfies all expectations throughout its life cycle. In this approach mainly the “technical management” processes are well known and common practice (project planning\, risk management\, configuration management\, …). However\, some other\, often neglected aspects (thorough requirements definition\, verification\, information management\, …) are also indispensable to control budget\, timing and quality.This webinar outlines what systems engineering is and which specific aspects deserve attention.  \n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n Systems Engineering\n \n \n \n \n 1 file(s) 5.97 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Systems Engineering – video\n \n \n \n \n 1 file(s) 28.90 MB\n \n \n Login to download. URL:https://edmforum.eu/event/webinar-4system-engineering/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170530T000000 DTEND;TZID=Europe/Brussels:20170601T235959 DTSTAMP:20260709T122455 CREATED:20241008T102410Z LAST-MODIFIED:20241008T122129Z UID:8785-1496102400-1496361599@edmforum.eu SUMMARY:Electronics & Applications Beurs 2017: Toekomst van elektronicaproductie in de Benelux DESCRIPTION:Hoe ziet de Benelux markt voor elektronica productie er over 10 jaar uit? Veel productie is vetrokken naar Azië en later naar Oost-Europa. Maar dit was zeker niet altijd succesvol. Reshoring is een nieuwe trend. Maar de vraag van OEM’ers is wel veranderd. Om te kunnen voldoen aan kleine series en snelle levertijden moeten EMS’ers veranderen in een ‘smart factory’. De sprekers geven hun kijk op de toekomst en laten door middel van praktische presentaties zien hoe zij zich voorbereiden op de toekomst. \n\n\n\n\n\n\n\n\n\n\n\n\n\nEDM bijdrage: Donderdag 1 juni \n\n\n\n\n\n \n \n \n \n \n \n Competitief Elektronica Ontwerp en Assemblage dicht bij de klant\n \n \n \n \n 1 file(s) 2 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\nNa een periode van outsourcing van de elektronica assemblage naar het verre Oosten\, zien we meer en meer bedrijven de strategische beslissing nemen om productie dichter bij de (Westerse) klant te brengen. Geert Willems geeft zijn kijk op de redenen voor deze “re- of near-shoring”\, en hoe de kennis van alle processen en methodologieën\, vanaf het ontwerp tot bij de klant\, een belangrijke bijdrage levert tot het succes van deze bedrijven. De rol van Design-for-eXcellence\, modelering\, simulatie en virtuele prototyping wordt toegelicht aan de hand van enkele praktische voorbeelden. \n\n\n\n\n\nLocatie: Jaarbeurs Utrecht\, Jaarbeursplein\, 3521 AL Utrecht URL:https://edmforum.eu/event/electronics-applications-beurs-2017-toekomst-van-elektronicaproductie-in-de-benelux/ CATEGORIES:Events with EDM contribution END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170407T130000 DTEND;TZID=Europe/Brussels:20170407T170000 DTSTAMP:20260709T122455 CREATED:20231212T223741Z LAST-MODIFIED:20240726T114033Z UID:1806-1491570000-1491584400@edmforum.eu SUMMARY:PBA Technology Seminar and Factory Visit DESCRIPTION: URL:https://edmforum.eu/event/pba-tecnhology-session/ LOCATION:Connect Group Ieper\, Bargiestraat 2\, Ieper\, 8900\, Belgium CATEGORIES:Technology seminar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170406T100000 DTEND;TZID=Europe/Brussels:20170406T110000 DTSTAMP:20260709T122455 CREATED:20231212T224231Z LAST-MODIFIED:20240725T090724Z UID:1931-1491472800-1491476400@edmforum.eu SUMMARY:Webinar 2017-4-6: Virtual Testing of Thermal-Mechanical Reliability of Electronic Systems DESCRIPTION:Presented by: Bart Vandevelde – imec \n\n\n\nBefore electronic systems can be brought on the market\, they must fulfill qualification tests according to international standards and customer specified test programs. Thermal and mechanical environmental loadings are major causes for electronic system failures that also appear during these qualification testing. It is obvious that any failure after such a test is very expensive in terms of time and cost. Performing virtual testing in a simulation environment allows to find possible weak spots in the system already in early phase of the development when adaptations can be made easily. In