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Electronic components
ESA Workshop 2014: Reduced 2nd Level Solder Joint Life time of Low-CTE Mold Compound Packages
1 file(s) 1 MB
Material Identification in Electronics – Going Green CARE 2014
1 file(s) 449 KB
Reduced 2nd Level Solder Joint Life time of Low-CTE Mold Compound Packages
1 file(s) 1 MB
Impact of Green Mold Compounds on First- and Second-Level Interconnect
1 file(s) 5 MB
Green IC Packaging: A Threath to Electronics Reliability
1 file(s) 3 MB
Aanpak van betrouwbaarheid van microsystemen en innovatieve verpakkingen
1 file(s) 738 KB
Aanpak van betrouwbaarheid op IC niveau
1 file(s) 1 MB
EDM Code Generator
1 file(s) 37 MB
IEEE Transactions Device and Materials reliability – September 2018: Methodology for Solder-Joint Lifetime Prediction of LED-Based PCB Assemblies
1 file(s) 2.00 MB
EPTC 2011: Green Mould Compounds: Impact on Second Level Interconnect Reliability
1 file(s) 765.40 KB