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IPC Releases April 2025
IPC-7530B, Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave) – Released April 2025
IPC-2591-V2.0, Connected Factory Exchange – Released April 2025
IPC-7530B, Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave) – Released April 2025
IPC-2591-V2.0, Connected Factory Exchange – Released April 2025