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BOM DfM Checklist
The ‘Bill-Of-Material (BOM) DfM Checklist’ provides a structurized and comprehensive list of electronic component packaging properties with regard to the terminal, material, legislation and assembly properties. Available to members only: free download.
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Failure Risk Assessment FMEA
Printed Board Assembly defect and failure assessment tool (FMEA). Available to members only: free download.
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IPC Class 2 vs IPC Class 3 – Assembly View
This document compares IPC Class 2 with IPC Class 3 concerning the assembly of printed circuit boards and gives an overview of all IPC Class 2/3 differences of the IPC performance standard J-STD-001 ‘Requirements for Soldered Electrical and Electronic Assemblies’.…
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IPC Standards Guide
The ‘IPC Standards Guide’ is intended to help the user in localising specific Printed Circuit Board (PCB) and Printed Board Assembly (PBA) information in IPC standards. Available to members only: free download.
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PBA Design-to-Manufacturing Mapping
Tool to map a PBA design to the PCB and electronic assembly suppliers’ capabilities. Available to members only: free download.
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PBA Passport
The ‘PBA Passport’ identifies and lists the PBA design features that determine the technologies and the manufacturing capability required to realize the PBA design. It is a basic tool for Design-for-X evaluation and for design-to-manufacturing mapping. Available to members only:…
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PCB Laminate Overview
The ‘Laminate Overview’ is intended to support you in specifying and realising cost-effective, high quality Printed Board Assemblies. Available to members only: free download.
