New Product Introduction Methodology for Reliable Smart Products

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Physics of Failure Based Quantification of Life Time for Electronics Board Assemblies

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Via Reliability: Stresses and Strains Explained

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Reliability Analysis Using Finite Element Modeling (FEM)

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PBA Falingen… en hoe ze te vermijden

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Elektronische module (PBA) ontwikkeling en assemblage. Wat kunnen we leren van de IC industrie?

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Geen kwaliteit bij het uitbesteden zonder technische kennis

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PBA DfX in the RoHS era: Specify the Requirements!

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Electronics testing: Quality and Reliability

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Via Failure and Delamination

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