this webinar\, we will show several examples how simulations are used to virtually test the electronic systems from the thermal and mechanical point of view. \n\n\n\n\n\n\n\n \n \n \n \n \n \n Virtual Testing of Thermal-Mechanical Reliability of Electronic Systems\n \n \n \n \n 1 file(s) 2.20 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Virtual Testing of Thermal-Mechanical Reliability of Electronic Systems – video\n \n \n \n \n 1 file(s) 37.00 MB\n \n \n Login to download. URL:https://edmforum.eu/event/webinar-3virtual-testing/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170310T130000 DTEND;TZID=Europe/Brussels:20170310T170000 DTSTAMP:20260709T122455 CREATED:20240726T113942Z LAST-MODIFIED:20240729T081201Z UID:5854-1489150800-1489165200@edmforum.eu SUMMARY:PCB Technology Seminar and Factory Visit DESCRIPTION: URL:https://edmforum.eu/event/pcb-technology-seminar-and-factory-visit-4/ LOCATION:ACB\, Vosmeer 3\, Dendermonde\, +3252202030\, 9200\, Belgium CATEGORIES:Technology seminar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170223T000000 DTEND;TZID=Europe/Brussels:20170226T235959 DTSTAMP:20260709T122455 CREATED:20241008T095503Z LAST-MODIFIED:20241008T095504Z UID:8778-1487808000-1488153599@edmforum.eu SUMMARY:KULeuven Course: Increasing your products immunity against electromagnetic disturbances: an approachable way. DESCRIPTION:The research group ReMI (Reliability in Mechatronics and ICT) organizes a course on basic and advanced techniques to increase the immunity of products against electromagnetic disturbances. \n\n\n\n\n\nue to the ever increasing use of electronic systems in almost every possible application\, the generation of possible disturbances has been continuously growing over the last decade with no signs that this trend will be broken. Besides\, one sees that electronic systems are being applied more and more in and for mission or even safety critical functions which require an extremely high resilience against all environmental stresses\, including electromagnetic disturbances\, over the whole foreseen lifetime. As a product developer it is often very difficult to assess the products environment\, let alone foresee the effect of various electromagnetic disturbances on the product itself.In this training course several topics about the immunity of electronic products and their electromagnetic environment are discussed. Low-cost pre-compliance debugging and protection techniques against ESD\, surge transients\, etc. are presented.Key-note speaker of this course is Keith Armstrong (UK). Keith has written many practical papers and books on design for EMC and EMC debugging. Much of his working life involves solving real-life EMC problems in high-technology products\, systems\, and installations\, for a variety of companies and organisations in a wide range of industries. Keith has always aimed to make products easy to design and manufacture\, work properly\, please their users\, and make money for their manufacturers. \n\n\n\nAgenda:  \n\n\n\nDay 1: \n\n\n\n\nIntro on EMC & immunity\n\n\n\nResilience to EM disturbances for mission- or safety-critical systems\n\n\n\nAssessing an EM environment\n\n\n\nOverview of basic EMC immunity test methods\n\n\n\nBasic low-cost precompliance immunity testing \n\n\n\n\nDay 2: \n\n\n\n\nAdvanced low-cost precompliance immunity testing\n\n\n\nProtection against ESD\n\n\n\nProtecting against surge\, transients\, etc\n\n\n\nProtecting from AC/DC power quality\n\n\n\n\nParticipation fee:  \n\n\n\n\n€650 (excl. VAT) for both days\n\n\n\n€350 (excl. VAT) for only day 1A 10% discount applies for members of Agoria\, the RELIM project or the INPROVOL project. The participation fee includes course notes\, lunches and coffee breaks. URL:https://edmforum.eu/event/kuleuven-course-increasing-your-products-immunity-against-electromagnetic-disturbances-an-approachable-way/ LOCATION:KHBO\, Zeedijk 101\, Oostende\, 8400 CATEGORIES:Partner Events END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170223T000000 DTEND;TZID=Europe/Brussels:20170223T235959 DTSTAMP:20260709T122455 CREATED:20241008T100206Z