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Design-for-eXcellence
EDM-D-003 PBA Assembly Material Specification – V1.4 (2019)
1 file(s) 650 KB
EDM-D-002 Component Specification – V1.3 (2017)
1 file(s) 484 KB
EDM-D-001 PCB Specification – V3.3 (2023)
1 file(s) 1 MB
EDM-D-000 Good Design-for-X Practice V2.0 (2017)
1 file(s) 443 KB
ESTC 2012: Early Fatigue Failures in Copper Wire Bonds Inside Packages with low CTE Green Mold Compounds
1 file(s) 421 KB
EMC Europe 2013: Modeling the Low- and High-Frequency Impedance of Thermal Reliefs
1 file(s) 468 KB
Eurosime 2015: Impact of Solder-Joint Tilting on the Reliability of LED-based PCB Assemblies
1 file(s) 1 MB
Eurosime 2016: Four-point Bending Cycling as Alternative for Thermal Cycling Solder fatigue Testing
1 file(s) 845 KB
ICEP 2016: How the Mold Compound Thermal Expansion Overrules the Solder Composition Choice in Board Level Reliability Performance
1 file(s) 798 KB
Safety Assurance of Autonomous Systems – video
1 file(s) 33.93 MB