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EDM Workshop 33: Electronics Cooling and Interconnect Technologies for Vehicle Computers
May 18, 2021 | 2:00 pm – 4:00 pm CEST
High-Performance CPU/GPU processors are required for self-driving cars to perform vision processing, object recognition and interaction with intelligent traffic systems in real-time and reliable for 15 years.
A consortium of Belgian, Dutch and German companies and research organisations with expertise along the entire automotive value chain, intends to meet the challenges to develop high performance electronic systems that can withstand the harsh vehicle conditions. This is realised through innovations in integrated circuit design, manufacturing and packaging to create automotive grade solutions in three key areas: computation, communication and integration.
The three Flemish partners (Materialise, Interflux Electronics & imec) provides advanced and reliable liquid cooling solutions to enable the required high heat dissipation (300W). Additionally, the solderability of very large BGA processor components is improved with the introduction of low melting point soldering technology. These key innovations will be presented in this virtual workshop.
Agenda
| 14h00 | HIPER: Introduction to colklaborative research project on High Performance Vehicle Provcessors. Bart Vandevelde – imec |
| 14h20 | Advanced 3D printing solutions for advanced processor cooling Part A: 3D printing technology Willem Verleysen – Materialise Part B: Simulation and characterisation of cooling performance of 3D printed heat sinks Majid Nazemi – Materialise and Antonio Pappaterra – imec |
| 15h10 | Low melting point solder technology for advanced processor components Ralph Lauwaert – Interflux Electronics |
| 15h40 | Q&A |
Online workshop
Intro EDM Workshop 33
1 file(s) 340.25 KB
For members only
HIPER: Introduction to Research Project on High Performance Vehicle Processors
1 file(s) 1 MB
Advanced 3D Printing Solutions for Advanced Processor Cooling: 3D Printing Technology
1 file(s) 6 MB
Simulation and Characterisation of Cooling Performance of 3D Printed Heat Sinks
1 file(s) 4 MB
Low Melting Point Solder Technology for Advanced Processor Components
1 file(s) 3 MB