LAST-MODIFIED:20241008T100207Z UID:8780-1487808000-1487894399@edmforum.eu SUMMARY:Flanders Make First Seminar Day 2017 DESCRIPTION:Curious about how Flanders Makes research projects can strengthen your company? Then join them on the 23rd of February for their first of two seminar days of the year. On this day\, Flanders Make and speakers from the companies involved will present the results and lessons learned from three of the projects:– Waste heat recuperation in vehicles– Low-cost embedded 1D vision sensors for smart monitoring applications– Model-based design of drivetrain cooling systemsThe CEO Dirk Torfs will also give a presentation on the strategy of Flanders Make. \n\n\n\n\n\nParticipation fee:  \n\n\n\n\nFlanders Make member company: 50 € (95 € for the 2 sessions)\n\n\n\nNon-member company: 95 € (195 € for the 2 sessions)\n\n\n\n\nLocation: The Business Faculty\, Sint-Lendriksborre 6\, 1120 Neder-Over-Heembeek URL:https://edmforum.eu/event/flanders-make-first-seminar-day-2017/ CATEGORIES:Partner Events END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170202T100000 DTEND;TZID=Europe/Brussels:20170202T110000 DTSTAMP:20260709T122455 CREATED:20231212T224228Z LAST-MODIFIED:20240725T084040Z UID:1930-1486029600-1486033200@edmforum.eu SUMMARY:Webinar 2017-2-2: CE Marking DESCRIPTION:Presented by: Davy Pissoort – KU Leuven \n\n\n\nThe CE-mark (Conformité Européenne or European Conformity) is required for every electronic product that is put on the market within the European Economic Area. However\, a lot of questions and misunderstanding exist around what is exactly required and who should be involved with the CE-marking process. Within this seminar\, we will clarify the difference between directives and standards\, explain a typical conformity assessment procedure and describe the typical format of the final Declaration-of-Conformity. It will be stressed that the CE-marking on its own is not the evidence of compliance\, instead\, it is the Technical Documentation that gathers all arguments for claiming compliance. Advice will be given on how to identify the relevant directives and standards needed for this Technical Documentation. \n\n\n\n\n\n\n\n \n \n \n \n \n \n CE Marking of Electronic Products\n \n \n \n \n 1 file(s) 2.26 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n CE Marking of Electronic Products – video\n \n \n \n \n 1 file(s) 44.43 MB\n \n \n Login to download. URL:https://edmforum.eu/event/webinar-2ce-marking/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170125T090000 DTEND;TZID=Europe/Brussels:20170125T130000 DTSTAMP:20260709T122455 CREATED:20241008T094712Z LAST-MODIFIED:20241008T094757Z UID:8763-1485334800-1485349200@edmforum.eu SUMMARY:Innofour - DfR Solutions seminar: Implementing Physics of Failure into the Design Process DESCRIPTION:Innofour and DfR Solutions are pleased to invite you to the Seminar: “Implementing Physics of Failure into the Design Process” which will take place the 25th of January 2017 at High Tech Campus Eindhoven.Attend this unique seminar in which Dr. Craig Hillman\, Chief Executive Officer of DfR Solutions\, will introduce you to how PCB reliability analysis challenges are solved by Sherlock\, CAE software which is based on Physics of Failure (PoF).Pressure to design products under budget and on time are the biggest challenge of Engineering teams. The challenge requires new methods to break away from the old design-build-test-fix iterative ad-hoc engineering flow. Physics based simulation is proving to be the way to make this change.In this seminar\, you will learn about the best methods and tools to incorporate the Physics of Failure modeling approach into your design process. You will gain information that will help you develop better\, more reliable products faster and more efficiently no matter what industry you are in. \n\n\n\n\n\nAgenda:  \n\n\n\n09:00-09:30 Registration and coffee09:30-10:45 Physics of Failure and Design for Reliability10:45-11:00 Coffee break11:00-12:15 Introduction to Sherlock12:15-12:30 Coffee break12:30-13.00 User cases and future plans \n\n\n\nLocation: High Tech Campus\, Eindhoven