Thermal Via Design

The ‘Thermal Via Design Calculator’ calculates the optimal design (size, spacing, distribution) for thermal plated through vias in a PCB thermal pad. Input parameters are the via density class and soldermask density class as defined in EDM-D-005, the dimensions of the thermal pad, the PCB thickness and the via drill diameter. The calculator takes into account a minimum required solderable area and calculates the thermal resistance of the via network.