The PBA DfX Guidelines provide practical guidelines to master the multi-disciplinary hardware aspects of electronic module (PBA) development.

DfX
Guideline		TitleMembers (free)Public
EDM-D-000Good Design-for-X Practice – previewdownloadfree download1
EDM-D-001PCB Specification – previewdownload€100 request
EDM-D-002Component Specification – previewdownload€50 request
EDM-D-003PBA Assembly Material Specification – previewdownload€50 request
EDM-D-004Design-for-Assembly – previewdownload€80 request
EDM-D-005Rigid PCB Build-Up and Density Classification – previewdownload€80 request
EDM-D-006Layout Solutions – previewdownload€80 request
EDM-D-007Quality and Test Coverage Quantification – Design-for-Test – previewdownload€80 request
EDM-D-008Technology and Manufacturing Capability Mapping of PBA designs – previewdownload€50 request
EDM-D-009Signal Integrity – previewdownload€50 request
EDM-D-010Power Integrity – previewdownload€50 request
EDM-D-011Electro-Magnetic Compatibility – previewdownload€50 request
EDM-D-012Mechanical Integration – previewdownload€80 request
EDM-D-013Thermal design of electronics – previewdownload€80 request
EDM-D-014Design-for-Robustness –  previewdownload€80 request
EDM-D-100Reliability Quantification – previewdownload€50 request
EDM-D-202Design of Electronic Medical Devices – previewdownload€50 request

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Use and implementation of EDM DfX Guidelines

DfX
Guideline		OEM, Design and industrialisationEMS and in-house assemblyPCB manufacturer
EDM-D-000General design guidelines: high level design deployable in conceptual design phase.Good DfX practice reference for communication with customers. Background knowledge.Good DfX practice reference for communication with customers. Background knowledge.
EDM-D-001

Design and purchasing instructions for PCB laminate Implementation: design rules, purchasing instructions.