URL:https://edmforum.eu/event/innofour-dfr-solutions-seminar-implementing-physics-of-failure-into-the-design-process/ CATEGORIES:Partner Events END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20170112T100000 DTEND;TZID=Europe/Brussels:20170112T110000 DTSTAMP:20260709T122455 CREATED:20231212T224228Z LAST-MODIFIED:20240725T083947Z UID:1929-1484215200-1484218800@edmforum.eu SUMMARY:Webinar 2017-1-12: How FMEA Can Improve the Reliability of Your Product DESCRIPTION:Presented by: Riet Labie – imec \n\n\n\nAn FMEA (Failure Mode and Effect Analysis) procedure is a risk assessment method that helps to pinpoint critical design choices of your product. In this webinar we will explain how to apply this method to a PBA (Printed Board Assembly). A differentiation is made between failures at the level of the PCB\, component failures and failures at the interconnection level. A list of common failure mechanisms is documented in a database which serves as a guide through the risk assessment process. For each of the potential malfunctions\, the critical parameters that influence the occurrence of the failure are listed. By gaining a better understanding of the effect of these parameters\, the effect of certain design choices on the final product performance will become more clear. Some practical examples will be shown to improve your knowledge on the methodology as well as on some of the potentially occurring (and avoidable) errors. \n\n\n\n\n\n\n\n \n \n \n \n \n \n How FMEA Can Improve the Reliability of Your Product\n \n \n \n \n 1 file(s) 2.51 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n How FMEA Can Improve The Reliability of Your Product – video\n \n \n \n \n 1 file(s) 30.40 MB\n \n \n Login to download. URL:https://edmforum.eu/event/webinar-1fmea/ CATEGORIES:Webinar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20161125T140000 DTEND;TZID=Europe/Brussels:20161125T190000 DTSTAMP:20260709T122455 CREATED:20231212T223923Z LAST-MODIFIED:20240726T074555Z UID:1819-1480082400-1480100400@edmforum.eu SUMMARY:EDM Event 2016: The Extended imec - What Can It Bring to Our industry? DESCRIPTION:Press release 22/9/2016Renewed imec confirms its role as the world’s leading research center for nanoelectronics and digital technology \n\n\n\nGhent and Leuven – 22 September 2016. Since yesterday\, the merger between research centers imec and iMinds – announced on February 19 – has been completed. The deed of merger was officially signed in Brussels\, in the presence of Flemish minister-president Geert Bourgeois and Flemish minister for work\, the economy\, innovation and sport Philippe Muyters. iMinds vzw thereby ceased to exist\, but its activities are making a new start within imec\, which is now stronger than ever as a unique high-tech research center for the digital economy. \n\n\n\nNo doubt you have heard about the merger of imec with the iMinds research organization. The extended imec combines the world class electronics hardware technology of imec with the state-of-the-art software expertise of iMinds and its well-established innovation services supporting regional industry. \n\n\n\n1+1>3 on the innovation front\, that is what the extended imec is aiming for. The combination of advanced hardware\, the newest software techniques\, data science\, living labs to assess user experience and effective\, low threshold innovation services creates a large potential to boost the innovative strength and the international competiveness of our industry\, especially the manufacturing industry. \n\n\n\nIn this event we will provide a concise overview of the software and data science competences of imec. Responsibles from imec’s Innovation Services will present innovation tools as imec.icon\, imec.livinglabs and software prototyping with practical realizations and examples in the domain of smart cities\, smart energy\, health care\, mobility\, logistics and industry 4.0.Before diving into the new opportunities an overview of the cEDM activities will be presented. \n\n\n\nAgenda \n\n\n\n14h00Welcome14h10Trends for the electronic industry and cEDM’s offering responseGeert Willems – imec14h45Smart applications & Innovation servicesTanguy Coenen – imec15h45Q&A16h00Networking and visit to booths\n\n\n\n\n\n\n\n \n \n \n \n \n \n Trends for the Electronic Industry\n \n \n \n \n 1 file(s) 5.39 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Smart applications & Innovation Services\n \n \n \n \n 1 file(s) 3.60 MB\n \n \n Login to download. URL:https://edmforum.eu/event/cedm-program-event/ LOCATION:Imec Leuven\, Kapeldreef 75\, Leuven\, 3001\, Belgium CATEGORIES:EDM event END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20161123T083000 DTEND;TZID=Europe/Brussels:20161123T160000 DTSTAMP:20260709T122455 CREATED:20241008T093150Z LAST-MODIFIED:20241008T093446Z UID:8759-1479889800-1479916800@edmforum.eu SUMMARY:NMI/DSP Valley imec event 2016: Silicon to Systems DESCRIPTION:Program \n\n\n\n\n\nFollowing on from last years’ Silicon to Systems event\, NMI have this year partnered with imec and DSP Valley to bring you the latest in how to develop low cost Application Specific Integrated Circuits (ASICs) for almost any application.Many people are put off designing ASICs because they think it’s too hard\, too expensive or they don’t have the skills. This conference aims to show you that an ASIC could be easier and less costly than you think. It will show there are a range of strategies that can be used to successfully implement an ASIC solution even in low to moderate volumes.Come along to imec’s headquarters in Leuven\, Belgium and hear from the experts and peers on how to do it\, how it may be easier and less costly than you think. \n\n\n\n\n\nCome and see some case studies that show designing your own ASIC can be done at a very low cost and without the need for acquiring significant overhead. You will hear about some of the other advantages\, such as IP protection\, that comes with low cost ASICS. So no matter if it’s a first time design in ASIC or a cost reduction from FPGA or PCB this conference has something for you.There is strong interest in this event expect to hear keynote speakers from TSMC and imec together with contributions from a range of other industry speakers as well as several real world case studies.According to Phill Christie of the Business Technolgoy & Strategy Group at imec “The continued falling cost of ASIC manufacturing is a message that really needs to get out. This message is especially important for start-ups and SMEs focussing on IoT markets\, where more mature technologies have a strong role play. I think the conference on Easy Access ASICs will be a tremendous networking opportunity and an excellent way to gain access to the low-cost manufacturing infra-structure that is now in place.”Patrick McNamee from the NMI continued “ It seems that in semiconductors all the news in the last year or so has been about mergers and acquisitions. However our members are telling us that there is a real and growing demand from SME’s to enable them to get into ASIC for a whole range applications including IOT\, medical and automotive sectors this conference should demonstrate several ways this can be achieved at low cost.” URL:https://edmforum.eu/event/nmi-dsp-valley-imec-event-2016-silicon-to-systems/ LOCATION:Imec Leuven\, Kapeldreef 75\, Leuven\, 3001\, Belgium CATEGORIES:Partner Events END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20161028T130000 DTEND;TZID=Europe/Brussels:20161028T170000 DTSTAMP:20260709T122455 CREATED:20240726T113352Z LAST-MODIFIED:20240726T114841Z UID:5850-1477659600-1477674000@edmforum.eu SUMMARY:PCB Technology Seminar and Factory Visit DESCRIPTION:PCB Technology Seminar 2016 Program\n \n \n \n \n 1 file(s) 159.70 KB\n \n \n Download URL:https://edmforum.eu/event/pcb-technology-seminar-and-factory-visit-3/ LOCATION:ACB\, Vosmeer 3\, Dendermonde\, +3252202030\, 9200\, Belgium CATEGORIES:Technology seminar END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20161018T000000 DTEND;TZID=Europe/Brussels:20161019T235959 DTSTAMP:20260709T122455 CREATED:20241008T092209Z LAST-MODIFIED:20241008T092407Z UID:8755-1476748800-1476921599@edmforum.eu SUMMARY:EuWorel 2016: 4th European Expert Workshop on