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ACB Technology Seminar 2012

April 25, 2012 | 12:00 pm – 10:00 pm CEST

Programma

13:30 Welcome & introduction – Gilles Rigon, CEO ACB
13:45 Design and reliability considerations on stacked filled µvias – Arnaud Grivon, Thales
14:15 ACB & IPC class 3 – Wim Perdu, ACB
14:45 Flexible and stretchable circuits for randomly shaped electronics – Jan Van Fleteren, imec/UG-CMST
15:15 Design for manufacturing, the tool to reduce cost and increase reliability – Wim Huwel, ACB
15:45 Pause
16:30 Via reliability: stresses and strains explained – Geert Willems, imec-EDM forum

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Via Reliability: Stresses and Strains Explained

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17:00 Cu fill process and µ BGA fan out – Wim Christiaans – ACB
17:30 Electronic components embedded in printed circuit boards – Johan De baets, imec/UG-CMST
18:00 Q&A
19:00 – 22:00 Dinner

Location: Verbeke Foundation, Westakker, 9190 Kemzeke