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ESA: 5th Electronic Materials, Processes and Packaging for Space workshops (EMPPS)

May 20, 2014 – May 22, 2014 CEST

Presentation: Bart Vandevelde, imec

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Reduced 2nd Level Solder Joint Life time of Low-CTE Mold Compound Packages

1 file(s) 1 MB

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Location: ESA-ESTEC, Nederland