Via Failure and Delamination

The ‘Via Failure Calculator’ calculates the numbers of cycles to failure (lifetime) of copper plated through vias in Printed Circuit Boards under soldering and under accelerated thermal cycling conditions. The input parameters for the calculator are:
– thermal properties of the laminate and the plated copper;
– via dimensions;
– thermal load conditions.
Default material properties are provided for copper.
The ‘Delamination Calculator’ calculates the number of lead-free solder cycles to cohesive delamination for a PCB applying a specific laminate type. An IPC-9631 and IPC-TM-650 2.6.27 based assembly simulation reflow profile with a peak of 260° C is used as a reference profile. It uses a selection of the laminate thermal properties (Td, T260, T288, T300) for the delamination calculation and calculates the missing thermal properties. It also allows the calculation of the amount of decomposition at an elevated temperature, TGA curve for a certain heating rate, time to delamination at a certain temperature .

This tool uses the via failure and delamination models described in DfX Guideline EDM-D-001: PCB Specification. The delamination models was published in Global SMT & Packaging, Vol. 10, No. 9, september 2010. It enables also the calculation of the via failure probability of the entire PCB and has the possibility to load the laminate properties from the PCB Laminate Overview.