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Design-for-X Guidelines
The PBA DfX Guidelines provide practical guidelines to master the multi-disciplinary hardware aspects of electronic module (PBA) development.
EDM-D-000 Good Design-for-X Practice
1 file(s) 443 KB
EDM-D-001 PCB Specification
1 file(s) 1 MB
EDM-D-002 Component Specification
1 file(s) 484 KB
EDM-D-003 PBA Assembly Material Specification
1 file(s) 650 KB
EDM-D-004 Design-for-Assembly
1 file(s) 1 MB
EDM-D-005 Rigid PCB Build-Up and Density Classification
1 file(s) 1,019 KB
EDM-D-006 Layout Solutions
1 file(s) 1 MB
EDM-D-007 Quality and Test Coverage Quantification
1 file(s) 1 MB
EDM-D-008 Technology and Manufacturing Capability Mapping of PBA Designs
1 file(s) 657 KB
EDM-D-009 Signal Integrity
1 file(s) 1 MB
EDM-D-010 Power Integrity
1 file(s) 843 KB
EDM-D-011 Electro-Magnetic Compatibility
1 file(s) 876 KB
EDM-D-012 Mechanical Integration
1 file(s) 2 MB
EDM-D-013 Thermal Design of Electronics
1 file(s) 2 MB
EDM-D-014 Design-for-Robustness
1 file(s) 882 KB
EDM-D-100 Reliability Quantification
1 file(s) 733 KB
EDM-D-202 Design of Electronic Medical Devices
1 file(s) 317 KB
Note: All prices are exclusive VAT.
Use and implementation of EDM DfX Guidelines
| DfX Guideline | OEM, Design and industrialisation | EMS and in-house assembly | PCB manufacturer |
| EDM-D-000 | General design guidelines: high level design deployable in conceptual design phase. | Good DfX practice reference for communication with customers. Background knowledge. | Good DfX practice reference for communication with customers. Background knowledge. |
| EDM-D-001 | Design and purchasing instructions for PCB laminate Implementation: design rules, purchasing instructions. – Lead-free compatibility of PCB.– Design-for-reliability of PCB (via fatigue). – PCB Quality/performance requirements. – Solderable finish selection. | Purchasing instructions for PCB. – Lead-free compatibility of PCB. – Design-for-reliability of PCB (via fatigue). – PCB Quality/performance requirements. – Solderable finish selection. Assemby preparation and handling – Moisture management of PCB: storage and drying. – Packing PCB for storage. – PCB damage prevention in assembly and repair. | Purchasing instructions for PCB laminate, customer information. – Lead-free compatibility of PCB. – Design-for-reliability of PCB (via fatigue). – Solderable finish. – Assemby preparation and handling. – Moisture management of PCB: storage and drying. – Packing PCB for storage. |
| EDM-D-002 | Design and purchasing instructions for components. Implementation: Approved Components and Manufacturer’s List(s). – Lead-free compatibility of BOM. – Design-for-Reliability of PBA (solder joint, SIR, whisker,… ). – Component Quality/performance requirements. – Terminal finish selectionDesign-for-Assembly: component aspects. – MSL and PSL definition and use for process compatibility (J-STD-020/J-STD-075). | Purchasing instructions for components. Implementation: Approved Components and Manufacturers List(s). – Lead-free compatibility of BOM. – Assessment of reliability risk of PBA (solder joint, SIR, whisker,… ): liability risks of EMS, customer feedback. – Component Quality/performance requirements. – Terminal finish selectionAssembly preparation and handling. – Moisture management of components: storage and drying. – J-STD-020/J-STD-075. – Reflow profile and wave soldering process set-up. – BOM damage prevention: check for lead-free soldering incompatibility, soldering/cleaning limitations. – PSL (J-STD-075)inspection instructions. | Background info |
| EDM-D-003 | Design (material selection, design-for-cleaning) and assembly instructions. Implementation: Design rules, Assembly instructions. – RoHS, SnPb, lead-free alloy selection. – Design-for-Reliability of PBA (alloy selection,mixed alloys, SIR, thermal mismatch). – Assembly material quality/performance requirements. | Assembly material selection, qualification and handling Implementation: Qualification, Purchasing, Process and production floor management instructions. – RoHS, SnPb, lead-free alloy selection. – Reliability risk mitigation of PBA (alloy selection,mixed alloys, SIR, thermal mismatch): select safe materials. – Assembly material quality/performance requirements. – Assembly material storage and handling. | Background info |
