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EDM Workshop 18: Quality and Reliability Impact of Electronic Component Selection: the EDM-D-002 Guideline Explained
March 14, 2014 | 2:00 pm – 5:00 pm CET
The selection of components that make up the Bill-of-Material, especially the package type selection, determines the manufacturability and the reliability of the Printed Board Assembly.
This workshop presents the EDM-D-002: Electronic Component Specification guideline. It addresses the specification of assembly aspects of components like Moisture and Process Sensitivity levels, solder process compatibility and quality (yield) as well as reliability aspects.
Our host ON Semiconductor will present the electronic component requirements set by the automotive industry and potential assembly and reliability risks.
The assessment of package and interconnection failures using physico-chemical analysis and thermo-mechanical simulation will be discussed by cEDM based on practical cases.
Agenda
| 14h00 | Welcome |
| 14h10 | Manufacturability and reliability impact of package selection: The EDM-D-002 Guideline Geert Willems – imec |
| 14h40 | Component package selection in automotive electronics Daniel Vanderstraeten – ON Semiconductor |
| 15h10 | Package and interconnection failure assessment Bart Vandevelde – imec |
| 15h45 | Q&A – Networking |
EDM Workshop 18 program
1 file(s) 252.62 KB
Intro EDM Workshop 18
1 file(s) 244.65 KB
For members only
Manufacturability and Reliability Impact of Package Selection: The EDM-D-002 Guideline
1 file(s) 4.18 MB
Component Package Selection in Automotive Electronics
1 file(s) 2.21 MB
Package and Interconnection Failure Assessment
1 file(s) 12.74 MB