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Electronic components
ESTC 2012: Early Fatigue Failures in Copper Wire Bonds Inside Packages with low CTE Green Mold Compounds
1 file(s) 421 KB
IMAPS-EMPC 2013: Impact of Pad Finish on Mechanical Shock Resistance of Lead-Free Solder Joints Tested Under Shear and in Pull Mode
1 file(s) 651 KB
Eurosime 2014: Hidden Head-In-Pillow Soldering Failures
1 file(s) 1,008 KB
Eurosime 2015: Impact of Solder-Joint Tilting on the Reliability of LED-based PCB Assemblies
1 file(s) 1 MB
ICEP 2016: How the Mold Compound Thermal Expansion Overrules the Solder Composition Choice in Board Level Reliability Performance
1 file(s) 798 KB
Active Components in Today’s PBA: Challenges for ON Semi
1 file(s) 1.56 MB
imecservices
1 file(s) 212.48 KB
Failure Mechanisms Turned into an Asset: New Ways of Embedding Key Security Elements in IC’s
1 file(s) 1.96 MB
BGA soldeer- en betrouwbaarheidsaspecten
1 file(s) 9.43 MB
BGA layout aspecten
1 file(s) 1.82 MB