New Product Introduction Methodology for Reliable Smart Products

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State of the art on Prognostic Health Monitoring for Electronic Systems

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Data-driven system health monitoring

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Physics-of-Failure Based Reliability Assessment of Electronics

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Physics of Failure Based Quantification of Life Time for Electronics Board Assemblies

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Reduced 2nd Level Solder Joint Life time of Low-CTE Mold Compound Packages

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Kritieke Metalen in Elektronica

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Competitief Elektronica Ontwerp en Assemblage dicht bij de klant

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Quantification of PBA Quality, Test Coverage and Zero Hour Defect Rate

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Kwaliteit Kwantificatie en Kwaliteitverhoging door Test

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