Presented by: Bart Vandevelde and Riet Labie – imec In the first years after the introduction of the RoHS directive in 2006, SnAgCu (SAC) with Ag percentage between 3 and 4.5% was the main solder composition used by the industry to replace SnPb solder. However, in the recent years, many new lead-free compositions were and […]
In the frame of the preparation of an SBO (‘strategisch basisonderzoek’) project proposal, we would like to invite industrial research and technical experts in the field of electronics design to support us in defining the research objectives and end goal(s) of the project.The project lies in the field of Prognostic Health Monitoring (PHM) for electronic […]
Locatie: Flanders Expo, Gent Advanced Engineering is een gloednieuw event voor de creatie en de vervaardiging van vernieuwende producten. Alle aspecten komen aan bod: ontwerp, engineeringsproces en prototyping, materialen en componenten, alsook connectiviteit. Advanced Engineering, dat zijn twee vliegen in één klap: een gratis beurs met meer dan 100 standhouders die u helpen om uw […]
Flexible substrates have found their way into a wide range of applications, even if we are not always aware of it. With the benefits of adaptability to 3D shapes, multiple bendability, compact design and weight reduction comes the complexity of the design and manufacturing of flexible electronics. These benefits have led to an increased demand […]
Best practices toward robust sensing & control of your system The Mechatronica 4.0 project aims to help Flemish companies to put the Industry 4.0 philosophy into practice. Sensing and control technology will be a key feature of the next generation of autonomous, safety and inspection systems, and it is the focus of our next Mechatronics 4.0 Masterclass. […]
Presented by: Tania Drissen – Sirris Product reliability is gaining importance because of today’s increasing overall complexity of products. In a product’s design for reliability knowing the actual loads that will act on the product during its lifetime is key. The life cycle profile describes these different loads and their variation over time throughout the […]
Presented by: Bart Vandevelde (imec) In particular for testing of the board level interconnect reliability of components, bending cycling can be an interesting alternative for regular thermal cycling. The main gain lies in the testing time. The four point bending stresses the interconnections in a similar way as in thermal cycling, but as the test […]
Op 7 november 2018 vindt het D&E Event plaats in Technopolis te Mechelen. Ontmoet hier ontwikkelaars en toepassers van embedded systems, ontdek de laatste technologieën en wissel visies en ervaringen uit met vakgenoten.Specifieke thema’s tijdens dit event zijn FPGA, Security, Internet of Things, Electronic Design & Production en Embedded. EDM contribution: Abstract: Smart products that build-up […]
