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Webinar 2017-11-8: Plated Through Hole Via Failure
Presented by: Bart Vandevelde – imec In cEDM’s ‘reliability FMEA’ tool, we listed about 15 different failure mechanisms which over time can lead to electrical malfunctioning of the Printed Circuit Board (PCB) itself. One of the most dominant failures which are purely related to the PCB, is fracturing of the copper plated through hole via’s. […]

