IPC-7352, Generic Guideline for Land Pattern Design – Released July 2023

IPC-9797A, Press-fit Standard for Automotive Requirements and other High-Reliability Applications – Released July 2023

IPC-2591 V1.6, Connected Factory Exchange (CFX) – Released March 2023

IPC-1791C, Trusted Electronic Designer, Fabricator and Assembler Requirements – Released March 2023

IPC-1792, Standard for the Management and Mitigation of Cybersecurity Incidents in the Manufacturing Industry Supply Chain – Released February 2023

IPC-7091A, Design and Assembly Process Implementation of 3D Components – Released February 2023

IPC-8971, Requirements for Electrical Testing of Printed Electronics E-Textiles – Released February 2023

IPC-8952, Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles – Released February 2023

IPC-9203A, Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance Using the IPC-B-52 Test Assembly – Released February 2023

IPC J-STD-003D, Solderability Tests for Printed Boards – Released February 2023

IPC J-STD-004C WAM1, Requirements for Soldering Fluxes – Released February 2023

IPC/JEDEC J-STD-020F, Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs) – Released February 2023

IPC/JEDEC J-STD-035A, Acoustic Microscopy for Nonhermetic Encapsulated Electronics Devices – Released February 2023

IPC-1402, Standard for Greener Cleaners Used in Electronic Manufacturing – Released December 2022

IPC-2292A, Design Standard for Printed Electronics on Flexible Substrates – Released December 2022

IPC-7092A, Design and Assembly Process Implementation for Embedded Circuitry – Released December 2022

IPC-2228, Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards – Released October 2022

IPC-4592, Requirements for Printed Electronics Functional Dielectric Materials – Released October 2022

IPC-5262, Design, Critical Process and Acceptance Requirements for Polymeric Applications – Released October 2022

IPC-7801A, Reflow Oven Process Control Standard – Released October 2022

IPC/WHMA-A-620E, Requirements and Acceptance for Cable and Wire Harness Assemblies – Released October 2022

IPC J-STD-004C, Requirements for Soldering Fluxes – Released March 2022

IPC-4202C, SPECIFICATION FOR FLEXIBLE BASE DIELECTRICS FOR USE IN FLEXIBLE PRINTED BOARDS – Released March 2022

IPC-4412C, SPECIFICATION FOR FINISHED FABRIC WOVEN FROM “E” GLASS FOR PRINTED BOARDS – Released March 2022

IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards – Released March 2022

IPC-7525C, Stencil Design Guidelines – Released March 2022

IPC-D-620A, Design and Critical Process Requirements for Cable and Wiring Harnesses – Released March 2022

IPC-2591 v1.4, Connected Factory Exchange – Released January 2022

IPC-1401A, Corporate Social Responsibility Management System Standard – Released November 2021

IPC-9709A, Guidelines for Acoustic Emission Measurement Method During Mechanical Testing – Released November 2021

IPC-T-50N, Terms and Definitions for Interconnecting and Packaging Electronic Circuits – released November 2021

IPC-1791B, Trusted Electronic Designer, Fabricator and Assembler Requirements – Released October 2021

IPC-6013E, Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards – Released October 2021

IPC-6017A, Qualification and Performance Specification for Printed Boards Containing Embedded Active and Passive Circuitry – Released October 2021

IPC-4552B, Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards – Released August 2021