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EDM Workshop 16: PBA Assembly Material Specification – The Guideline Explained
March 22, 2013 | 2:00 pm – 6:00 pm CET
Electronics assembly materials like soldering fluxes, solder pastes, adhesives and coatings have a major impact on the final product quality and reliability. Improper selection and/or application may lead to severe surface insulation (SIR) failures and corrosion. Despite these risks assembly materials are rarely specified beyond “no-clean”, leaving the selection entirely to the production unit. Very often, however, the production unit is not fully knowledgeable about the working conditions and reliability requirements of the end product. A situation that may and has led to major product failures.
cEDM has developed the PBA Assembly Material Specification guideline EDM-D-003 to support design departments and production units in selecting manufacturing friendly materials that will result in reliable products.
In this workshop the technology, application and reliability risks of soldering materials, conductive adhesives and underfill will be presented. The content and use of the new guideline will be explained illustrated with the PBA failures it will prevent and how this is achieved.
Agenda
| 14h00 | Welcome |
| 14h15 | Soldering Materials: Technology, Applications and Reliability aspects Ralph Lauwaert – Interflux |
| 15h00 | Conductive Adhesives and Underfill: Technology and Applications Cindy Doumen – Henkel Electronic Materials |
| 15h30 | Break |
| 16h00 | Assembly material related failures and EDM-D-003 Guideline Geert Willems – imec |
| 16h45 | Q&A – Networking |
EDM Workshop 16 program
1 file(s) 314.04 KB
Intro EDM Workshop 16
1 file(s) 600.82 KB
For members only
Soldering Materials: Technology, Applications and Reliability Aspects
1 file(s) 1.75 MB
Conductive Adhesives and Underfill: Technology and Applications
1 file(s) 1.04 MB
Assembly Material Related Failures and EDM-D-003 Guideline
1 file(s) 1.86 MB