The ubiquity of electronics has started and is imagined to increase even more. Future electronics are also expected to have a higher level of product integration with the boundaries between electronics and the remaining of the product less clearly defined. Electronics in textiles are a typical example of such integrated electronic devices. An intense collaboration […]
The classical assembly line is coming to a stop. Enter flexible production! The assembly line was introduced in the early 1900s. It skyrocketed the productivity of workers, for the first time allowing efficient mass production of standard products. The line timed and coordinated the actual production, dividing the work into standard repetitive actions that required […]
Meet and Learn from the Best Experts and Stakeholders in Your IndustryThis forum will bring together industry key decision-makers, insightful experts and thought-leaders for a unique gathering to share experience and enjoy the ultimate networking opportunities. Come and network with engineers, business leaders, and visionaries — as well as the leading industry experts and European […]
Presented by: Wesley Van Meensel – imec Your EMS supplier is delivering your requested Printed Board Assembly. But how certain are you about the quality of the PBA? What is the risk that your electronic module will not work after integrating it into your product or at the customer? What can we do during the design […]
The automotive industry is facing two major evolutions in the coming years: the move towards autonomous driving and the transformation from combustion to 100% electric cars. It is obvious that these trends push the demand for more electronic components and systems, but also increase the requirements towards reliability of these components/systems. In this workshop, several […]
European start-ups have traditionally been a tremendous source of innovation in the semiconductor industry. However, two major difficulties limit their technological and business impact on the global market: raising capital and obtaining specific start-up support. The Conference is the meeting place for start-ups, strategic investors, financial investors and everyone else who cares about the future […]
During this Seminar Day, engineers, researchers and R&D managers from the manufacturing industry will come together to learn more about the results of some of our recent projects. In 3 parallel sessions, project managers and industrial partners will elaborate on their newly acquired knowledge and on concrete cases that help companies to innovate. Each track […]
Presented by: Bart Vandevelde – imec In cEDM’s ‘reliability FMEA’ tool, we listed about 15 different failure mechanisms which over time can lead to electrical malfunctioning of the Printed Circuit Board (PCB) itself. One of the most dominant failures which are purely related to the PCB, is fracturing of the copper plated through hole via’s. […]
Electronics Everywhere, Everything Connected, Internet of Things (IoT), City of Things, Industry 4.0 all imply a distributed network of a large number of electronic devices that must be able to handle confidential, safety critical or other secured data in a reliable way. With 50 billion active devices by 2020 it is likely that security incidents […]
Davy Pissoort – KU Leuven Everyone has already been confronted with Electro-Magnetic Interference (EMI), ranging from an annoying buzz in a stereo when receiving a phone call to a computer crashing during a lightning storm. Frustrating, but not life threatening. However, two trends warrant appropriate concern: (i) high-tech electronics is being used more and more […]
Challenges of segmented supply chains in component qualification for space In the past, homogeneous Integrated Device Manufacturers (IDMs) were responsible for electrical, electronic and electromechanical part development and manufacturing. Over the last 20 years things have changed, many manufacturers only retain their core competence, and heavily rely on outsourcing. The more this supply chain is […]
Presented by: Bart Vandevelde and Riet Labie – imec In the first years after the introduction of the RoHS directive in 2006, SnAgCu (SAC) with Ag percentage between 3 and 4.5% was the main solder composition used by the industry to replace SnPb solder. However, in the recent years, many new lead-free compositions were and […]
