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Webinar 2018-9-13: Bending Cycling as Fast Alternative for Thermal Cycling
Presented by: Bart Vandevelde (imec)In particular for testing of the board level interconnect reliability of components, bending cycling can be an interesting alternative for regular thermal cycling. The main gain lies in the testing time. The four point bending stresses the interconnections in a similar way as in thermal cycling, but as the test can […]