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EDM Workshop 12: Green IC Packaging
November 25, 2011 | 2:00 pm – 6:00 pm CET
The last decade new electronic materials are being introduced by component, PCB manufacturers and assembly plants to cope with the IC-technology evolution, the environmental legislation (RoHS) and the “going green” trend. One of these trends has been the replacement of the mold compound of plastic packaged IC-components by so-called “Green Mold Compounds” (GMC) which are usually halogen-free, hence the name. The change-over has gradually taken place in the last five years and has reached a very high penetration level without being noticed by most of the component users. Although these new mold compounds have many environmental and technical benefits, they also may endanger the reliability of electronics significantly. Product lifetime may be divided by a factor four when GMC based components are introduced. The workshop will explain the risks that GMC based IC-packages pose to – especially professional – electronics as well as the parameters of influence.
Agenda
| 14h00 | Welcome |
| 14h10 | Green IC packaging: electronics reliability imperiled? Geert Willems – imec |
| 14h40 | Mold compounds: what is it all about? Makino Tatsuya – Hitachi Chemical Co Ltd |
| 15h00 | Break |
| 15h30 | Reliability impact assessment of Green Mold Compounds Bart Vandevelde – imec |
| 16h15 | Q&A – Networking |
EDM Workshop 12 program
1 file(s) 363.27 KB
Intro EDM Workshop 12
1 file(s) 479.14 KB
For members only
Green IC Packaging: Electronics Reliability Imperiled?
1 file(s) 2.90 MB
Mold Compounds: What Is It All About?
1 file(s) 874.23 KB
Reliability Impact Assessment of Green Mold Compounds
1 file(s) 2.54 MB