| EDM-D-004 | Design rules and assembly plant selection and instructions Implementation: design rules, PBA passport, NPI release, EMS purchasing instructions. – Automatic machine handling. – Selection of PBA build-up and associated assembly flow. – BOM compatibility with assembly processes. – Component placement – Rework and repair. | Assembly preparation Implementation: Assembly preparation instructions , methods and tools. – Identification of assembly flow. – BOM & layout process compatibility check. – Reflow profile and wave soldering process set-up. – Component collection, machine assignment,… – Assembly cost estimation | Background info |
| EDM-D-005 | Design rules and PCB plant selection and instructions. Implementation: design rules, PBA passport, NPI release, PCB purchasing instructions. – PCB build-up. – Selecting optimal PCB density class: minimization of cost and complexity. – Cu thickness. – Selecting design matched PCB supplier using density classes. – Criteria for selecting advanced PCB technologies. – Quality and reliability risks of advanced technologies. – PCB build-up nomenclature. | PCB plant selection and instructions Implementation: PBA passport, PCB purchasing instructions. – Selecting design matched PCB supplier using density classes. – Quality and reliability risks of advanced PCB technologies: risk assessment.PCB build-up nomenclature. – Input for solder process and repair set-up. | PCB manufacturing capabilities, customer support. Implementation: nomenclature, technical capacity identification. – Communication of technical capabilities. – Quality and reliability risk assessment and related customer communication. |
| EDM-D-006 | Layout rules. Implementation: footprint library, layout rules, design checks. – Footprint design basics for BGA, QFN,… – Thermal relief. | Design check. Implementation: DfM check. | Design check. Implementation: DfM check. |
| EDM-D-007 | Assembly risk assessment, quality and yield prediction, Design-for-Test. Implementation: Test strategy development instructions, DfM/DfT evaluation, NPI release. – Quality quantification methodology. – Test coverage quantification. – Test strategy development basics. – DfT guidelines for production test and inspection. – Quality, Test and Non-quality cost prediction. | Assembly risk assessment, quality and yield prediction, Test strategy set-up. Implementation: Test strategy development instructions, manufacturability and testability assessment, cost estimation method. – Quality quantification methodology. – Test coverage quantification. – Test strategy development basics. – Quality, Test and Non-quality cost prediction. – Customer communication and quotation. | Background info |
| EDM-D-008 | – Identification of technology, manufacturing and test capability needs for PCB and PBA: PBA Passport. – Design-for-X evaluation. – Cost, quality, reliability and supply risk assessment. – PCB supplier selection and qualification. – PBA assembly selection and evaluation. | – Assembly capability mapping. – PBA design assembly analysis and quotation. – Assembly preparation. – Customer communication. | – PCB manufacturing capability mapping. – PCB manufacturing analysis and quotation. – Manufacturing preparation. – Customer communication. |
| EDM-D-009 | Design guidelines to guarantee signal integrity on PBA. | Background info | Clarification of PCB layout |
| EDM-D-010 | Design guidelines to guarantee power integrity on PBA. | Background info | Clarification of PCB layout |
| EDM-D-011 | Design guideline to guarantee Electro-Magnetic Compatibility in a system. | Background info | Clarification of PCB layout |
| EDM-D-012 | – Understanding impact of vibration and PBA fixation on PBA reliability. – Vibration load assessment. – Guidelines for pre-layout fixation point and stiffner location. | Background info | Background info |
| EDM-D-013 | Thermal design of PBA in a system. | Clarification of PBA build-up: heat sinks. | Clarification of PBA build-up: heat sinks. |
| EDM-D-014 | Design-for-Robustness of PBA. | Design-for-Robustness of PBA support. | Design-for-Robustness of PBA support. |
| EDM-D-100 | Reliability quantification, assessment and lifetime prediction. | Basics of reliability risk assessment of delivered products. Assessment of stress screening (e.g. burn-in) relevancy. | Background info |
| EDM-D-202 | Basic design aspects for medical devices to be CE (EU) or FDA (USA) certified. | Basic design aspects for medical devices to be CE (EU) or FDA (USA) certified. | Basic design aspects for medical devices to be CE (EU) or FDA (USA) certified. |