Reduced 2nd Level Solder Joint Life time of Low-CTE Mold Compound Packages

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Impact of Green Mold Compounds on First- and Second-Level Interconnect

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Green IC Packaging: A Threath to Electronics Reliability

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Aanpak van betrouwbaarheid van microsystemen en innovatieve verpakkingen

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Aanpak van betrouwbaarheid op IC niveau

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EDM Code Generator

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IEEE Transactions Device and Materials reliability – September 2018: Methodology for Solder-Joint Lifetime Prediction of LED-Based PCB Assemblies

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EPTC 2011: Green Mould Compounds: Impact on Second Level Interconnect Reliability

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ESTC 2012: Early Fatigue Failures in Copper Wire Bonds Inside Packages with low CTE Green Mold Compounds

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IMAPS-EMPC 2013: Impact of Pad Finish on Mechanical Shock Resistance of Lead-Free Solder Joints Tested Under Shear and in Pull Mode

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