imec, a research institute based in Belgium (and an iNEMI member), is scheduling a special webinar for our membership to talk about reliability issues related to green mold compounds.New electronic materials are being introduced by component, PCB manufacturers and assembly plants to cope with the IC-technology evolution, environmental legislation (RoHS) and the “going green” trend. […]
Presented by: Riet Labie – imec An FMEA (Failure Mode and Effect Analysis) procedure is a risk assessment method that helps to pinpoint critical design choices of your product. In this webinar we will explain how to apply this method to a PBA (Printed Board Assembly). A differentiation is made between failures at the level […]
Presented by: Davy Pissoort – KU Leuven The CE-mark (Conformité Européenne or European Conformity) is required for every electronic product that is put on the market within the European Economic Area. However, a lot of questions and misunderstanding exist around what is exactly required and who should be involved with the CE-marking process. Within this seminar, […]
Presented by: Bart Vandevelde – imec Before electronic systems can be brought on the market, they must fulfill qualification tests according to international standards and customer specified test programs. Thermal and mechanical environmental loadings are major causes for electronic system failures that also appear during these qualification testing. It is obvious that any failure after such […]
Presented by: Tania Drissen- Sirris Systems engineering (SE) is a complete process with 24 sub-processes to turn an early stage business idea or need of a client into a working product or process that satisfies all expectations throughout its life cycle. In this approach mainly the “technical management” processes are well known and common practice (project […]
Presented by: Wesley Van Meensel – imec Your EMS supplier is delivering your requested Printed Board Assembly. But how certain are you about the quality of the PBA? What is the risk that your electronic module will not work after integrating it into your product or at the customer? What can we do during the design […]
Presented by: Bart Vandevelde – imec In cEDM’s ‘reliability FMEA’ tool, we listed about 15 different failure mechanisms which over time can lead to electrical malfunctioning of the Printed Circuit Board (PCB) itself. One of the most dominant failures which are purely related to the PCB, is fracturing of the copper plated through hole via’s. […]
Davy Pissoort – KU Leuven Everyone has already been confronted with Electro-Magnetic Interference (EMI), ranging from an annoying buzz in a stereo when receiving a phone call to a computer crashing during a lightning storm. Frustrating, but not life threatening. However, two trends warrant appropriate concern: (i) high-tech electronics is being used more and more […]
Presented by: Bart Vandevelde and Riet Labie – imec In the first years after the introduction of the RoHS directive in 2006, SnAgCu (SAC) with Ag percentage between 3 and 4.5% was the main solder composition used by the industry to replace SnPb solder. However, in the recent years, many new lead-free compositions were and […]
Presented by: Tania Drissen – Sirris Product reliability is gaining importance because of today’s increasing overall complexity of products. In a product’s design for reliability knowing the actual loads that will act on the product during its lifetime is key. The life cycle profile describes these different loads and their variation over time throughout the […]
