Your basket is currently empty!
Electronic components
Reduced 2nd Level Solder Joint Life time of Low-CTE Mold Compound Packages
1 file(s) 4 MB
Login to download.
Impact of Green Mold Compounds on First- and Second-Level Interconnect
1 file(s) 5 MB
Login to download.
Green IC Packaging: A Threath to Electronics Reliability
1 file(s) 3 MB
Login to download.
Aanpak van betrouwbaarheid van microsystemen en innovatieve verpakkingen
1 file(s) 738 KB
Login to download.
Aanpak van betrouwbaarheid op IC niveau
1 file(s) 1 MB
Login to download.
EDM Code Generator
1 file(s) 37 MB
Login to download.
IEEE Transactions Device and Materials reliability – September 2018: Methodology for Solder-Joint Lifetime Prediction of LED-Based PCB Assemblies
1 file(s) 2.00 MB
Login to download.
EPTC 2011: Green Mould Compounds: Impact on Second Level Interconnect Reliability
1 file(s) 765.40 KB
Login to download.
ESTC 2012: Early Fatigue Failures in Copper Wire Bonds Inside Packages with low CTE Green Mold Compounds
1 file(s) 421.07 KB
Login to download.
IMAPS-EMPC 2013: Impact of Pad Finish on Mechanical Shock Resistance of Lead-Free Solder Joints Tested Under Shear and in Pull Mode
1 file(s) 651.15 KB
Login to download.