Material Identification in Electronics – Going Green CARE 2014

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A parametric approach to quantifying the environmental impact of PCB manufacturing

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Milieuimpact van elektronica: Hoe bepalen en hoe verminderen?

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New Product Introduction Methodology for Reliable Smart Products

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Physics of Failure Based Quantification of Life Time for Electronics Board Assemblies

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Via Reliability: Stresses and Strains Explained

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Reliability Analysis Using Finite Element Modeling (FEM)

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PBA Falingen… en hoe ze te vermijden

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Elektronische module (PBA) ontwikkeling en assemblage. Wat kunnen we leren van de IC industrie?

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Geen kwaliteit bij het uitbesteden zonder technische kennis

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