Reliability of Electronics and Smart Systems DESCRIPTION:cEDM attended the “4th European Expert Workshop on Reliability of Electronics and Smart Systems” in Berlin. About 30 reliability experts from mainly industrial companies attended this workshop which is the annual forum for addressing the concerns of reliability\, robustness\, and functional safety of new products and technologies in the field of electronics and smart systems. It makes further research requirements on reliability methodology clearly visible\, not only to the electronics packaging community but also to the representatives of funding agencies at national and European levels. \n\n\n\n\n\nThe first day of the workshop was dedicated to latest results on reliability research presented by the experts. The second day The second elaborated on the research direction concerning functional safety and system availability\, i.e.\, on new methods for self-diagnostics\, predictive and preventive maintenance. Right now\, these subjects receive massive attention as they are seen as key enablers of many of the new application scenarios: Autonomous driving\, Industry 4.0\, Smart grid and other smart infra-structure solutions.Finally\, a roadmap for Prognostic Health Monitoring (PHM) is defined during the meeting which will guide the research in the coming years. \n\n\n\nLocation: Berlin\, Germany URL:https://edmforum.eu/event/euworel-2016-4th-european-expert-workshop-on-reliability-of-electronics-and-smart-systems/ CATEGORIES:Events with EDM contribution END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20161013T113000 DTEND;TZID=Europe/Brussels:20161013T180000 DTSTAMP:20260709T122455 CREATED:20241008T091615Z LAST-MODIFIED:20241008T091648Z UID:8752-1476358200-1476381600@edmforum.eu SUMMARY:Innovatiebeurs 2016 DESCRIPTION:Op 13 oktober (van 11u30 tot 18u) organiseren de Innovatiecentra de 6de editie van hun Innovatiebeurs\, een must voor alle ondernemers om in contact te komen met experts aan alle Vlaamse kennisinstellingen en onderzoekscentra. Op deze beurs in C-mine in Genk ontdek je de meest recente ontwikkelingen en innovaties\, en leer je hoe je die in jouw bedrijf kan toepassen. Ook met specifieke vragen over jouw bedrijf kan je die dag terecht bij de experts en onderzoekers\, en dus ook bij ons! \n\n\n\n\n\nImec neemt als exposant deel aan deze beurs en je kan met onze technologie en ruime dienstverlening kennismaken op maar liefst 3 verschillende eilanden: \n\n\n\n\nBouw\, milieu\, energie en chemie\n\n\n\nZorg\, agro\, food en lifetech\n\n\n\nMaakindustrie en logistiek\n\n\n\n\nOp onze standen kan je praten met onze technologiecoaches\, en je kan experimenteren met onze demo’s. Wij beantwoorden jouw vragen rond o.a. slimme elektronische systemen\, zonnecellen\, draadloze communicatie\, biomedische-elektronica\, geavanceerde beeldvorming\, de betrouwbaarheid van elektronica assemblages \, organische (“plastiek”) elektronica\, sensoren en fotonica. En dankzij de fusie (op 1 oktober 2016) met iMinds breiden we ons R&D aanbod verder uit in de domeinen IoT\, Data Science en Security.Het uitgebreide programma voor 13 oktober biedt voor ieder wat wils. Bezoekers kunnen al voor de opening van de beurs de handen uit de mouwen steken tijdens 3 workshops. \n\n\n\n\n‘Cross-industry innovation’ i.s.m. Marc Heleven.\n\n\n\n‘Innoveren met gebruikers’ i.s.m. Lifetech Valley (zorgsector)\n\n\n\n‘Bouw breekt uit’ i.s.m. Confederatie Bouw\n\n\n\n\nNadien zorgen keynote sprekers voor inspiratie! \n\n\n\n\nCreatieve duizendpoot en topproducent Tim Van Aelst (Saftey First\, Benidorm Bastards\, …) getuigt hoe creatief ondernemerschap gepaard gaat met veel vallen en nog meer opstaan.\n\n\n\nIngenieur\, ondernemer en ‘Chef wetenschap’ van de Laatste Show Filip Van den Abeele legt uit hoe ondernemers zich kunnen voorbereiden op Industry 4.0.\n\n\n\nOnline-onderneemster Kim Hardy vertelt hoe hogescholen hielpen om haar bedrijf Mamzel incontournable te maken.