– Lead-free compatibility of PCB.
– Design-for-reliability of PCB (via fatigue).
– PCB Quality/performance requirements.
– Solderable finish selection.		Purchasing instructions for PCB.
– Lead-free compatibility of PCB.
– Design-for-reliability of PCB (via fatigue).
– PCB Quality/performance requirements.
– Solderable finish selection.
Assemby preparation and handling
– Moisture management of PCB: storage and drying.
– Packing PCB for storage.
– PCB damage prevention in assembly and repair.		Purchasing instructions for PCB laminate, customer information.
– Lead-free compatibility of PCB.
– Design-for-reliability of PCB (via fatigue).
– Solderable finish.
– Assemby preparation and handling.
– Moisture management of PCB: storage and drying.
– Packing PCB for storage.
EDM-D-002Design and purchasing instructions for components.
Implementation: Approved Components and Manufacturer’s List(s).
– Lead-free compatibility of BOM.
– Design-for-Reliability of PBA (solder joint, SIR, whisker,… ).
– Component Quality/performance requirements.
– Terminal finish selectionDesign-for-Assembly: component aspects.
– MSL and PSL definition and use for process compatibility (J-STD-020/J-STD-075).		Purchasing instructions for components.
Implementation: Approved Components and Manufacturers List(s).
– Lead-free compatibility of BOM.
– Assessment of reliability risk of PBA (solder joint, SIR, whisker,… ): liability risks of EMS, customer feedback.
– Component Quality/performance requirements.
– Terminal finish selectionAssembly preparation and handling.
– Moisture management of components: storage and drying.
– J-STD-020/J-STD-075.
– Reflow profile and wave soldering process set-up.
– BOM damage prevention: check for lead-free soldering incompatibility, soldering/cleaning limitations.
– PSL (J-STD-075)inspection instructions.		Background info
EDM-D-003Design (material selection, design-for-cleaning) and assembly instructions.
Implementation: Design rules, Assembly instructions.
– RoHS, SnPb, lead-free alloy selection.
– Design-for-Reliability of PBA (alloy selection,mixed alloys, SIR, thermal mismatch).
– Assembly material quality/performance requirements.		Assembly material selection, qualification and handling
Implementation: Qualification, Purchasing, Process and production floor management instructions.
– RoHS, SnPb, lead-free alloy selection.
– Reliability risk mitigation of PBA (alloy selection,mixed alloys, SIR, thermal mismatch): select safe materials.
– Assembly material quality/performance requirements.
– Assembly material storage and handling.		Background info
EDM-D-004Design rules and assembly plant selection and instructions
Implementation: design rules, PBA passport, NPI release, EMS purchasing instructions.
– Automatic machine handling.
– Selection of PBA build-up and associated assembly flow.
– BOM compatibility with assembly processes.
– Component placement
– Rework and repair.		Assembly preparation
Implementation: Assembly preparation instructions , methods and tools.
– Identification of assembly flow.
– BOM & layout process compatibility check.
– Reflow profile and wave soldering process set-up.
– Component collection, machine assignment,…
– Assembly cost estimation		Background info
EDM-D-005Design rules and PCB plant selection and instructions.
Implementation: design rules, PBA passport, NPI release, PCB purchasing instructions.
– PCB build-up.
– Selecting optimal PCB density class: minimization of cost and complexity.
– Cu thickness.
– Selecting design matched PCB supplier using density classes.
– Criteria for selecting advanced PCB technologies.
– Quality and reliability risks of advanced technologies.
– PCB build-up nomenclature.		PCB plant selection and instructions
Implementation: PBA passport, PCB purchasing instructions.
– Selecting design matched PCB supplier using density classes.
– Quality and reliability risks of advanced PCB technologies: risk assessment.PCB build-up nomenclature.
– Input for solder process and repair set-up.		PCB manufacturing capabilities, customer support.
Implementation: nomenclature, technical capacity identification.
– Communication of technical capabilities.
– Quality and reliability risk assessment and related customer communication.
EDM-D-006Layout rules.
Implementation: footprint library, layout rules, design checks.
– Footprint design basics for BGA, QFN,…
– Thermal relief.		Design check.
Implementation: DfM check.		Design check.
Implementation: DfM check.
EDM-D-007Assembly risk assessment, quality and yield prediction, Design-for-Test.
Implementation: Test strategy development instructions, DfM/DfT evaluation, NPI release.
– Quality quantification methodology.
– Test coverage quantification.
– Test strategy development basics.
– DfT guidelines for production test and inspection.
– Quality, Test and Non-quality cost prediction.		Assembly risk assessment, quality and yield prediction, Test strategy set-up.
Implementation: Test strategy development instructions, manufacturability and testability assessment, cost estimation method.
– Quality quantification methodology.
– Test coverage quantification.
– Test strategy development basics.
– Quality, Test and Non-quality cost prediction.
– Customer communication and quotation.		Background info
EDM-D-008– Identification of technology, manufacturing and test capability needs for PCB and PBA: PBA Passport.
– Design-for-X evaluation.
– Cost, quality, reliability and supply risk assessment.
– PCB supplier selection and qualification.
– PBA assembly selection and evaluation.
– Assembly capability mapping.
– PBA design assembly analysis and quotation.
– Assembly preparation.
– Customer communication.		– PCB manufacturing capability mapping.
– PCB manufacturing analysis and quotation.
– Manufacturing preparation.
– Customer communication.
EDM-D-009Design guidelines to guarantee signal integrity on PBA.Background infoClarification of PCB layout
EDM-D-010Design guidelines to guarantee power integrity on PBA.Background infoClarification of PCB layout
EDM-D-011Design guideline to guarantee Electro-Magnetic Compatibility in a system.Background infoClarification of PCB layout
EDM-D-012– Understanding impact of vibration and PBA fixation on PBA reliability.
– Vibration load assessment.
– Guidelines for pre-layout fixation point and stiffner location.		Background infoBackground info
EDM-D-013Thermal design of PBA in a system.Clarification of PBA build-up: heat sinks.Clarification of PBA build-up: heat sinks.
EDM-D-014Design-for-Robustness of PBA.Design-for-Robustness of PBA support.Design-for-Robustness of PBA support.
EDM-D-100Reliability quantification, assessment and lifetime prediction.Basics of reliability risk assessment of delivered products. Assessment of stress screening (e.g. burn-in) relevancy. Background info
EDM-D-202Basic design aspects for medical devices to be CE (EU) or FDA (USA) certified.Basic design aspects for medical devices to be CE (EU) or FDA (USA) certified.Basic design aspects for medical devices to be CE (EU) or FDA (USA) certified.