• thermal properties of the laminate and the plated copper;
  • via dimensions;
  • thermal load conditions.

    • Default material properties are provided for copper.

    This version contains the new via failure model developed by cEDM (as described in DfX Guideline EDM-D-001: PCB Specification V2.6), allows you to calculate also the via failure probability of the entire PCB and has the possibility to load the laminate properties from our PCB Laminate Overview.’;
    $calcversion = ‘3.4’;
    $calcrelease= ‘May 2, 2019’;

    include_once($_SERVER[‘DOCUMENT_ROOT’].’/../php/includes/CalculatorPage.inc’);
    ?>