ESA Workshop 2014: Reduced 2nd Level Solder Joint Life time of Low-CTE Mold Compound Packages

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Reliability of Solder Joints for LED Applications

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Het Kennishoofd bieden aan de elektronica maakconcurrentie

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Material Identification in Electronics – Going Green CARE 2014

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Milieuimpact van elektronica: Hoe bepalen en hoe verminderen?

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New Product Introduction Methodology for Reliable Smart Products

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State of the art on Prognostic Health Monitoring for Electronic Systems

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Physics-of-Failure Based Reliability Assessment of Electronics

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Physics of Failure Based Quantification of Life Time for Electronics Board Assemblies

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Reduced 2nd Level Solder Joint Life time of Low-CTE Mold Compound Packages

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