\n\n\n\n\nRichting kwijt? Geen probleem: de excursiebegeleiders nemen je graag mee op een geleid bezoek aan de eilanden. ’s avonds sluiten de Innovatiebeurs af met een Captain’s drink\, het ideale moment om te netwerken. \n\n\n\nLocatie: C-mine\, Genk URL:https://edmforum.eu/event/innovatiebeurs-2016/ CATEGORIES:Partner Events END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20160930T140000 DTEND;TZID=Europe/Brussels:20160930T180000 DTSTAMP:20260709T122455 CREATED:20231212T224102Z LAST-MODIFIED:20240726T074528Z UID:1859-1475244000-1475258400@edmforum.eu SUMMARY:EDM Workshop 25: 10 Years of RoHS DESCRIPTION:10 years ago\, July 1st\, 2006 to be exact\, the EU directive 2002/95/EC RoHS (Restriction of Hazardous Substances in electrical and electronic equipment) came into effect. The goal of this directive is to reduce the use of six hazardous materials in the electronics industry : Pb\, Hg\, Cd\, Cr6+ and the flame retardants PBB and PBDE. \n\n\n\nThe electronics industry started preparing for this directive well in advance. It proved to have an impact to the operations of the electronic industry as well as on electronics quality and reliability\, larger than what some expected. \n\n\n\nMainly the use of lead-free soldering processes\, and the subsequent higher soldering temperature\, induced a change in the choice of solder alloys and flux formulations\, PCB substrate material\, board and terminal finishes\, component mold compounds and lead to more thermal stress to the components during soldering. It also changed the way we look at reliability of electronic modules. Even some of the well-established design rules required revision. \n\n\n\nOn the other hand\, the requirement of traceability of RoHS compliancy over the total supply chain was a logistical challenge\, both for the component suppliers\, for the manufacturers ERP systems and for the quality departments in the companies. As an extra complexity\, the exemptions for some sectors meant that most manufacturing companies had the need to run both lead-free and SnPb solder processes simultaneously (some still do). \n\n\n\nDuring this workshop\, we will focus on legislation and on the material aspects of the RoHS story. Below you find a short overview of the presentations that will be given during the workshop. \n\n\n\nAgenda \n\n\n\n14h00IntroductionThe future of RoHS\, what is still coming up?In the last ten years\, we got used to RoHS. Even the recast of 2011 did not fundamentally change the way RoHS works. But will this also be true for the next ten years? And what about other EU policies coming up? Let us take a look at the EU negotiation table.Johan Daniëls – FOD Leefmilieu\, Afdeling ProductbeleidSoldering Materials and chemistry : evolution in the past 10 years of RoHS and future challenges and trends.Steven Teliszewski – Interflux electronicsConductive adhesives as alternative for solder\, or is there more?Jochen Schuermans – RoartisLead-Free soldering : a challenge for PCB base materialsAdolf Sommer\, Manager of Application Engineering : ISOLA group17h00Networking\n\n\n\n\n\n\n\n \n \n \n \n \n \n EDM Workshop 25 program\n \n \n \n \n 1 file(s) 238.22 KB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Intro EDM Workshop 25\n \n \n \n \n 1 file(s) 1.37 MB\n \n \n Download\n \n \n \n \n \n\n\n\n\n\n\n\n\n\nFor members only \n\n\n\n\n\n \n \n \n \n \n \n The Future of RoHS: What Is Still Coming Up\n \n \n \n \n 1 file(s) 375.45 KB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n 10 Years of RoHS and Future Challenges and Trends in Soldering Chemistry\n \n \n \n \n 1 file(s) 2.56 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\n\n\n \n \n \n \n \n \n Conductive Adhesives as Alternative for Solder\n \n \n \n \n 1 file(s) 1.24 MB\n \n \n Login to download. \n \n \n \n \n \n\n\n\n\n\nDue to confidentiality\, full presentation is not available. Please\, contact jochen.schuermans@roartis.com for further details and a copy of the original presentation. \n\n\n\n\n\n\n\n\n\n \n \n \n \n \n \n Lead Free Soldering: a Challenge for PCB Base Materials\n \n \n \n \n 1 file(s) 2.05 MB\n \n \n Login to download. URL:https://edmforum.eu/event/cedm-workshop-25/ LOCATION:Imec Leuven\, Kapeldreef 75\, Leuven\, 3001\, Belgium CATEGORIES:Workshop END:VEVENT END:VCALENDAR