ESA Workshop 2014: Reduced 2nd Level Solder Joint Life time of Low-CTE Mold Compound Packages

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Material Identification in Electronics – Going Green CARE 2014

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Reduced 2nd Level Solder Joint Life time of Low-CTE Mold Compound Packages

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Impact of Green Mold Compounds on First- and Second-Level Interconnect

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Green IC Packaging: A Threath to Electronics Reliability

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Aanpak van betrouwbaarheid van microsystemen en innovatieve verpakkingen

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Aanpak van betrouwbaarheid op IC niveau

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EDM Code Generator

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IEEE Transactions Device and Materials reliability – September 2018: Methodology for Solder-Joint Lifetime Prediction of LED-Based PCB Assemblies

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EPTC 2011: Green Mould Compounds: Impact on Second Level Interconnect Reliability

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