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Category: Technical publication
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Eurosime 2015: Impact of Solder-Joint Tilting on the Reliability of LED-based PCB Assemblies
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IEEE Eurosime Conference 2015 – Bart Vandevelde et al.
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Eurosime 2016: Four-point Bending Cycling as Alternative for Thermal Cycling Solder fatigue Testing
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IEEE Eurosime Conference 2016 – Bart Vandevelde et al.
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ICEP 2016: How the Mold Compound Thermal Expansion Overrules the Solder Composition Choice in Board Level Reliability Performance
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Conference paper ICEP 2016 – Bart Vandevelde et al.