Workshops

Date:
Thursday, April 25, 2024
Presentations:

Intro
Presentation 1: A paradigm shift in electronic product development (Geert Willems, imec)
Presentation 2: Digitalization in the electronics industry (Jeroen De Jong, Siemens)
Presentation 3: Smart manufacturing for electronics (Jean-Paul Dirven, Siemens)
Presentation 4: Analysis driven design for electronics Part II (Julian Lai and Heiko Dudek, Siemens)
Presentation 5: Supply Chain management (Andres Maya, Siemens)
Presentation 6: PLC management for electronics (Jeroen De Jong, Siemens)

Date:
Wednesday, October 11, 2023
Presentations:
  • Intro: Introduction
  • Presentation 1: Introduction to Life Cycle Assessment, LCI and LCIA
  • Presentation 2: Internet-of-Things for the best and the worst
  • Presentation 3: Lean eco-design of electronics based on parametric LCI analysis
  • Presentation 4: Parametric LCI analysis of PCB manufacturing and assembly
  • Presentation 5: Assessing the environmental impact of integrated circuit chip manufacturing
Date:
Friday, November 4, 2022
Presentations:
  • Presentation 1: System Engineering based Smart Product Exploration.
  • Presentation 2: Smart Product development readiness of the system engineering organization.

Electronics Cooling and Interconnect Technologies

for Vehicle Computers

Date:
Tuesday, May 18, 2021
Presentations:
  • Introduction: HIPER: Introduction to collaborative research project on High Performance Vehicle Processors
  • Presentation 1: Advanced 3D printing solutions for advanced processor cooling
  • Presentation 2 Part A: 3D printing technology
  • Presentation 2 Part B: Simulation and characterisation of cooling performance of 3D printed heat sink
  • Presentation 3: Low melting point solder technology for advanced processor components

Towards an Improved Lifetime Prediction of Electronics

Date:
Friday, January 10, 2020
Presentations:
  • Introduction
  • Presentation 1: Reliability by design approach for life time prediction of electronic systems
  • Presentation 2: Challenging the acceleration factor models by a Long-Term life Testing on a soldered board assembly
  • Presentation 3: Engineering model for the life prediction of LED drivers
  • Presentation 4: Design-for-Robustness for electronics
  • Video of workshop

 

Space Electronics for the 21st Century

 

Date:
Thursday, June 13, 2019
Presentations:
  • Presentation 1: Introduction to Space Electronics for the 21st Century
  • Presentation 2: Improving Space Electronics: a review of opportunities
  • Presentation 3: Electronics for earth orbit satellite missions: Proba-V
  • Presentation 4: Life Cycle Assessment and eco-design of the PROBA-V space mission: focus on space electronics
  • Presentation 5: High-density Printed Circuit Boards for Space Electronics
  • The ESA and Verhaert presentations were cancelled because of last-minute unavailability of the speakers.

Smart New Product Introduction

Date:
Wednesday, November 7, 2018
Presentations:
  •  Presentation1: Predictive New Product Introduction for Smart Products
  •  Presentation2: New Product Introduction Process in a Startup Company
  •  Presentation3: Think before you act, leads to “right first time”
  •  Presentation4: World Wide NPI: the PBA Passport opens the manufacturing doors
  •  Presentation5: The Smart Product Initiative

Flexible Electronics

Date:
Wednesday, May 23, 2018
Presentations:
  •  Presentation1: Advantages and challenges of flex-rigid PCB technology
  •  Presentation2: Challenges in design and assembly using flex substrates
  •  Presentation3: Challenges and opportunities in printed electronics manufacturing
  •  Presentation4: Stretchable circuits

Reliable Electronics for Aerospace

Date:
Thursday, January 18, 2018
Presentations:
  •  Presentation1: Challenges of segmented supply chains in component qualification for space
  •  Presentation2: Automatization for large solar panels assembly
  •  Presentation3: Reliable electronics for aerospace
  •  Presentation4: Aluminum silicon carbide
  •  Presentation5: Contribution of multiphysics simulation to reliable microsystem packaging

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