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From aerospace to automotive to telecommunications to medical devices, reliability has never been more critical than in today’s high technology electronic products. Co-developed with technologists from top companies, including Thales, Continental Automotive, EADS, Robert Bosch, Celestica and Zestron, this two-day technical conference will bring together experts from industry and research institutions to explore critical reliability issues facing European electronics designers and manufacturers.
The High Reliability Forum opens with a choice of one half-day workshop (one focused on fundamentals, the other offering advanced education) followed by paper presentations in four key areas:
– Electrochemical Migration
– Impact of High Temperatures on Design, Process and Assembly
– Advanced PCB Materials and Technology
– Solder Joint Reliability
Location: Dusseldorf, Germany.