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Category: Technical publication
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Best Paper APEX 2024 – A Parametric Approach to Quantifying the Environmental Impact of PCB Manufacturing
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APEX 2024 – Maarten Cauwe, Geert Willems and Eddy Geerinckx
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IEEE Transactions Device and Materials reliability – September 2018: Methodology for Solder-Joint Lifetime Prediction of LED-Based PCB Assemblies
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IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, VOL. 18, NO. 3, SEPTEMBER 2018 – Bart Vandevelde et al.
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Global SMT & Packaging September 2010: Predicting Delamination in Lead-free Assembly
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Global SMT & Packaging september 2010 – Geert Willems and Piet Watte
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EPTC 2011: Green Mould Compounds: Impact on Second Level Interconnect Reliability
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EPTC Conference December 2011 – Bart Vandevelde et al.
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ESTC 2012: Early Fatigue Failures in Copper Wire Bonds Inside Packages with low CTE Green Mold Compounds
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ESTC Conference September 2012 – Bart Vandevelde and Geert Willems
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EMC Europe 2013: Modeling the Low- and High-Frequency Impedance of Thermal Reliefs
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EMC Europe September 2013 – Bart Boesman et al.
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IMAPS-EMPC 2013: Impact of Pad Finish on Mechanical Shock Resistance of Lead-Free Solder Joints Tested Under Shear and in Pull Mode
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IMAPS EMPC Conference September 2013 – Bart Vandevelde et al.
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Global SMT & Packaging April 2014: New Brittle Fracture Test Reveals Importance of Choosing the Right Board Finish
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Global SMT & Packaging April 2014 – Bart Vandevelde
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Eurosime 2014: Hidden Head-In-Pillow Soldering Failures
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IEEE Eurosime Conference 2014 – Bart Vandevelde et al.