Electronic Assembly Reliability

Smart products, AI, electronics everywhere… increasing electronics complexity means more opportunities to fail and, therefore, intrinsically a reduced reliability.
This seminar will explain quality and reliability assessment and quantification, take you through the failure mechanisms in electronics and show you why and how Physics-of-Failure must be the cornerstone of modern reliability engineering.
This Master Class provides a more in-depth discussion of the topics addressed in the “PBA reliability and test facility visit” seminar. It is complementary to the Master Class “Electronic Assembly Technology”. Participants are assumed to be familiar with PCB and PBA technology.

Agenda:
1.      Quality Quantification
2.      Reliability related basics
3.      PBA failure mechanisms
4.      Reliability Assessment
         o   The traditional approach
         o   A Reliability Physics based approach
5.      Reliability quantification